Mechanical treatment

Industry

CPC
H01L21/304

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/304Mechanical treatment

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a pre-mold substrate
- Patent number 12,327,728
- Issue date Jun 10, 2025
- HAESUNG DS CO., LTD
- Jong Hoe Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing system and substrate processing method
- Patent number 12,327,768
- Issue date Jun 10, 2025
- Tokyo Electron Limited
- Hayato Tanoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,322,708
- Issue date Jun 3, 2025
- Renesas Electronics Corporation
- Takehirou Mariko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard ring structure, semiconductor structure and manufacturing method
- Patent number 12,322,671
- Issue date Jun 3, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hua Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method, modification device and substrate proc...
- Patent number 12,322,599
- Issue date Jun 3, 2025
- Tokyo Electron Limited
- Norifumi Kohama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Kit for cleaning agent and method for preparing cleaning agent
- Patent number 12,312,569
- Issue date May 27, 2025
- FUJIFILM Corporation
- Satoshi Shirahata
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Wafer processing method
- Patent number 12,315,716
- Issue date May 27, 2025
- Disco Corporation
- Shunichiro Hirosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 12,308,334
- Issue date May 20, 2025
- Advanced Semiconductor Engineering, Inc.
- Hsin He Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with tapered sidewall in package
- Patent number 12,308,346
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatment liquid and pattern forming method
- Patent number 12,306,538
- Issue date May 20, 2025
- FUJIFILM Corporation
- Hideaki Tsubaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing wafer
- Patent number 12,308,293
- Issue date May 20, 2025
- Disco Corporation
- Masaru Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor silicon wafer
- Patent number 12,308,228
- Issue date May 20, 2025
- Globalwafers Japan Co., Ltd
- Takeshi Senda
- C30 - CRYSTAL GROWTH
Information Patent Grant
Slurry composition for polishing silicon oxide film, and polishing...
- Patent number 12,305,080
- Issue date May 20, 2025
- YOUNG CHANG CHEMICAL CO., LTD
- Seung Hun Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Silica particle and production method therefor, silica sol, polishi...
- Patent number 12,297,376
- Issue date May 13, 2025
- Mitsubishi Chemical Corporation
- Tomohiro Kyotani
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of forming protective layer utilized in silicon remove process
- Patent number 12,300,534
- Issue date May 13, 2025
- United Microelectronics Corp.
- Chia-Liang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge-trimming methods for wafer bonding and dicing
- Patent number 12,300,664
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer with devices having different top layer thickne...
- Patent number 12,302,637
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High resistivity silicon-on-insulator substrate comprising an isola...
- Patent number 12,300,535
- Issue date May 13, 2025
- GlobalWafers Co., Ltd.
- Igor Peidous
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide components and methods for producing silicon carbid...
- Patent number 12,302,619
- Issue date May 13, 2025
- Infineon Technologies AG
- Roland Rupp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Gallium nitride device with field plate structure and method of man...
- Patent number 12,293,941
- Issue date May 6, 2025
- United Microelectronics Corp.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 12,290,898
- Issue date May 6, 2025
- Tokyo Electron Limited
- Nobutaka Fukunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for wafer stack processing
- Patent number 12,293,946
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Lung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier head for chemical mechanical polishing apparatus comprising...
- Patent number 12,285,839
- Issue date Apr 29, 2025
- Joon Mo Kang
- B24 - GRINDING POLISHING
Information Patent Grant
Processing method
- Patent number 12,289,922
- Issue date Apr 29, 2025
- Disco Corporation
- Hayato Iga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive for processing a microelectronic substrate, and related me...
- Patent number 12,288,575
- Issue date Apr 29, 2025
- Seagate Technology LLC
- Zubair Ahmed Khan
- B24 - GRINDING POLISHING
Information Patent Grant
Adhesive sheet
- Patent number 12,286,569
- Issue date Apr 29, 2025
- Nitto Denko Corporation
- Shusaku Ueno
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Plasma processing apparatus and plasma processing method
- Patent number 12,283,465
- Issue date Apr 22, 2025
- Tokyo Electron Limited
- Eiki Kamata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,283,614
- Issue date Apr 22, 2025
- Kabushiki Kaisha Toshiba
- Shinji Onduka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,272,568
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing composition, polishing method and method for producing se...
- Patent number 12,269,970
- Issue date Apr 8, 2025
- FUJIMI INCORPORATED
- Yukinobu Yoshizaki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING ROUNDED COMPONENTS AND RELATED MANU...
- Publication number 20250192005
- Publication date Jun 12, 2025
- INFINEON TECHNOLOGIES AG
- Rainer Markus SCHALLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250194209
- Publication date Jun 12, 2025
- Kabushiki Kaisha Toshiba
- Shinji Onduka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR PRODUCING THE SAME
- Publication number 20250191916
- Publication date Jun 12, 2025
- Mitsubishi Electric Corporation
- Kazuhiro NISHIMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLANARIZATION METHOD OF WAFER
- Publication number 20250191925
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- Kai ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER WITH RECESSED PORTIONS AT A SCRIBE AREA
- Publication number 20250192066
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR FABRICATING A 3D MEMORY STRUCTURE
- Publication number 20250185259
- Publication date Jun 5, 2025
- TOKYO ELECTRON LIMITED
- Sang Cheol Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKGRIND TAPE ETCHING FOR IMPROVED LASER DICING
- Publication number 20250183090
- Publication date Jun 5, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jezreel Duane Aquino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE SILICON CARBIDE SUBSTRATE AND PREPARATION METHOD THEREFOR
- Publication number 20250185328
- Publication date Jun 5, 2025
- TJ INNOVATIVE SEMICONDUCTOR SUBSTRATE TECHNOLOGY CO., LTD.
- Chao GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CHIP M...
- Publication number 20250174555
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250166996
- Publication date May 22, 2025
- Mitsubishi Electric Corporation
- Takuya YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge structure of semiconductor wafer and manufacturing method thereof
- Publication number 20250166997
- Publication date May 22, 2025
- UNITED MICROELECTRONICS CORP.
- Yu-Ping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER SUBSTRATE AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE...
- Publication number 20250167031
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Hosin SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PRODUCTION METHOD USING PEEL TAPE AND ADHESIVE MATERIAL, PEEL...
- Publication number 20250167035
- Publication date May 22, 2025
- Mitsui Chemicals ICT Materia, Inc.
- Takashi SUZUKI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TRIMMING METHOD OF STACKED STRUCTURE AND STACKED STRUCTURE FORMED T...
- Publication number 20250167150
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-An Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD
- Publication number 20250144674
- Publication date May 8, 2025
- EBARA CORPORATION
- Chikako TAKATOH
- B08 - CLEANING
Information Patent Application
METHOD OF MANUFACTURING SUBSTRATE
- Publication number 20250144747
- Publication date May 8, 2025
- Disco Corporation
- Yuya SETO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD
- Publication number 20250144675
- Publication date May 8, 2025
- EBARA CORPORATION
- Chikako TAKATOH
- B08 - CLEANING
Information Patent Application
COMPOSITE COMPONENT DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250149423
- Publication date May 8, 2025
- Murata Manufacturing Co., Ltd.
- Tatsuya FUNAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149424
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CLEANING SYSTEMS AND RELATED METHODS
- Publication number 20250149386
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PROCESSING LAMINATED WAFER
- Publication number 20250149341
- Publication date May 8, 2025
- Disco Corporation
- Kokichi MINATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149425
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TO ALIGNMENT MARKS WITH DUMMY ALIGNMENT MARKS
- Publication number 20250149500
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD, MANUFACTURING METHOD, AND SUBSTRATE PR...
- Publication number 20250140576
- Publication date May 1, 2025
- SEMES CO., LTD.
- Jun Hee CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLURRY, SCREENING METHOD, AND POLISHING METHOD
- Publication number 20250129279
- Publication date Apr 24, 2025
- Resonac Corporation
- Satoyuki NOMURA
- C01 - INORGANIC CHEMISTRY
Information Patent Application
SEMICONDUCTOR WAFER THINNED BY CRACK PROPAGATION
- Publication number 20250132205
- Publication date Apr 24, 2025
- Western Digital Technologies, Inc.
- Fan Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSINGSYSTEM
- Publication number 20250125162
- Publication date Apr 17, 2025
- TOKYO ELECTRON LIMITED
- Takashi UNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR COMPENSATING FOR DISTORTIONS
- Publication number 20250125152
- Publication date Apr 17, 2025
- EV GROUP E. THALLNER GMBH
- Thomas Uhrmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFORMATION PROCESSING APPARATUS, INFERENCE APPARATUS, MACHINE-LEAR...
- Publication number 20250125172
- Publication date Apr 17, 2025
- EBARA CORPORATION
- Mitsuru MIYAZAKI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR CHIP
- Publication number 20250125197
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Junyun Kweon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Mechanical treatment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing a pre-mold substrate

Substrate processing system and substrate processing method

Semiconductor device

Guard ring structure, semiconductor structure and manufacturing method

Substrate processing method, modification device and substrate proc...

Kit for cleaning agent and method for preparing cleaning agent

Wafer processing method

Semiconductor device and semiconductor package

Semiconductor die with tapered sidewall in package

Treatment liquid and pattern forming method

Method of processing wafer

Manufacturing method for semiconductor silicon wafer

Slurry composition for polishing silicon oxide film, and polishing...

Silica particle and production method therefor, silica sol, polishi...

Method of forming protective layer utilized in silicon remove process

Edge-trimming methods for wafer bonding and dicing

Semiconductor wafer with devices having different top layer thickne...

High resistivity silicon-on-insulator substrate comprising an isola...

Silicon carbide components and methods for producing silicon carbid...

Gallium nitride device with field plate structure and method of man...

Substrate processing method and substrate processing apparatus

Techniques for wafer stack processing

Carrier head for chemical mechanical polishing apparatus comprising...

Processing method

Adhesive for processing a microelectronic substrate, and related me...

Adhesive sheet

Plasma processing apparatus and plasma processing method

Semiconductor device

Semiconductor package and manufacturing method thereof

Polishing composition, polishing method and method for producing se...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES INCLUDING ROUNDED COMPONENTS AND RELATED MANU...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR APPARATUS AND METHOD FOR PRODUCING THE SAME

PLANARIZATION METHOD OF WAFER

SEMICONDUCTOR WAFER WITH RECESSED PORTIONS AT A SCRIBE AREA

TECHNOLOGIES FOR FABRICATING A 3D MEMORY STRUCTURE

BACKGRIND TAPE ETCHING FOR IMPROVED LASER DICING

COMPOSITE SILICON CARBIDE SUBSTRATE AND PREPARATION METHOD THEREFOR

SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CHIP M...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Edge structure of semiconductor wafer and manufacturing method thereof

CARRIER SUBSTRATE AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE...

WAFER PRODUCTION METHOD USING PEEL TAPE AND ADHESIVE MATERIAL, PEEL...

TRIMMING METHOD OF STACKED STRUCTURE AND STACKED STRUCTURE FORMED T...

SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD

METHOD OF MANUFACTURING SUBSTRATE

SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD

COMPOSITE COMPONENT DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

DIE CLEANING SYSTEMS AND RELATED METHODS

METHOD FOR PROCESSING LAMINATED WAFER

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

BONDING TO ALIGNMENT MARKS WITH DUMMY ALIGNMENT MARKS

SUBSTRATE PROCESSING METHOD, MANUFACTURING METHOD, AND SUBSTRATE PR...

SLURRY, SCREENING METHOD, AND POLISHING METHOD

SEMICONDUCTOR WAFER THINNED BY CRACK PROPAGATION

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSINGSYSTEM

METHOD AND DEVICE FOR COMPENSATING FOR DISTORTIONS

INFORMATION PROCESSING APPARATUS, INFERENCE APPARATUS, MACHINE-LEAR...

SEMICONDUCTOR CHIP