Mechanical treatment

Industry

CPC
H01L21/304

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/304Mechanical treatment

Industries

Patents Grantslast 30 patents

Information Patent Grant
Polishing composition
- Patent number 12,146,077
- Issue date Nov 19, 2024
- FUJIMI INCORPORATED
- Yasuaki Ito
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Jet ablation die singulation systems and related methods
- Patent number 12,148,665
- Issue date Nov 19, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and wafer-attached structure
- Patent number 12,148,667
- Issue date Nov 19, 2024
- Rohm Co., Ltd.
- Masatoshi Aketa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 12,142,483
- Issue date Nov 12, 2024
- Tokyo Electron Limited
- Yoshihiro Kawaguchi
- B24 - GRINDING POLISHING
Information Patent Grant
Technique for training neural network for use in in-situ monitoring...
- Patent number 12,136,574
- Issue date Nov 5, 2024
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus
- Patent number 12,128,523
- Issue date Oct 29, 2024
- Ebara Corporation
- Makoto Fukushima
- B24 - GRINDING POLISHING
Information Patent Grant
Die on die bonding structure
- Patent number 12,125,819
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for grinding wafer and wafer failure analysis method
- Patent number 12,125,752
- Issue date Oct 22, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jiabao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive sheet
- Patent number 12,122,947
- Issue date Oct 22, 2024
- Nitto Denko Corporation
- Shusaku Ueno
- B24 - GRINDING POLISHING
Information Patent Grant
Methods of fabricating the same die stack structure and semiconduct...
- Patent number 12,119,328
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure
- Patent number 12,119,229
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,119,324
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kung-Chen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dies and methods for forming bonded structures
- Patent number 12,113,056
- Issue date Oct 8, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing system
- Patent number 12,112,958
- Issue date Oct 8, 2024
- Highlight Tech Corp.
- Chwung-Shan Kou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method of wafer
- Patent number 12,106,966
- Issue date Oct 1, 2024
- Disco Corporation
- Masaru Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer producing method
- Patent number 12,106,967
- Issue date Oct 1, 2024
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Slurry, screening method, and polishing method
- Patent number 12,104,112
- Issue date Oct 1, 2024
- Resonac Corporation
- Satoyuki Nomura
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Polishing liquid and chemical mechanical polishing method
- Patent number 12,098,301
- Issue date Sep 24, 2024
- FUJIFILM Corporation
- Tetsuya Kamimura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for forming a crack in an edge region of a donor substrate
- Patent number 12,097,641
- Issue date Sep 24, 2024
- Siltectra GmbH
- Marko David Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid chemical for forming water-repellent protective film, method...
- Patent number 12,098,319
- Issue date Sep 24, 2024
- Central Glass Company, Limited
- Yuzo Okumura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wafer processing method and machine
- Patent number 12,100,620
- Issue date Sep 24, 2024
- Disco Corporation
- Yoshinobu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ruthenium-based liner for a copper interconnect
- Patent number 12,094,770
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Min Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for dissolving abrasive particles and cleaning method u...
- Patent number 12,091,636
- Issue date Sep 17, 2024
- KCTECH CO., LTD.
- Kyong Jin Jung
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Chip manufacturing method
- Patent number 12,087,630
- Issue date Sep 10, 2024
- Disco Corporation
- Kazuki Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective wafer grooving structure for wafer thinning and methods...
- Patent number 12,087,756
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wafer and method of manufacturing stacked d...
- Patent number 12,087,589
- Issue date Sep 10, 2024
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 12,087,588
- Issue date Sep 10, 2024
- Tokyo Electron Limited
- Hirotoshi Mori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming semiconductor die having edge with multiple grad...
- Patent number 12,087,618
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP slurry composition for polishing tungsten pattern wafer and met...
- Patent number 12,077,681
- Issue date Sep 3, 2024
- Samsung SDI Co., Ltd.
- Ji Ho Lee
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
RUTHENIUM-BASED LINER FOR A COPPER INTERCONNECT
- Publication number 20240387256
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Min LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20240387197
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SiC CRYSTAL SUBSTRATE, METHOD OF MANUFACTURING SiC CRYSTAL SUBSTRAT...
- Publication number 20240387640
- Publication date Nov 21, 2024
- Sumitomo Electric Industries, Ltd.
- Issei SATOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ON DIE BONDING STRUCTURE
- Publication number 20240387452
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON FRAGMENT DEFECT REDUCTION IN GRINDING PROCESS
- Publication number 20240387312
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Cheng Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE CLEAN SYSTEM AND METHOD
- Publication number 20240383105
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Yi Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387242
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- MIN-YING TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20240379402
- Publication date Nov 14, 2024
- Disco Corporation
- Tomoharu TAKITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DICING DEVICES AND METHODS OF WAFER DICING
- Publication number 20240375212
- Publication date Nov 14, 2024
- Yangtze Memory Technologies Co., Ltd.
- Wei Xie
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF
- Publication number 20240379369
- Publication date Nov 14, 2024
- Yangtze Memory Technologies Co., Ltd.
- Qingyi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20240379370
- Publication date Nov 14, 2024
- TOKYO ELECTRON LIMITED
- Yoshihiro KAWAGUCHI
- B24 - GRINDING POLISHING
Information Patent Application
BACK GRINDING ADHESIVE FILM AND METHOD FOR MANUFACTURING ELECTRONIC...
- Publication number 20240379403
- Publication date Nov 14, 2024
- MITSUI CHEMICALS TOHCELLO, INC.
- Hiroto YASUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED WAFER STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240371625
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chen CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20240371647
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- YU-HSIANG HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING APPARATUS AND PROCESSING METHOD
- Publication number 20240367266
- Publication date Nov 7, 2024
- TOKYO ELECTRON LIMITED
- Hayato TANOUE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240371821
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kung-Chen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS CONTROL METHOD FOR PATTERN WAFER INDEX POLISHING
- Publication number 20240371646
- Publication date Nov 7, 2024
- Applied Materials, Inc.
- Jimin ZHANG
- B24 - GRINDING POLISHING
Information Patent Application
CHIP STACK AND FABRICATION METHOD
- Publication number 20240363489
- Publication date Oct 31, 2024
- Yibu Semiconductor Co., Ltd.
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE HAVING EDGE WITH MULTIPLE GRADIENTS
- Publication number 20240363398
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING EPITAXIAL LAYER AND RESPECTIVE SEMICONDUCTOR ST...
- Publication number 20240363416
- Publication date Oct 31, 2024
- MICLEDI MICRODISPLAYS BV
- Soeren STEUDEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE WAFER GROOVING STRUCTURE FOR WAFER THINNING AND METHODS...
- Publication number 20240363613
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Ming WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
- Publication number 20240355627
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shang-Yu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP PARTITION POWER DELIVERY WITH DEEP TRENCH CAPACITOR
- Publication number 20240355799
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20240355628
- Publication date Oct 24, 2024
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Fu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM THICKNESS MEASUREMENT DEVICE, FILM THICKNESS MEASUREMENT METHO...
- Publication number 20240353344
- Publication date Oct 24, 2024
- EBARA CORPORATION
- Masaki KINOSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STACKING METHOD
- Publication number 20240355684
- Publication date Oct 24, 2024
- Powerchip Semiconductor Manufacturing Corporation
- Chih Feng Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20240349518
- Publication date Oct 17, 2024
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATED SEMICONDUCTOR WAFER SAMPLE PRE-PROCESSING SYSTEM
- Publication number 20240347385
- Publication date Oct 17, 2024
- PAMTEK Co., Ltd.
- Jae Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE
- Publication number 20240347512
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CHIPS
- Publication number 20240342835
- Publication date Oct 17, 2024
- Disco Corporation
- Hayato IGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Mechanical treatment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Polishing composition

Jet ablation die singulation systems and related methods

Semiconductor device manufacturing method and wafer-attached structure

Substrate processing apparatus and substrate processing method

Technique for training neural network for use in in-situ monitoring...

Polishing apparatus

Die on die bonding structure

Method for grinding wafer and wafer failure analysis method

Adhesive sheet

Methods of fabricating the same die stack structure and semiconduct...

Through-substrate via structure and method of manufacture

Method of manufacturing semiconductor structure

Package structure

Stacked dies and methods for forming bonded structures

Wafer processing system

Processing method of wafer

Wafer producing method

Slurry, screening method, and polishing method

Polishing liquid and chemical mechanical polishing method

Method for forming a crack in an edge region of a donor substrate

Liquid chemical for forming water-repellent protective film, method...

Wafer processing method and machine

Ruthenium-based liner for a copper interconnect

Composition for dissolving abrasive particles and cleaning method u...

Chip manufacturing method

Protective wafer grooving structure for wafer thinning and methods...

Method of manufacturing wafer and method of manufacturing stacked d...

Substrate processing apparatus and substrate processing method

Method for forming semiconductor die having edge with multiple grad...

CMP slurry composition for polishing tungsten pattern wafer and met...

Patents Applicationslast 30 patents

RUTHENIUM-BASED LINER FOR A COPPER INTERCONNECT

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

SiC CRYSTAL SUBSTRATE, METHOD OF MANUFACTURING SiC CRYSTAL SUBSTRAT...

DIE ON DIE BONDING STRUCTURE

SILICON FRAGMENT DEFECT REDUCTION IN GRINDING PROCESS

SURFACE CLEAN SYSTEM AND METHOD

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

WAFER PROCESSING METHOD

WAFER DICING DEVICES AND METHODS OF WAFER DICING

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF

SUBSTRATE PROCESSING METHOD

BACK GRINDING ADHESIVE FILM AND METHOD FOR MANUFACTURING ELECTRONIC...

STACKED WAFER STRUCTURE AND METHOD FOR FORMING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

PROCESSING APPARATUS AND PROCESSING METHOD

PACKAGE STRUCTURE

PROCESS CONTROL METHOD FOR PATTERN WAFER INDEX POLISHING

CHIP STACK AND FABRICATION METHOD

SEMICONDUCTOR DIE HAVING EDGE WITH MULTIPLE GRADIENTS

METHOD FOR REMOVING EPITAXIAL LAYER AND RESPECTIVE SEMICONDUCTOR ST...

PROTECTIVE WAFER GROOVING STRUCTURE FOR WAFER THINNING AND METHODS...

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

DEEP PARTITION POWER DELIVERY WITH DEEP TRENCH CAPACITOR

WAFER PROCESSING METHOD

FILM THICKNESS MEASUREMENT DEVICE, FILM THICKNESS MEASUREMENT METHO...

WAFER STACKING METHOD

SEMICONDUCTOR DEVICE STRUCTURE

AUTOMATED SEMICONDUCTOR WAFER SAMPLE PRE-PROCESSING SYSTEM

PACKAGE

METHOD FOR MANUFACTURING CHIPS