Mechanical processes

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H01L2224/432

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/432Mechanical processes

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 12,166,006
- Issue date Dec 10, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 12,132,026
- Issue date Oct 29, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium-coated copper bonding wire, manufacturing method of palla...
- Patent number 11,996,382
- Issue date May 28, 2024
- Tanaka Denshi Kogyo K.K.
- Mitsuo Takada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 11,929,343
- Issue date Mar 12, 2024
- Nippon Micrometal Corporation
- Daizo Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,901,337
- Issue date Feb 13, 2024
- Kioxia Corporation
- Yasuo Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure with heat sink and method preparing...
- Patent number 11,842,976
- Issue date Dec 12, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Hanlung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure with heat sink and method preparing...
- Patent number 11,488,925
- Issue date Nov 1, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Hanlung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curved pillar interconnects
- Patent number 11,239,400
- Issue date Feb 1, 2022
- Facebook Technologies, LLC
- Zheng Sung Chio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,950,570
- Issue date Mar 16, 2021
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,840,208
- Issue date Nov 17, 2020
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,737,356
- Issue date Aug 11, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,610,976
- Issue date Apr 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection pads for low cross-talk vertical wirebonds
- Patent number 10,580,756
- Issue date Mar 3, 2020
- Intel Corporation
- Hungying L. Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,525,555
- Issue date Jan 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire and method for manufacturing the same
- Patent number 10,483,130
- Issue date Nov 19, 2019
- KUNSHAN NEW FLAT PANEL DISPLAY TECHNOLOGY CENTER CO., LTD.
- Kun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,468,370
- Issue date Nov 5, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,414,002
- Issue date Sep 17, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silver bonding wire for semiconductor device containing indium, gal...
- Patent number 10,381,320
- Issue date Aug 13, 2019
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming wire interconnect structures
- Patent number 10,153,247
- Issue date Dec 11, 2018
- Kulicke and Soffa Industries, Inc.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,137,534
- Issue date Nov 27, 2018
- Nippon Micrometal Corporation
- Takashi Yamada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,121,758
- Issue date Nov 6, 2018
- Nippon Micrometal Corporation
- Daizo Oda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper-based alloy wire and methods for manufaturing the same
- Patent number 9,997,488
- Issue date Jun 12, 2018
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package assembly with wire end above a topmost c...
- Patent number 9,978,722
- Issue date May 22, 2018
- Intel Corporation
- William T. Glennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Off substrate kinking of bond wire
- Patent number 9,893,033
- Issue date Feb 13, 2018
- Invensas Corporation
- Belgacem Haba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming wire interconnect structures
- Patent number 9,865,560
- Issue date Jan 9, 2018
- Kulicke and Soffa Industries, Inc.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 9,812,421
- Issue date Nov 7, 2017
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 9,768,067
- Issue date Sep 19, 2017
- Xintec Inc.
- Chien-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package having a dual through hole redistribution layer structure
- Patent number 9,543,233
- Issue date Jan 10, 2017
- Xintec Inc.
- Chien-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device use and method of production...
- Patent number 9,536,854
- Issue date Jan 3, 2017
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming wire interconnect structures
- Patent number 9,502,371
- Issue date Nov 22, 2016
- Kulicke and Soffa Industries, Inc.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BOND WIRE HAVING A RECYCLED THERMOPLASTIC CORE WITH CONDUCTIVE FILLERS
- Publication number 20240404980
- Publication date Dec 5, 2024
- Western Digital Technologies, Inc.
- MUHAMAD RIDHWAN HAFIZ BIN ROSDI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240297142
- Publication date Sep 5, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240290743
- Publication date Aug 29, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- G01 - MEASURING TESTING
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240290745
- Publication date Aug 29, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- G01 - MEASURING TESTING
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240266313
- Publication date Aug 8, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro UNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF AUTOMATIC RECOVERY FOR PROCESS ERRORS IN OPERATING WIRE...
- Publication number 20240250063
- Publication date Jul 25, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Hui Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240071996
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Wonil SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230387066
- Publication date Nov 30, 2023
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230335528
- Publication date Oct 19, 2023
- NIPPON MICROMETAL COPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230245995
- Publication date Aug 3, 2023
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR FUSE WITH MULTI-BOND WIRE
- Publication number 20230187348
- Publication date Jun 15, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220238490
- Publication date Jul 28, 2022
- KIOXIA Corporation
- Yasuo OTSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE WITH HEAT SINK AND METHOD PREPARING...
- Publication number 20210280552
- Publication date Sep 9, 2021
- SJ Semiconductor (Jiangyin) Corporation
- Hanlung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Reliability Copper Alloy Bonding Wire for Electronic Packaging...
- Publication number 20200373272
- Publication date Nov 26, 2020
- SOUTH CHINA UNIVERSITY OF TECHNOLOGY
- Bin Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL WIRE
- Publication number 20190385969
- Publication date Dec 19, 2019
- The Charles Stark Draper Laboratory, Inc.
- Caprice Gray Haley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Bonding an Electrically Conductive Element to a Bonding...
- Publication number 20190356098
- Publication date Nov 21, 2019
- Florian Eacock
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180366345
- Publication date Dec 20, 2018
- Kunshan New Flat Panel Display Technology Center Co., Ltd.
- Kun HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION PADS FOR LOW CROSS-TALK VERTICAL WIREBONDS
- Publication number 20180323173
- Publication date Nov 8, 2018
- Intel Corporation
- Hungying L. LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20180133843
- Publication date May 17, 2018
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20180122765
- Publication date May 3, 2018
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
INTEGRATED CIRCUIT PACKAGE ASSEMBLY WITH WIRE END ABOVE A TOPMOST C...
- Publication number 20180090468
- Publication date Mar 29, 2018
- Intel Corporation
- William T. Glennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING WIRE INTERCONNECT STRUCTURES
- Publication number 20170345787
- Publication date Nov 30, 2017
- KULICKE AND SOFFA INDUSTRIES, INC.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170216974
- Publication date Aug 3, 2017
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER BONDING WIRE WITH ANGSTROM (Å) THICK SURFACE OXIDE LAYER
- Publication number 20170154863
- Publication date Jun 1, 2017
- Heraeus Deutschland GmbH & Co. KG
- Murali SARANGAPANI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170076981
- Publication date Mar 16, 2017
- XINTEC INC.
- Chien-Hung LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING WIRE INTERCONNECT STRUCTURES
- Publication number 20170040280
- Publication date Feb 9, 2017
- KULICKE AND SOFFA INDUSTRIES, INC.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFF SUBSTRATE KINKING OF BOND WIRE
- Publication number 20160225739
- Publication date Aug 4, 2016
- Invensas Corporation
- Belgacem Haba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20160133544
- Publication date May 12, 2016
- XINTEC INC.
- Chien-Hung LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE USE AND METHOD OF PRODUCTION...
- Publication number 20160111389
- Publication date Apr 21, 2016
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COATED WIRE FOR BONDING APPLICATIONS
- Publication number 20150360316
- Publication date Dec 17, 2015
- Heraeus Deutschland GmbH & Co. KG
- Eugen MILKE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Mechanical processes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding wire for semiconductor devices

Bonding wire for semiconductor devices

Palladium-coated copper bonding wire, manufacturing method of palla...

Bonding wire for semiconductor devices

Semiconductor device and method of manufacturing the same

Semiconductor package structure with heat sink and method preparing...

Semiconductor package structure with heat sink and method preparing...

Curved pillar interconnects

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Connection pads for low cross-talk vertical wirebonds

Bonding wire for semiconductor device

Wire and method for manufacturing the same

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Silver bonding wire for semiconductor device containing indium, gal...

Methods of forming wire interconnect structures

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Copper-based alloy wire and methods for manufaturing the same

Integrated circuit package assembly with wire end above a topmost c...

Off substrate kinking of bond wire

Methods of forming wire interconnect structures

Bonding wire for semiconductor devices

Chip package and manufacturing method thereof

Chip package having a dual through hole redistribution layer structure

Bonding wire for semiconductor device use and method of production...

Methods of forming wire interconnect structures

Patents Applicationslast 30 patents

BOND WIRE HAVING A RECYCLED THERMOPLASTIC CORE WITH CONDUCTIVE FILLERS

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

METHODS OF AUTOMATIC RECOVERY FOR PROCESS ERRORS IN OPERATING WIRE...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR FUSE WITH MULTI-BOND WIRE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE WITH HEAT SINK AND METHOD PREPARING...

High-Reliability Copper Alloy Bonding Wire for Electronic Packaging...

COAXIAL WIRE

Method for Bonding an Electrically Conductive Element to a Bonding...

WIRE AND METHOD FOR MANUFACTURING THE SAME

CONNECTION PADS FOR LOW CROSS-TALK VERTICAL WIREBONDS

BONDING WIRE FOR SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGE ASSEMBLY WITH WIRE END ABOVE A TOPMOST C...

METHODS OF FORMING WIRE INTERCONNECT STRUCTURES

BONDING WIRE FOR SEMICONDUCTOR DEVICE

COPPER BONDING WIRE WITH ANGSTROM (Å) THICK SURFACE OXIDE LAYER

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

METHODS OF FORMING WIRE INTERCONNECT STRUCTURES

OFF SUBSTRATE KINKING OF BOND WIRE

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

BONDING WIRE FOR SEMICONDUCTOR DEVICE USE AND METHOD OF PRODUCTION...

COATED WIRE FOR BONDING APPLICATIONS