Mechanical treatment

Industry

CPC
H01L21/304

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/304Mechanical treatment

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Method of processing wafer
- Patent number 12,170,224
- Issue date Dec 17, 2024
- Disco Corporation
- Shunsuke Teranishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for separating dies from a semiconductor substrate
- Patent number 12,170,226
- Issue date Dec 17, 2024
- Infineon Technologies AG
- Franz-Josef Pichler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for ring frame cleaning and inspection
- Patent number 12,165,901
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Fa Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 12,165,982
- Issue date Dec 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing composition for semiconductor wiring
- Patent number 12,152,167
- Issue date Nov 26, 2024
- Daicel Corporation
- Yuichi Sakanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of wafer thinning
- Patent number 12,154,783
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing composition
- Patent number 12,146,077
- Issue date Nov 19, 2024
- FUJIMI INCORPORATED
- Yasuaki Ito
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Jet ablation die singulation systems and related methods
- Patent number 12,148,665
- Issue date Nov 19, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and wafer-attached structure
- Patent number 12,148,667
- Issue date Nov 19, 2024
- Rohm Co., Ltd.
- Masatoshi Aketa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 12,142,483
- Issue date Nov 12, 2024
- Tokyo Electron Limited
- Yoshihiro Kawaguchi
- B24 - GRINDING POLISHING
Information Patent Grant
Technique for training neural network for use in in-situ monitoring...
- Patent number 12,136,574
- Issue date Nov 5, 2024
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus
- Patent number 12,128,523
- Issue date Oct 29, 2024
- Ebara Corporation
- Makoto Fukushima
- B24 - GRINDING POLISHING
Information Patent Grant
Die on die bonding structure
- Patent number 12,125,819
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for grinding wafer and wafer failure analysis method
- Patent number 12,125,752
- Issue date Oct 22, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jiabao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive sheet
- Patent number 12,122,947
- Issue date Oct 22, 2024
- Nitto Denko Corporation
- Shusaku Ueno
- B24 - GRINDING POLISHING
Information Patent Grant
Methods of fabricating the same die stack structure and semiconduct...
- Patent number 12,119,328
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure
- Patent number 12,119,229
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,119,324
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kung-Chen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dies and methods for forming bonded structures
- Patent number 12,113,056
- Issue date Oct 8, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing system
- Patent number 12,112,958
- Issue date Oct 8, 2024
- Highlight Tech Corp.
- Chwung-Shan Kou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry, screening method, and polishing method
- Patent number 12,104,112
- Issue date Oct 1, 2024
- Resonac Corporation
- Satoyuki Nomura
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Processing method of wafer
- Patent number 12,106,966
- Issue date Oct 1, 2024
- Disco Corporation
- Masaru Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer producing method
- Patent number 12,106,967
- Issue date Oct 1, 2024
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polishing liquid and chemical mechanical polishing method
- Patent number 12,098,301
- Issue date Sep 24, 2024
- FUJIFILM Corporation
- Tetsuya Kamimura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for forming a crack in an edge region of a donor substrate
- Patent number 12,097,641
- Issue date Sep 24, 2024
- Siltectra GmbH
- Marko David Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid chemical for forming water-repellent protective film, method...
- Patent number 12,098,319
- Issue date Sep 24, 2024
- Central Glass Company, Limited
- Yuzo Okumura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wafer processing method and machine
- Patent number 12,100,620
- Issue date Sep 24, 2024
- Disco Corporation
- Yoshinobu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ruthenium-based liner for a copper interconnect
- Patent number 12,094,770
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Min Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for dissolving abrasive particles and cleaning method u...
- Patent number 12,091,636
- Issue date Sep 17, 2024
- KCTECH CO., LTD.
- Kyong Jin Jung
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20240413022
- Publication date Dec 12, 2024
- TOKYO ELECTRON LIMITED
- Keisuke SAKAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20240412976
- Publication date Dec 12, 2024
- TOKYO ELECTRON LIMITED
- Susumu HAYAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDDY CURRENT SENSOR, EDDY CURRENT SENSOR ASSEMBLY, AND POLISHING AP...
- Publication number 20240399536
- Publication date Dec 5, 2024
- EBARA CORPORATION
- Katsuya MINATOZAKI
- B24 - GRINDING POLISHING
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240404831
- Publication date Dec 5, 2024
- InnoLux Corporation
- Ker-Yih KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, METHOD FOR PRODUCING FILM-LI...
- Publication number 20240395759
- Publication date Nov 28, 2024
- Resonac Corporation
- Hiroyuki ISHIGE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DICING METHOD FOR STACKED SEMICONDUCTOR DEVICES
- Publication number 20240395621
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsung-Hsing Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR REDUCING GAP FILL DEFECTS IN A VERTICALLY STACKED SE...
- Publication number 20240395610
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SiC CRYSTAL SUBSTRATE, METHOD OF MANUFACTURING SiC CRYSTAL SUBSTRAT...
- Publication number 20240387640
- Publication date Nov 21, 2024
- Sumitomo Electric Industries, Ltd.
- Issei SATOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ON DIE BONDING STRUCTURE
- Publication number 20240387452
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON FRAGMENT DEFECT REDUCTION IN GRINDING PROCESS
- Publication number 20240387312
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Cheng Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RUTHENIUM-BASED LINER FOR A COPPER INTERCONNECT
- Publication number 20240387256
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Min LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20240387197
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE CLEAN SYSTEM AND METHOD
- Publication number 20240383105
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Yi Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387242
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- MIN-YING TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20240379402
- Publication date Nov 14, 2024
- Disco Corporation
- Tomoharu TAKITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DICING DEVICES AND METHODS OF WAFER DICING
- Publication number 20240375212
- Publication date Nov 14, 2024
- Yangtze Memory Technologies Co., Ltd.
- Wei Xie
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF
- Publication number 20240379369
- Publication date Nov 14, 2024
- Yangtze Memory Technologies Co., Ltd.
- Qingyi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20240379370
- Publication date Nov 14, 2024
- TOKYO ELECTRON LIMITED
- Yoshihiro KAWAGUCHI
- B24 - GRINDING POLISHING
Information Patent Application
BACK GRINDING ADHESIVE FILM AND METHOD FOR MANUFACTURING ELECTRONIC...
- Publication number 20240379403
- Publication date Nov 14, 2024
- MITSUI CHEMICALS TOHCELLO, INC.
- Hiroto YASUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED WAFER STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240371625
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chen CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20240371647
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- YU-HSIANG HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING APPARATUS AND PROCESSING METHOD
- Publication number 20240367266
- Publication date Nov 7, 2024
- TOKYO ELECTRON LIMITED
- Hayato TANOUE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240371821
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kung-Chen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS CONTROL METHOD FOR PATTERN WAFER INDEX POLISHING
- Publication number 20240371646
- Publication date Nov 7, 2024
- Applied Materials, Inc.
- Jimin ZHANG
- B24 - GRINDING POLISHING
Information Patent Application
CHIP STACK AND FABRICATION METHOD
- Publication number 20240363489
- Publication date Oct 31, 2024
- Yibu Semiconductor Co., Ltd.
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE HAVING EDGE WITH MULTIPLE GRADIENTS
- Publication number 20240363398
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING EPITAXIAL LAYER AND RESPECTIVE SEMICONDUCTOR ST...
- Publication number 20240363416
- Publication date Oct 31, 2024
- MICLEDI MICRODISPLAYS BV
- Soeren STEUDEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE WAFER GROOVING STRUCTURE FOR WAFER THINNING AND METHODS...
- Publication number 20240363613
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Ming WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
- Publication number 20240355627
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shang-Yu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP PARTITION POWER DELIVERY WITH DEEP TRENCH CAPACITOR
- Publication number 20240355799
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Mechanical treatment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of processing wafer

Method for separating dies from a semiconductor substrate

System and method for ring frame cleaning and inspection

Semiconductor package structure and method for manufacturing the same

Polishing composition for semiconductor wiring

Semiconductor wafer and method of wafer thinning

Polishing composition

Jet ablation die singulation systems and related methods

Semiconductor device manufacturing method and wafer-attached structure

Substrate processing apparatus and substrate processing method

Technique for training neural network for use in in-situ monitoring...

Polishing apparatus

Die on die bonding structure

Method for grinding wafer and wafer failure analysis method

Adhesive sheet

Methods of fabricating the same die stack structure and semiconduct...

Through-substrate via structure and method of manufacture

Method of manufacturing semiconductor structure

Package structure

Stacked dies and methods for forming bonded structures

Wafer processing system

Slurry, screening method, and polishing method

Processing method of wafer

Wafer producing method

Polishing liquid and chemical mechanical polishing method

Method for forming a crack in an edge region of a donor substrate

Liquid chemical for forming water-repellent protective film, method...

Wafer processing method and machine

Ruthenium-based liner for a copper interconnect

Composition for dissolving abrasive particles and cleaning method u...

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

EDDY CURRENT SENSOR, EDDY CURRENT SENSOR ASSEMBLY, AND POLISHING AP...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, METHOD FOR PRODUCING FILM-LI...

DICING METHOD FOR STACKED SEMICONDUCTOR DEVICES

STRUCTURES FOR REDUCING GAP FILL DEFECTS IN A VERTICALLY STACKED SE...

SiC CRYSTAL SUBSTRATE, METHOD OF MANUFACTURING SiC CRYSTAL SUBSTRAT...

DIE ON DIE BONDING STRUCTURE

SILICON FRAGMENT DEFECT REDUCTION IN GRINDING PROCESS

RUTHENIUM-BASED LINER FOR A COPPER INTERCONNECT

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

SURFACE CLEAN SYSTEM AND METHOD

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

WAFER PROCESSING METHOD

WAFER DICING DEVICES AND METHODS OF WAFER DICING

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF

SUBSTRATE PROCESSING METHOD

BACK GRINDING ADHESIVE FILM AND METHOD FOR MANUFACTURING ELECTRONIC...

STACKED WAFER STRUCTURE AND METHOD FOR FORMING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

PROCESSING APPARATUS AND PROCESSING METHOD

PACKAGE STRUCTURE

PROCESS CONTROL METHOD FOR PATTERN WAFER INDEX POLISHING

CHIP STACK AND FABRICATION METHOD

SEMICONDUCTOR DIE HAVING EDGE WITH MULTIPLE GRADIENTS

METHOD FOR REMOVING EPITAXIAL LAYER AND RESPECTIVE SEMICONDUCTOR ST...

PROTECTIVE WAFER GROOVING STRUCTURE FOR WAFER THINNING AND METHODS...

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

DEEP PARTITION POWER DELIVERY WITH DEEP TRENCH CAPACITOR