Mechanical polishing of wafer

Industry

CPC
Y10S438/959

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S438/00Semiconductor device manufacturing: process

Current Industry

Y10S438/959Mechanical polishing of wafer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a high-K gate dielectric above an STI r...
- Patent number 9,659,928
- Issue date May 23, 2017
- Advanced Micro Devices, Inc.
- Andy Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for self-aligned removal of a high-K gate dielectric above a...
- Patent number 9,023,712
- Issue date May 5, 2015
- Advanced Micro Devices, Inc.
- Andy Wei
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Creating extremely thin semiconductor-on-insulator (ETSOI) having s...
- Patent number 9,018,024
- Issue date Apr 28, 2015
- International Business Machines Corporation
- Nathaniel C. Berliner
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Radiation detectors and methods of fabricating radiation detectors
- Patent number 9,006,010
- Issue date Apr 14, 2015
- General Electric Company
- Arie Shahar
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for producing silicon epitaxial wafer
- Patent number 8,999,061
- Issue date Apr 7, 2015
- Sumco Corporation
- Masayuki Ishibashi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor structure with means for testing metal-insulator-meta...
- Patent number 8,884,288
- Issue date Nov 11, 2014
- Shanghai Huali Microelectronics Corporation
- Qiang Li
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of polishing a silicon wafer
- Patent number 8,877,643
- Issue date Nov 4, 2014
- Sumco Corporation
- Shuhei Matsuda
- B24 - GRINDING POLISHING
Information Patent Grant
Microelectronic device wafers and methods of manufacturing
- Patent number 8,455,983
- Issue date Jun 4, 2013
- Micron Technology, Inc.
- Alan G. Wood
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Solder structures for fabrication of inverted metamorphic multijunc...
- Patent number 8,187,907
- Issue date May 29, 2012
- Emcore Solar Power, Inc.
- Fred Newman
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Nitride semiconductor wafer having a chamfered edge
- Patent number 8,183,669
- Issue date May 22, 2012
- Sumitomo Electric Industries, Ltd.
- Keiji Ishibashi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of post-mold grinding a semiconductor package
- Patent number 8,124,471
- Issue date Feb 28, 2012
- Intel Corporation
- James-Yii Lee Kiong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of processing of nitride semiconductor wafer, nitride semico...
- Patent number 8,101,523
- Issue date Jan 24, 2012
- Sumitomo Electric Industries, Ltd.
- Keiji Ishibashi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Microelectronic device wafers and methods of manufacturing
- Patent number 8,062,958
- Issue date Nov 22, 2011
- Micron Technology, Inc.
- Alan G. Wood
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Nitride semiconductor wafer and method of processing nitride semico...
- Patent number 8,008,165
- Issue date Aug 30, 2011
- Sumitomo Electric Industries, Ltd.
- Masahiro Nakayama
- B24 - GRINDING POLISHING
Information Patent Grant
Nitride semiconductor wafer
- Patent number 7,872,331
- Issue date Jan 18, 2011
- Sumitomo Electric Industries, Ltd.
- Keiji Ishibashi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Surface treatment method for nitride crystal, nitride crystal subst...
- Patent number 7,851,381
- Issue date Dec 14, 2010
- Sumitomo Electric Industries, Ltd.
- Keiji Ishibashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Nitride semiconductor wafer and method of processing nitride semico...
- Patent number 7,786,488
- Issue date Aug 31, 2010
- Sumitomo Electric Industries, Ltd.
- Masahiro Nakayama
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer grinding method
- Patent number 7,758,402
- Issue date Jul 20, 2010
- Disco Corporation
- Shinji Yoshida
- B24 - GRINDING POLISHING
Information Patent Grant
Method of fabricating semiconductor device including planarizing co...
- Patent number 7,737,038
- Issue date Jun 15, 2010
- Samsung Electronics Co., Ltd.
- Seung-Mahn Lee
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,727,859
- Issue date Jun 1, 2010
- Semiconductor Energy Laboratory Co., Ltd.
- Yasuko Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of machining substrate
- Patent number 7,682,224
- Issue date Mar 23, 2010
- Disco Corporation
- Yusuke Kimura
- B24 - GRINDING POLISHING
Information Patent Grant
Manufacturing process of leadframe-based BGA packages
- Patent number 7,662,672
- Issue date Feb 16, 2010
- ChipMos Technologies (Bermuda) Ltd.
- Hung-Tsun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxially coated silicon wafer and method for producing epitaxial...
- Patent number 7,659,207
- Issue date Feb 9, 2010
- Siltronic AG
- Reinhard Schauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method
- Patent number 7,625,810
- Issue date Dec 1, 2009
- Disco Corporation
- Keiichi Kajiyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gallium nitride substrate, and gallium-nitride-substrate testing an...
- Patent number 7,554,175
- Issue date Jun 30, 2009
- Sumitomo Electric Industries, Ltd.
- Akihiro Hachigo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride semiconductor wafer and method of processing nitride semico...
- Patent number 7,535,082
- Issue date May 19, 2009
- Sumitomo Electric Industries, Ltd.
- Masahiro Nakayama
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor device and method for assembling the same
- Patent number 7,446,423
- Issue date Nov 4, 2008
- Matsushita Electric Industrial Co., Ltd.
- Tadahiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer polishing control
- Patent number 7,366,575
- Issue date Apr 29, 2008
- Intel Corporation
- Matthew A. Ring
- B24 - GRINDING POLISHING
Information Patent Grant
Method of fabricating nano SOI wafer and nano SOI wafer fabricated...
- Patent number 7,338,882
- Issue date Mar 4, 2008
- Siltron Inc.
- Jea-Gun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing composition and process
- Patent number 7,314,823
- Issue date Jan 1, 2008
- DuPont Airproducts NanoMaterials LLC
- Robert J. Small
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
RADIATION DETECTORS AND METHODS OF FABRICATING RADIATION DETECTORS
- Publication number 20130126998
- Publication date May 23, 2013
- GENERAL ELECTRIC COMPANY
- Arie Shahar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING OF NITRIDE SEMICONDUCTOR WAFER, NITRIDE SEMICO...
- Publication number 20120184108
- Publication date Jul 19, 2012
- SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Keiji ISHIBASHI
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD OF POST-MOLD GRINDING A SEMICONDUCTOR PACKAGE
- Publication number 20120175786
- Publication date Jul 12, 2012
- James Yii Lee Kiong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SILICON EPITAXIAL WAFER
- Publication number 20120090536
- Publication date Apr 19, 2012
- SUMCO CORPORATION
- Masayuki Ishibashi
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD OF POLISHING SILICON WAFER AS WELL AS SILICON WAFER
- Publication number 20120080775
- Publication date Apr 5, 2012
- Shuhei Matsuda
- B24 - GRINDING POLISHING
Information Patent Application
MICROELECTRONIC DEVICE WAFERS AND METHODS OF MANUFACTURING
- Publication number 20120070959
- Publication date Mar 22, 2012
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING OF NITRIDE SEMICONDUCTOR WAFER, NITRIDE SEMICO...
- Publication number 20120043645
- Publication date Feb 23, 2012
- SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Keiji ISHIBASHI
- C30 - CRYSTAL GROWTH
Information Patent Application
CREATING EXTREMELY THIN SEMICONDUCTOR-ON-INSULATOR (ETSOI) HAVING S...
- Publication number 20110095393
- Publication date Apr 28, 2011
- International Business Machines Corporation
- Nathaniel C. Berliner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING OF NITRIDE SEMICONDUCTOR WAFER, NITRIDE SEMICO...
- Publication number 20110049679
- Publication date Mar 3, 2011
- SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Keiji ISHIBASHI
- C30 - CRYSTAL GROWTH
Information Patent Application
NITRIDE SEMICONDUCTOR WAFER AND METHOD OF PROCESSING NITRIDE SEMICO...
- Publication number 20100279440
- Publication date Nov 4, 2010
- Sumitomo Electric Industries, Ltd.
- Masahiro Nakayama
- B24 - GRINDING POLISHING
Information Patent Application
NITRIDE SEMICONDUCTOR WAFER
- Publication number 20100270649
- Publication date Oct 28, 2010
- SUNITOMO ELECTRIC INDUSTRIES, LTD
- Keiji Ishibashi
- C30 - CRYSTAL GROWTH
Information Patent Application
MICROELECTRONIC DEVICE WAFERS AND METHODS OF MANUFACTURING
- Publication number 20100252915
- Publication date Oct 7, 2010
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE SEMICONDUCTOR WAFER AND METHOD OF PROCESSING NITRIDE SEMICO...
- Publication number 20090250790
- Publication date Oct 8, 2009
- Sumitomo Electric Industries, Ltd.
- Masahiro Nakayama
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF POST-MOLD GRINDING A SEMICONDUCTOR PACKAGE
- Publication number 20090230567
- Publication date Sep 17, 2009
- James Yii Lee Kiong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing process of leadframe-based BGA packages
- Publication number 20090087953
- Publication date Apr 2, 2009
- Hung-Tsun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SELF-ALIGNED REMOVAL OF A HIGH-K GATE DIELECTRIC ABOVE A...
- Publication number 20090057813
- Publication date Mar 5, 2009
- Andy Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MACHINING SUBSTRATE
- Publication number 20080318497
- Publication date Dec 25, 2008
- Disco Corporation
- Yusuke Kimura
- B24 - GRINDING POLISHING
Information Patent Application
Wafer grinding method
- Publication number 20080090505
- Publication date Apr 17, 2008
- Disco Corporation
- Shinji Yoshida
- B24 - GRINDING POLISHING
Information Patent Application
Surface treatment method for nitride crystal, nitride crystal subst...
- Publication number 20070281484
- Publication date Dec 6, 2007
- SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Keiji Ishibashi
- C30 - CRYSTAL GROWTH
Information Patent Application
Gallium Nitride Substrate, and Gallium-Nitride-Substrate Testing an...
- Publication number 20070228521
- Publication date Oct 4, 2007
- Sumitomo Electric Industries, Ltd.
- Akihiro Hachigo
- C30 - CRYSTAL GROWTH
Information Patent Application
Method of Fabricating Semiconductor Device Including Planarizing Co...
- Publication number 20070196994
- Publication date Aug 23, 2007
- Seung-Mahn Lee
- B24 - GRINDING POLISHING
Information Patent Application
Wafer polishing control
- Publication number 20070155284
- Publication date Jul 5, 2007
- Matthew A. Ring
- B24 - GRINDING POLISHING
Information Patent Application
Epitaxially coated silicon wafer and method for producing epitaxial...
- Publication number 20070066082
- Publication date Mar 22, 2007
- Siltronic AG
- Reinhard Schauer
- C30 - CRYSTAL GROWTH
Information Patent Application
Control system for multi-layer chemical mechanical polishing proces...
- Publication number 20070062819
- Publication date Mar 22, 2007
- Ming-Hsin Yeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20070004125
- Publication date Jan 4, 2007
- Semiconductor Energy Laboratory Co., Ltd.
- Yasuko Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer processing method
- Publication number 20060292826
- Publication date Dec 28, 2006
- DISCO CORPORATION
- Keiichi Kajiyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrochemically polishing conductive films on semiconductor wafers
- Publication number 20060169409
- Publication date Aug 3, 2006
- Joseph M. Steigerwald
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for cleaning slurry particles from a surface polished by che...
- Publication number 20060128153
- Publication date Jun 15, 2006
- Matrix Semiconductor, Inc.
- Samuel V. Dunton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductive substrate cleaning systems
- Publication number 20060076040
- Publication date Apr 13, 2006
- Scott E. Moore
- B08 - CLEANING
Information Patent Application
Hermetic chip in wafer form
- Publication number 20060022337
- Publication date Feb 2, 2006
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS

Mechanical polishing of wafer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device having a high-K gate dielectric above an STI r...

Method for self-aligned removal of a high-K gate dielectric above a...

Creating extremely thin semiconductor-on-insulator (ETSOI) having s...

Radiation detectors and methods of fabricating radiation detectors

Method for producing silicon epitaxial wafer

Semiconductor structure with means for testing metal-insulator-meta...

Method of polishing a silicon wafer

Microelectronic device wafers and methods of manufacturing

Solder structures for fabrication of inverted metamorphic multijunc...

Nitride semiconductor wafer having a chamfered edge

Method of post-mold grinding a semiconductor package

Method of processing of nitride semiconductor wafer, nitride semico...

Microelectronic device wafers and methods of manufacturing

Nitride semiconductor wafer and method of processing nitride semico...

Nitride semiconductor wafer

Surface treatment method for nitride crystal, nitride crystal subst...

Nitride semiconductor wafer and method of processing nitride semico...

Wafer grinding method

Method of fabricating semiconductor device including planarizing co...

Semiconductor device and manufacturing method thereof

Method of machining substrate

Manufacturing process of leadframe-based BGA packages

Epitaxially coated silicon wafer and method for producing epitaxial...

Wafer processing method

Gallium nitride substrate, and gallium-nitride-substrate testing an...

Nitride semiconductor wafer and method of processing nitride semico...

Semiconductor device and method for assembling the same

Wafer polishing control

Method of fabricating nano SOI wafer and nano SOI wafer fabricated...

Chemical mechanical polishing composition and process

Patents Applicationslast 30 patents

RADIATION DETECTORS AND METHODS OF FABRICATING RADIATION DETECTORS

METHOD OF PROCESSING OF NITRIDE SEMICONDUCTOR WAFER, NITRIDE SEMICO...

METHOD OF POST-MOLD GRINDING A SEMICONDUCTOR PACKAGE

METHOD FOR PRODUCING SILICON EPITAXIAL WAFER

METHOD OF POLISHING SILICON WAFER AS WELL AS SILICON WAFER

MICROELECTRONIC DEVICE WAFERS AND METHODS OF MANUFACTURING

METHOD OF PROCESSING OF NITRIDE SEMICONDUCTOR WAFER, NITRIDE SEMICO...

CREATING EXTREMELY THIN SEMICONDUCTOR-ON-INSULATOR (ETSOI) HAVING S...

METHOD OF PROCESSING OF NITRIDE SEMICONDUCTOR WAFER, NITRIDE SEMICO...

NITRIDE SEMICONDUCTOR WAFER AND METHOD OF PROCESSING NITRIDE SEMICO...

NITRIDE SEMICONDUCTOR WAFER

MICROELECTRONIC DEVICE WAFERS AND METHODS OF MANUFACTURING

NITRIDE SEMICONDUCTOR WAFER AND METHOD OF PROCESSING NITRIDE SEMICO...

METHOD OF POST-MOLD GRINDING A SEMICONDUCTOR PACKAGE

Manufacturing process of leadframe-based BGA packages

METHOD FOR SELF-ALIGNED REMOVAL OF A HIGH-K GATE DIELECTRIC ABOVE A...

METHOD OF MACHINING SUBSTRATE

Wafer grinding method

Surface treatment method for nitride crystal, nitride crystal subst...

Gallium Nitride Substrate, and Gallium-Nitride-Substrate Testing an...

Method of Fabricating Semiconductor Device Including Planarizing Co...

Wafer polishing control

Epitaxially coated silicon wafer and method for producing epitaxial...

Control system for multi-layer chemical mechanical polishing proces...

Semiconductor device and manufacturing method thereof

Wafer processing method

Electrochemically polishing conductive films on semiconductor wafers

Method for cleaning slurry particles from a surface polished by che...

Semiconductive substrate cleaning systems

Hermetic chip in wafer form