Mechanical interlocking

Industry

CPC
H01L2224/80897

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/80897Mechanical interlocking

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integration and bonding of micro-devices into system substrate
- Patent number 12,014,999
- Issue date Jun 18, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device
- Patent number 11,862,235
- Issue date Jan 2, 2024
- RAMBUS INC.
- Frederick A. Ware
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device
- Patent number 11,170,842
- Issue date Nov 9, 2021
- RAMBUS INC.
- Frederick A. Ware
- G11 - INFORMATION STORAGE
Information Patent Grant
Integration and bonding of micro-devices into system substrate
- Patent number 10,818,622
- Issue date Oct 27, 2020
- VueReal Inc.
- Gholamreza Chaji
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Stacked semiconductor device
- Patent number 10,475,505
- Issue date Nov 12, 2019
- Rambus Inc.
- Frederick A. Ware
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device
- Patent number 9,881,663
- Issue date Jan 30, 2018
- Rambus Inc.
- Frederick A. Ware
- G11 - INFORMATION STORAGE
Information Patent Grant
Power semiconductor package device having locking mechanism, and pr...
- Patent number 9,786,583
- Issue date Oct 10, 2017
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device
- Patent number 9,362,002
- Issue date Jun 7, 2016
- Rambus Inc.
- Frederick A. Ware
- G11 - INFORMATION STORAGE
Information Patent Grant
Stacked semiconductor device
- Patent number 9,142,262
- Issue date Sep 22, 2015
- Rambus Inc.
- Frederick A. Ware
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20240297133
- Publication date Sep 5, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE
- Publication number 20240203483
- Publication date Jun 20, 2024
- Rambus Inc.
- Frederick A. Ware
- G11 - INFORMATION STORAGE
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20230253350
- Publication date Aug 10, 2023
- VueReal Inc.
- GHOLAMREZA CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE
- Publication number 20220139445
- Publication date May 5, 2022
- Rambus Inc.
- Frederick A. Ware
- G11 - INFORMATION STORAGE
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20210020593
- Publication date Jan 21, 2021
- VueReal Inc.
- GHOLAMREZA CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE
- Publication number 20200135262
- Publication date Apr 30, 2020
- RAMBUS INC.
- Frederick A. Ware
- G11 - INFORMATION STORAGE
Information Patent Application
DIE-TO-DIE BONDING AND ASSOCIATED PACKAGE CONFIGURATIONS
- Publication number 20150255411
- Publication date Sep 10, 2015
- Omkar G. Karhade
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STACKED SEMICONDUCTOR DEVICE
- Publication number 20120201068
- Publication date Aug 9, 2012
- Frederick A. Ware
- G11 - INFORMATION STORAGE

Mechanical interlocking

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integration and bonding of micro-devices into system substrate

Stacked semiconductor device

Stacked semiconductor device

Integration and bonding of micro-devices into system substrate

Stacked semiconductor device

Stacked semiconductor device

Power semiconductor package device having locking mechanism, and pr...

Stacked semiconductor device

Stacked semiconductor device

Patents Applicationslast 30 patents

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

STACKED SEMICONDUCTOR DEVICE

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

STACKED SEMICONDUCTOR DEVICE

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

STACKED SEMICONDUCTOR DEVICE

DIE-TO-DIE BONDING AND ASSOCIATED PACKAGE CONFIGURATIONS

STACKED SEMICONDUCTOR DEVICE