Mechanical treatment

Industry

CPC
H01L21/304

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/304Mechanical treatment

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,368,071
- Issue date Jul 22, 2025
- SK Hynix Inc.
- Byung Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite interposer structure and method of providing same
- Patent number 12,362,284
- Issue date Jul 15, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fill-in planarization system and method
- Patent number 12,362,237
- Issue date Jul 15, 2025
- Wolfspeed, Inc.
- Simon Bubel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package geometries to enable visual inspection of solder fillets
- Patent number 12,354,918
- Issue date Jul 8, 2025
- Texas Instruments Incorporated
- LongTing Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating package structure
- Patent number 12,355,008
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing wafer
- Patent number 12,354,916
- Issue date Jul 8, 2025
- Disco Corporation
- Hayato Iga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing chips
- Patent number 12,341,068
- Issue date Jun 24, 2025
- Disco Corporation
- Hideyuki Sandoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer cleaning apparatus
- Patent number 12,341,052
- Issue date Jun 24, 2025
- ZEUS CO., LTD.
- Seung Dae Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 12,341,023
- Issue date Jun 24, 2025
- Qorvo US, Inc.
- Krishna Chetry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 12,341,051
- Issue date Jun 24, 2025
- Fuji Electric Co., Ltd.
- Kazuhiro Kitahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detachable structure used for transferring or handling layers, and...
- Patent number 12,334,347
- Issue date Jun 17, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- François-Xavier Darras
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 12,334,339
- Issue date Jun 17, 2025
- Denso Corporation
- Shosuke Nakabayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a pre-mold substrate
- Patent number 12,327,728
- Issue date Jun 10, 2025
- HAESUNG DS CO., LTD
- Jong Hoe Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing system and substrate processing method
- Patent number 12,327,768
- Issue date Jun 10, 2025
- Tokyo Electron Limited
- Hayato Tanoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,322,708
- Issue date Jun 3, 2025
- Renesas Electronics Corporation
- Takehirou Mariko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard ring structure, semiconductor structure and manufacturing method
- Patent number 12,322,671
- Issue date Jun 3, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hua Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method, modification device and substrate proc...
- Patent number 12,322,599
- Issue date Jun 3, 2025
- Tokyo Electron Limited
- Norifumi Kohama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Kit for cleaning agent and method for preparing cleaning agent
- Patent number 12,312,569
- Issue date May 27, 2025
- FUJIFILM Corporation
- Satoshi Shirahata
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Wafer processing method
- Patent number 12,315,716
- Issue date May 27, 2025
- Disco Corporation
- Shunichiro Hirosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 12,308,334
- Issue date May 20, 2025
- Advanced Semiconductor Engineering, Inc.
- Hsin He Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with tapered sidewall in package
- Patent number 12,308,346
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing wafer
- Patent number 12,308,293
- Issue date May 20, 2025
- Disco Corporation
- Masaru Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor silicon wafer
- Patent number 12,308,228
- Issue date May 20, 2025
- Globalwafers Japan Co., Ltd
- Takeshi Senda
- C30 - CRYSTAL GROWTH
Information Patent Grant
Treatment liquid and pattern forming method
- Patent number 12,306,538
- Issue date May 20, 2025
- FUJIFILM Corporation
- Hideaki Tsubaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry composition for polishing silicon oxide film, and polishing...
- Patent number 12,305,080
- Issue date May 20, 2025
- YOUNG CHANG CHEMICAL CO., LTD
- Seung Hun Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Silica particle and production method therefor, silica sol, polishi...
- Patent number 12,297,376
- Issue date May 13, 2025
- Mitsubishi Chemical Corporation
- Tomohiro Kyotani
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Edge-trimming methods for wafer bonding and dicing
- Patent number 12,300,664
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming protective layer utilized in silicon remove process
- Patent number 12,300,534
- Issue date May 13, 2025
- United Microelectronics Corp.
- Chia-Liang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer with devices having different top layer thickne...
- Patent number 12,302,637
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High resistivity silicon-on-insulator substrate comprising an isola...
- Patent number 12,300,535
- Issue date May 13, 2025
- GlobalWafers Co., Ltd.
- Igor Peidous
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ULTRA-THIN PACKAGED COMPONENT
- Publication number 20250239499
- Publication date Jul 24, 2025
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER SCHEME WITH FRONT-SIDE POWER INPUT
- Publication number 20250239523
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED DEVICE STRUCTURES WITH IMPROVED STRESS DISTRIBUTION AND REDU...
- Publication number 20250239548
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yung Lin Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYURETHANE FOR USE IN POLISHING LAYER, POLISHING LAYER, POLISHING...
- Publication number 20250236766
- Publication date Jul 24, 2025
- Kuraray Co., Ltd
- Azusa SUNAYAMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF PROCESSING WAFER
- Publication number 20250239468
- Publication date Jul 24, 2025
- Disco Corporation
- Akira MIZUTANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TECHNIQUES FOR WAFER STACK PROCESSING
- Publication number 20250241053
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Lung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING WORKPIECE
- Publication number 20250239453
- Publication date Jul 24, 2025
- Disco Corporation
- Kensuke FURUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CLEANING SYSTEMS AND RELATED METHODS
- Publication number 20250233021
- Publication date Jul 17, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20250232980
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM NITRIDE DEVICE WITH FIELD PLATE STRUCTURE AND METHOD OF MAN...
- Publication number 20250226261
- Publication date Jul 10, 2025
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Workpiece Processing Method
- Publication number 20250226229
- Publication date Jul 10, 2025
- LINTEC CORPORATION
- Hayato Nakanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A STRUCTURE COMPRISING AT LEAST TWO CHIPS ON A...
- Publication number 20250226225
- Publication date Jul 10, 2025
- SOITEC
- Bruno Ghyselen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING WAFER
- Publication number 20250226242
- Publication date Jul 10, 2025
- Disco Corporation
- Akira MIZUTANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID SUBSTRATE WITH EMBEDDED COMPONENT
- Publication number 20250226302
- Publication date Jul 10, 2025
- QUALCOMM Incorporated
- Yeoil PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WAFER LEVEL PACKAGING OF SEMICONDUCTOR DEVICES
- Publication number 20250226264
- Publication date Jul 10, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- George CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE BY USING CARRIER SUBS...
- Publication number 20250219020
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Junho CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM FOR WAFER BACK GRINDING
- Publication number 20250215269
- Publication date Jul 3, 2025
- INNOX ADVANCED MATERIALS CO., LTD.
- Kyung-Woo Park
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR...
- Publication number 20250201566
- Publication date Jun 19, 2025
- Mitsubishi Electric Corporation
- Kyohei AKIYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING GROUP 3 NITRIDE SEMICONDUCTOR TEMPLATE USI...
- Publication number 20250203899
- Publication date Jun 19, 2025
- WAVELORD CO., LTD
- Juneo SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250201580
- Publication date Jun 19, 2025
- Fuji Electric Co., Ltd.
- Tatsuya HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20250201583
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATING DEVICE AND METHOD OF FABRICATING SEMICONDUCTOR CHIP USIN...
- Publication number 20250201597
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- YEONG JUN JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250201632
- Publication date Jun 19, 2025
- DENSO CORPORATION
- Yuji NAGUMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING ROUNDED COMPONENTS AND RELATED MANU...
- Publication number 20250192005
- Publication date Jun 12, 2025
- INFINEON TECHNOLOGIES AG
- Rainer Markus SCHALLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250194209
- Publication date Jun 12, 2025
- Kabushiki Kaisha Toshiba
- Shinji Onduka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR PRODUCING THE SAME
- Publication number 20250191916
- Publication date Jun 12, 2025
- Mitsubishi Electric Corporation
- Kazuhiro NISHIMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLANARIZATION METHOD OF WAFER
- Publication number 20250191925
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- Kai ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER WITH RECESSED PORTIONS AT A SCRIBE AREA
- Publication number 20250192066
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKGRIND TAPE ETCHING FOR IMPROVED LASER DICING
- Publication number 20250183090
- Publication date Jun 5, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jezreel Duane Aquino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TECHNOLOGIES FOR FABRICATING A 3D MEMORY STRUCTURE
- Publication number 20250185259
- Publication date Jun 5, 2025
- TOKYO ELECTRON LIMITED
- Sang Cheol Han
- H01 - BASIC ELECTRIC ELEMENTS

Mechanical treatment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method for fabricating the same

Composite interposer structure and method of providing same

Fill-in planarization system and method

Package geometries to enable visual inspection of solder fillets

Methods of fabricating package structure

Method of processing wafer

Method of manufacturing chips

Wafer cleaning apparatus

Semiconductor device and method of manufacturing a semiconductor de...

Manufacturing method of semiconductor device

Detachable structure used for transferring or handling layers, and...

Manufacturing method of semiconductor device

Method for manufacturing a pre-mold substrate

Substrate processing system and substrate processing method

Semiconductor device

Guard ring structure, semiconductor structure and manufacturing method

Substrate processing method, modification device and substrate proc...

Kit for cleaning agent and method for preparing cleaning agent

Wafer processing method

Semiconductor device and semiconductor package

Semiconductor die with tapered sidewall in package

Method of processing wafer

Manufacturing method for semiconductor silicon wafer

Treatment liquid and pattern forming method

Slurry composition for polishing silicon oxide film, and polishing...

Silica particle and production method therefor, silica sol, polishi...

Edge-trimming methods for wafer bonding and dicing

Method of forming protective layer utilized in silicon remove process

Semiconductor wafer with devices having different top layer thickne...

High resistivity silicon-on-insulator substrate comprising an isola...

Patents Applicationslast 30 patents

ULTRA-THIN PACKAGED COMPONENT

BACKSIDE POWER SCHEME WITH FRONT-SIDE POWER INPUT

BONDED DEVICE STRUCTURES WITH IMPROVED STRESS DISTRIBUTION AND REDU...

POLYURETHANE FOR USE IN POLISHING LAYER, POLISHING LAYER, POLISHING...

METHOD OF PROCESSING WAFER

TECHNIQUES FOR WAFER STACK PROCESSING

METHOD FOR PROCESSING WORKPIECE

DIE CLEANING SYSTEMS AND RELATED METHODS

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE

GALLIUM NITRIDE DEVICE WITH FIELD PLATE STRUCTURE AND METHOD OF MAN...

Workpiece Processing Method

METHOD FOR PRODUCING A STRUCTURE COMPRISING AT LEAST TWO CHIPS ON A...

METHOD OF PROCESSING WAFER

HYBRID SUBSTRATE WITH EMBEDDED COMPONENT

FAN-OUT WAFER LEVEL PACKAGING OF SEMICONDUCTOR DEVICES

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE BY USING CARRIER SUBS...

ADHESIVE FILM FOR WAFER BACK GRINDING

METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR...

METHOD FOR MANUFACTURING GROUP 3 NITRIDE SEMICONDUCTOR TEMPLATE USI...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

LAMINATING DEVICE AND METHOD OF FABRICATING SEMICONDUCTOR CHIP USIN...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES INCLUDING ROUNDED COMPONENTS AND RELATED MANU...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR APPARATUS AND METHOD FOR PRODUCING THE SAME

PLANARIZATION METHOD OF WAFER

SEMICONDUCTOR WAFER WITH RECESSED PORTIONS AT A SCRIBE AREA

BACKGRIND TAPE ETCHING FOR IMPROVED LASER DICING

TECHNOLOGIES FOR FABRICATING A 3D MEMORY STRUCTURE