Mechanical processes

Industry

CPC
H01L2224/352

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/352Mechanical processes

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 10,727,163
- Issue date Jul 28, 2020
- Mitsubishi Electric Corporation
- Junji Fujino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode terminal, semiconductor device, and power conversion appa...
- Patent number 10,714,447
- Issue date Jul 14, 2020
- Mitsubishi Electric Corporation
- Rei Yoneyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with vertical interconnect between carrier and clip
- Patent number 10,707,158
- Issue date Jul 7, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier and clip each having sinterable, solidified paste for conne...
- Patent number 10,347,566
- Issue date Jul 9, 2019
- Heraeus Deutschland GmbH & Co. KG
- Michael Benedikt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging solutions for devices and systems comprising lateral GaN...
- Patent number 9,824,949
- Issue date Nov 21, 2017
- GaN Systems Inc.
- Cameron McKnight-MacNeil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,633,967
- Issue date Apr 25, 2017
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,609,775
- Issue date Mar 28, 2017
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip power semiconductor device
- Patent number 9,443,760
- Issue date Sep 13, 2016
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead for connection to a semiconductor device
- Patent number 9,418,918
- Issue date Aug 16, 2016
- NXP B.V.
- Roelf Anco Jacob Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,402,311
- Issue date Jul 26, 2016
- NSK Ltd.
- Takashi Sunaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module
- Patent number 9,397,030
- Issue date Jul 19, 2016
- NSK Ltd.
- Takashi Sunaga
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Grant
Semiconductor module and method for manufacturing the same
- Patent number 9,312,234
- Issue date Apr 12, 2016
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making contact with a semiconductor and contact arrangem...
- Patent number 9,281,270
- Issue date Mar 8, 2016
- Robert Bosch GmbH
- Eckart Geinitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device using diffusion soldering
- Patent number 8,975,117
- Issue date Mar 10, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip power semiconductor device
- Patent number 8,916,968
- Issue date Dec 23, 2014
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR MANUFACTURING A TERMINAL APPARATUS FOR CON...
- Publication number 20240021436
- Publication date Jan 18, 2024
- ZF Friedrichshafen AG
- Ake Ewald
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20240021569
- Publication date Jan 18, 2024
- Fuji Electric Co., Ltd.
- Yoko NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND VEHICLE
- Publication number 20230260951
- Publication date Aug 17, 2023
- Fuji Electric Co., Ltd.
- Hitoshi NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTION MEMBER, ELECTRICAL CONNECTION STRUCTURE, AND...
- Publication number 20210257327
- Publication date Aug 19, 2021
- Hitachi Metals, Ltd.
- Junya NISHINA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnect Clip with Angled Contact Surface and Raised Bridge Tec...
- Publication number 20210074667
- Publication date Mar 11, 2021
- Chai Chee Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIPS FOR SEMICONDUCTOR PACKAGES
- Publication number 20210043549
- Publication date Feb 11, 2021
- INFINEON TECHNOLOGIES AG
- Ke Yan Tean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING CONTACT WITH A SEMICONDUCTOR AND CONTACT ARRANGEM...
- Publication number 20140299998
- Publication date Oct 9, 2014
- Eckart Geinitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multichip Power Semiconductor Device
- Publication number 20130256856
- Publication date Oct 3, 2013
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Using Diffusion Soldering
- Publication number 20130200532
- Publication date Aug 8, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Mechanical processes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Electrode terminal, semiconductor device, and power conversion appa...

Package with vertical interconnect between carrier and clip

Carrier and clip each having sinterable, solidified paste for conne...

Packaging solutions for devices and systems comprising lateral GaN...

Semiconductor module

Semiconductor module

Multichip power semiconductor device

Lead for connection to a semiconductor device

Semiconductor module

Semiconductor module

Semiconductor module and method for manufacturing the same

Method for making contact with a semiconductor and contact arrangem...

Semiconductor device using diffusion soldering

Multichip power semiconductor device

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR MANUFACTURING A TERMINAL APPARATUS FOR CON...

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

SEMICONDUCTOR APPARATUS AND VEHICLE

ELECTRICAL CONNECTION MEMBER, ELECTRICAL CONNECTION STRUCTURE, AND...

Interconnect Clip with Angled Contact Surface and Raised Bridge Tec...

CLIPS FOR SEMICONDUCTOR PACKAGES

METHOD FOR MAKING CONTACT WITH A SEMICONDUCTOR AND CONTACT ARRANGEM...

Multichip Power Semiconductor Device

Semiconductor Device Using Diffusion Soldering