Mechanical interlocking

Industry

CPC
H01L2224/83897

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83897Mechanical interlocking

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packages having mechanical brace standoffs
- Patent number 12,080,623
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan Sheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration and bonding of micro-devices into system substrate
- Patent number 12,014,999
- Issue date Jun 18, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component tethers with spacers
- Patent number 11,088,007
- Issue date Aug 10, 2021
- X-CELEPRINT LIMITED
- Alin Mihai Fecioru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,011,451
- Issue date May 18, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan Sheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration and bonding of micro-devices into system substrate
- Patent number 10,818,622
- Issue date Oct 27, 2020
- VueReal Inc.
- Gholamreza Chaji
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Metallic interconnect, a method of manufacturing a metallic interco...
- Patent number 10,734,352
- Issue date Aug 4, 2020
- Infineon Technologies AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level die attach metallization
- Patent number 9,536,783
- Issue date Jan 3, 2017
- Cree, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grown carbon nanotube die attach structures, articles, devices, and...
- Patent number 8,753,924
- Issue date Jun 17, 2014
- Texas Instruments Incorporated
- James Cooper Wainerdi
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGES HAVING MECHANICAL BRACE STANDOFFS
- Publication number 20240363486
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan Sheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20240297133
- Publication date Sep 5, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20210272875
- Publication date Sep 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan Sheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallic Interconnect, a Method of Manufacturing a Metallic Interco...
- Publication number 20190103378
- Publication date Apr 4, 2019
- INFINEON TECHNOLOGIES AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL DIE ATTACH METALLIZATION
- Publication number 20140264868
- Publication date Sep 18, 2014
- Cree, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROWN CARBON NANOTUBE DIE ATTACH STRUCTURES, ARTICLES, DEVICES, AND...
- Publication number 20130234313
- Publication date Sep 12, 2013
- TEXAS INSTRUMENTS INCORPORATED
- James Cooper Wainerdi
- B82 - NANO-TECHNOLOGY

Mechanical interlocking

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit packages having mechanical brace standoffs

Integration and bonding of micro-devices into system substrate

Component tethers with spacers

Integrated circuit package and method

Integration and bonding of micro-devices into system substrate

Metallic interconnect, a method of manufacturing a metallic interco...

Wafer-level die attach metallization

Grown carbon nanotube die attach structures, articles, devices, and...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGES HAVING MECHANICAL BRACE STANDOFFS

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

Integrated Circuit Package and Method

Metallic Interconnect, a Method of Manufacturing a Metallic Interco...

WAFER-LEVEL DIE ATTACH METALLIZATION

GROWN CARBON NANOTUBE DIE ATTACH STRUCTURES, ARTICLES, DEVICES, AND...