Mechanical treatment

Industry

CPC
H01L21/304

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/304Mechanical treatment

Industries

Patents Grantslast 30 patents

Information Patent Grant
Polishing slurry composition
- Patent number 12,247,141
- Issue date Mar 11, 2025
- KCTECH CO., LTD.
- Nak Hyun Choi
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Slurry and polishing method
- Patent number 12,247,140
- Issue date Mar 11, 2025
- Resonac Corporation
- Tomohiro Iwano
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Semiconductor structure and method for manufacturing semiconductor...
- Patent number 12,243,779
- Issue date Mar 4, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Shuangshuang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for stripping gallium nitride substrate
- Patent number 12,243,746
- Issue date Mar 4, 2025
- SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD.
- Fen Guo
- C30 - CRYSTAL GROWTH
Information Patent Grant
Dicing method for stacked semiconductor devices
- Patent number 12,237,226
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Hsing Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate transporter and substrate processing apparatus including...
- Patent number 12,237,194
- Issue date Feb 25, 2025
- EBARA CORPORATION
- Akihiro Yazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SiC substrate
- Patent number 12,237,378
- Issue date Feb 25, 2025
- Kwansei Gakuin Educational Foundation
- Masatake Nagaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 12,230,515
- Issue date Feb 18, 2025
- Tokyo Electron Limited
- Nobuhiko Mouri
- B08 - CLEANING
Information Patent Grant
Die cleaning systems and related methods
- Patent number 12,230,543
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate processing system and substrate processing method
- Patent number 12,230,540
- Issue date Feb 18, 2025
- Tokyo Electron Limited
- Yoshihiro Kawaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Element chip manufacturing method
- Patent number 12,230,541
- Issue date Feb 18, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Atsushi Harikai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding to alignment marks with dummy alignment marks
- Patent number 12,218,097
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Indium phosphide substrate
- Patent number 12,217,967
- Issue date Feb 4, 2025
- JX Advanced Metals Corporation
- Shunsuke Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method of wafer, protective sheet, and protective sheet...
- Patent number 12,217,966
- Issue date Feb 4, 2025
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-contact apparatus for measuring wafer thickness
- Patent number 12,209,853
- Issue date Jan 28, 2025
- Fujikoshi Machinery Corp.
- Chihiro Miyagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microreplicated polishing surface with enhanced co-planarity
- Patent number 12,208,483
- Issue date Jan 28, 2025
- 3M Innovative Properties Company
- Kenneth A. P. Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside ohmic contacts for semiconductor devices
- Patent number 12,211,920
- Issue date Jan 28, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Srinivasa Reddy Yeduru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid body and multi-component arrangement
- Patent number 12,211,702
- Issue date Jan 28, 2025
- Siltectra GmbH
- Wolfram Drescher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 12,211,733
- Issue date Jan 28, 2025
- Ebara Corporation
- Nobuyuki Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser processing method, semiconductor member manufacturing method,...
- Patent number 12,194,570
- Issue date Jan 14, 2025
- NATIONAL UNIVERSITY CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH...
- Atsushi Tanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer manufacturing method and laminated device chip manufacturing...
- Patent number 12,198,990
- Issue date Jan 14, 2025
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 12,194,594
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Nobutaka Fukunaga
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing slurry composition
- Patent number 12,187,919
- Issue date Jan 7, 2025
- KCTECH Co., Ltd.
- Jin Sook Hwang
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,191,191
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Min-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of helical chamfer machining silicon wafer
- Patent number 12,191,152
- Issue date Jan 7, 2025
- Sumco Corporation
- Kentarou Ishida
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing method and substrate processing system
- Patent number 12,191,149
- Issue date Jan 7, 2025
- Tokyo Electron Limited
- Hayato Tanoue
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of transferring semiconductor wafer to polishing apparatus a...
- Patent number 12,179,308
- Issue date Dec 31, 2024
- Sumco Corporation
- Ryoya Terakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated aligned stealth laser for wafer edge trimming process
- Patent number 12,183,571
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Tung Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Film-thickness measuring method, method of detecting notch portion,...
- Patent number 12,183,642
- Issue date Dec 31, 2024
- Ebara Corporation
- Osamu Nabeya
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER BACKGRINDING
- Publication number 20250073845
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- GAIL EDSELLE REYES
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR COMPONENTS FROM A WAFER USING A...
- Publication number 20250079224
- Publication date Mar 6, 2025
- ROBERT BOSCH GmbH
- Bernhard Polzinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250079163
- Publication date Mar 6, 2025
- SK HYNIX INC.
- Sung Kun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Carbide Epitaxy
- Publication number 20250079165
- Publication date Mar 6, 2025
- ThinSiC Inc.
- Tirunelveli Subramaniam Ravi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED STEALTH LASER FOR WAFER EDGE TRIMMING PROCESS
- Publication number 20250079150
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Tung Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP SCALE SEMICONDUCTOR PACKAGE HAVING BACK SIDE METAL LAYER AND R...
- Publication number 20250069973
- Publication date Feb 27, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING HIGH METAL BUMPS AND ULTRA-THIN SUBSTR...
- Publication number 20250070069
- Publication date Feb 27, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Lin Lv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLLOIDAL SILICA AND PRODUCTION METHOD THEREFOR
- Publication number 20250059050
- Publication date Feb 20, 2025
- FUSO CHEMICAL CO., LTD.
- Chiharu Nakano
- C01 - INORGANIC CHEMISTRY
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD OF WAFER THINNING
- Publication number 20250062114
- Publication date Feb 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR RING FRAME CLEANING AND INSPECTION
- Publication number 20250062153
- Publication date Feb 20, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Chien-Fa LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JET ABLATION DIE SINGULATION SYSTEMS AND RELATED METHODS
- Publication number 20250062162
- Publication date Feb 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR COMPONENTS FROM A WAFER WITH SEL...
- Publication number 20250054746
- Publication date Feb 13, 2025
- ROBERT BOSCH GmbH
- Bernhard Polzinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING DISASSEMBLABLE SUBSTRATES
- Publication number 20250054762
- Publication date Feb 13, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Thierry SALVETAT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WAFER-ATTACHED STRUCTURE
- Publication number 20250046657
- Publication date Feb 6, 2025
- ROHM CO., LTD.
- Masatoshi AKETA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS WITH IMPLANTED ALIGNMENT MARK AND METHODS OF MANUFACTURIN...
- Publication number 20250046730
- Publication date Feb 6, 2025
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS WITH THINNING-BASED ALIGNMENT MARK AND METHODS OF MANUFAC...
- Publication number 20250046731
- Publication date Feb 6, 2025
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING WAFER
- Publication number 20250046624
- Publication date Feb 6, 2025
- Disco Corporation
- Akira MIZUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046747
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Junyun KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE, SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACT...
- Publication number 20250038062
- Publication date Jan 30, 2025
- Enkris Semiconductor (Wuxi), Ltd.
- Kai CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR SEPARATING SEMICONDUCTOR DEVICES USING SINGULATION GROO...
- Publication number 20250029878
- Publication date Jan 23, 2025
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP SLURRIES
- Publication number 20250026961
- Publication date Jan 23, 2025
- FUJIMI INCORPORATED
- Jimmy Granstrom
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250022809
- Publication date Jan 16, 2025
- Siliconware Precision Industries Co., Ltd.
- Wen-Jung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET DATA CORRECTION METHOD AND SEMICONDUCTOR DEVICE MANUFACTURIN...
- Publication number 20250022713
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Joongsuk Oh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR PROTECTING ACTIVE LAYERS OF ELECTRONIC CHIPS
- Publication number 20250014912
- Publication date Jan 9, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Emilie BOURJOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR STACKING INTEGRATED CIRCUIT WAFERS AND DIES
- Publication number 20250015045
- Publication date Jan 9, 2025
- TOKYO ELECTRON LIMITED
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MARKING SEMICONDUCTOR CHIP, METHOD FOR MANUFACTURING SEM...
- Publication number 20250015013
- Publication date Jan 9, 2025
- Mitsubishi Electric Corporation
- Hiroto MATSUBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STACK STRUCTURE WITH ULTRA T...
- Publication number 20250014942
- Publication date Jan 9, 2025
- Nexthin Technology
- Tzu-wei CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING METHOD FOR GALLIUM NITRIDE WAFER
- Publication number 20250006502
- Publication date Jan 2, 2025
- Disco Corporation
- Satori KINDAICHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-WAFER FABRICATION LASER DICING
- Publication number 20250006501
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Hao ZHANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REMOVING CONDUCTIVE MATERIAL FROM A PEDESTAL OF A SEMICONDUCTOR LID...
- Publication number 20250006496
- Publication date Jan 2, 2025
- ADVANCED MICRO DEVICES, INC.
- CHIA CHUN MIAO
- H01 - BASIC ELECTRIC ELEMENTS

Mechanical treatment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Polishing slurry composition

Slurry and polishing method

Semiconductor structure and method for manufacturing semiconductor...

Method for stripping gallium nitride substrate

Dicing method for stacked semiconductor devices

Substrate transporter and substrate processing apparatus including...

Method for manufacturing SiC substrate

Substrate processing apparatus and substrate processing method

Die cleaning systems and related methods

Substrate processing system and substrate processing method

Element chip manufacturing method

Semiconductor device and method of forming micro interconnect struc...

Bonding to alignment marks with dummy alignment marks

Indium phosphide substrate

Processing method of wafer, protective sheet, and protective sheet...

Non-contact apparatus for measuring wafer thickness

Microreplicated polishing surface with enhanced co-planarity

Backside ohmic contacts for semiconductor devices

Solid body and multi-component arrangement

Substrate processing apparatus and substrate processing method

Laser processing method, semiconductor member manufacturing method,...

Wafer manufacturing method and laminated device chip manufacturing...

Substrate processing method and substrate processing apparatus

Polishing slurry composition

Semiconductor structure and manufacturing method thereof

Method of helical chamfer machining silicon wafer

Substrate processing method and substrate processing system

Method of transferring semiconductor wafer to polishing apparatus a...

Integrated aligned stealth laser for wafer edge trimming process

Film-thickness measuring method, method of detecting notch portion,...

Patents Applicationslast 30 patents

WAFER BACKGRINDING

METHOD FOR PRODUCING SEMICONDUCTOR COMPONENTS FROM A WAFER USING A...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Silicon Carbide Epitaxy

INTEGRATED STEALTH LASER FOR WAFER EDGE TRIMMING PROCESS

CHIP SCALE SEMICONDUCTOR PACKAGE HAVING BACK SIDE METAL LAYER AND R...

SEMICONDUCTOR PACKAGE HAVING HIGH METAL BUMPS AND ULTRA-THIN SUBSTR...

COLLOIDAL SILICA AND PRODUCTION METHOD THEREFOR

SEMICONDUCTOR WAFER AND METHOD OF WAFER THINNING

SYSTEM AND METHOD FOR RING FRAME CLEANING AND INSPECTION

JET ABLATION DIE SINGULATION SYSTEMS AND RELATED METHODS

METHOD FOR PRODUCING SEMICONDUCTOR COMPONENTS FROM A WAFER WITH SEL...

METHOD FOR MANUFACTURING DISASSEMBLABLE SUBSTRATES

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WAFER-ATTACHED STRUCTURE

APPARATUS WITH IMPLANTED ALIGNMENT MARK AND METHODS OF MANUFACTURIN...

APPARATUS WITH THINNING-BASED ALIGNMENT MARK AND METHODS OF MANUFAC...

METHOD OF PROCESSING WAFER

SEMICONDUCTOR PACKAGE

SUBSTRATE STRUCTURE, SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACT...

METHODS FOR SEPARATING SEMICONDUCTOR DEVICES USING SINGULATION GROO...

CMP SLURRIES

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

OFFSET DATA CORRECTION METHOD AND SEMICONDUCTOR DEVICE MANUFACTURIN...

METHOD FOR PROTECTING ACTIVE LAYERS OF ELECTRONIC CHIPS

METHOD FOR STACKING INTEGRATED CIRCUIT WAFERS AND DIES

METHOD FOR MARKING SEMICONDUCTOR CHIP, METHOD FOR MANUFACTURING SEM...

METHOD FOR MANUFACTURING SEMICONDUCTOR STACK STRUCTURE WITH ULTRA T...

POLISHING METHOD FOR GALLIUM NITRIDE WAFER

PRE-WAFER FABRICATION LASER DICING

REMOVING CONDUCTIVE MATERIAL FROM A PEDESTAL OF A SEMICONDUCTOR LID...