Mechanical treatment

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CPC
H01L2224/03602

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/03602Mechanical treatment

Industries

Patents Grantslast 30 patents

Information Patent Grant
Flat metal features for microelectronics applications
- Patent number 11,908,739
- Issue date Feb 20, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,798,905
- Issue date Oct 24, 2023
- Lapis Semiconductor Co., Ltd.
- Takashi Shimada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming same
- Patent number 11,728,296
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improving wire bonding strength of an image sensor
- Patent number 11,133,275
- Issue date Sep 28, 2021
- Semiconductor Manufacturing International (Beijing) Corporation
- Yunlong Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat metal features for microelectronics applications
- Patent number 10,840,135
- Issue date Nov 17, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming same
- Patent number 10,811,374
- Issue date Oct 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated circuit and method of manufacturing th...
- Patent number 10,790,248
- Issue date Sep 29, 2020
- United Microelectronics Corp.
- Chun-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrathin layer for forming a capacitive interface between joined i...
- Patent number 10,600,760
- Issue date Mar 24, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat metal features for microelectronics applications
- Patent number 10,446,441
- Issue date Oct 15, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging process
- Patent number 10,424,573
- Issue date Sep 24, 2019
- DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTD
- Beng Beng Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure and manufacturing method thereof
- Patent number 10,224,300
- Issue date Mar 5, 2019
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming same
- Patent number 10,157,866
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having gaps within the conductive parts
- Patent number 10,090,351
- Issue date Oct 2, 2018
- TOSHIBA MEMORY CORPORATION
- Hiroaki Ashidate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device package comprising photo sensitive fill between a...
- Patent number 10,037,941
- Issue date Jul 31, 2018
- QUALCOMM Incorporated
- Vladimir Noveski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a layer structure having partially sealed p...
- Patent number 9,929,111
- Issue date Mar 27, 2018
- Infineon Technologies AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and manufacturing method for the...
- Patent number 9,892,988
- Issue date Feb 13, 2018
- Dawning Leading Technology Inc.
- Yu-Shan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus, solid state imaging device, imaging appara...
- Patent number 9,881,962
- Issue date Jan 30, 2018
- Sony Corporation
- Hidetsugu Otani
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Final passivation for wafer level warpage and ULK stress reduction
- Patent number 9,754,905
- Issue date Sep 5, 2017
- International Business Machines Corporation
- Ekta Misra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a low-adhesive bond substrate pair
- Patent number 9,679,867
- Issue date Jun 13, 2017
- Kabushiki Kaisha Toshiba
- Hiroaki Ashidate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming same
- Patent number 9,679,859
- Issue date Jun 13, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding metallic contact areas with solution of a sacrif...
- Patent number 9,640,510
- Issue date May 2, 2017
- EV Group E. Thallner GmbH
- Bernhard Rebhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plug via formation with grid features in the passivation layer
- Patent number 9,633,962
- Issue date Apr 25, 2017
- GLOBALFOUNDRIES Inc.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer to wafer bonding process and structures
- Patent number 9,613,926
- Issue date Apr 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device package with organic interposer
- Patent number 9,401,345
- Issue date Jul 26, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant interconnects in wafers
- Patent number 9,224,649
- Issue date Dec 29, 2015
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 9,196,505
- Issue date Nov 24, 2015
- Samsung Electronics Co., Ltd.
- Un-Byoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structure and method for forming the same
- Patent number 9,159,685
- Issue date Oct 13, 2015
- ChipMOS Technologies Inc.
- Geng-Shin Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced WLP for superior temp cycling, drop test and high current...
- Patent number 9,099,345
- Issue date Aug 4, 2015
- Maxim Integrated Products, Inc.
- Rey Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structure and method for forming the same
- Patent number 8,872,336
- Issue date Oct 28, 2014
- ChipMOS Technologies Inc.
- Geng-Shin Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic device by reducing thickness...
- Patent number 8,815,651
- Issue date Aug 26, 2014
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE WITH HIGHER BEARING CAPACITY IN WIRE BONDING
- Publication number 20230395538
- Publication date Dec 7, 2023
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR CHIP
- Publication number 20230114550
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- Yongbum KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220102300
- Publication date Mar 31, 2022
- LAPIS SEMICONDUCTOR CO., LTD.
- Takashi SHIMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming Same
- Publication number 20210050316
- Publication date Feb 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING TH...
- Publication number 20200235063
- Publication date Jul 23, 2020
- United Microelectronics Corp.
- Chun-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING PROCESS
- Publication number 20190304961
- Publication date Oct 3, 2019
- Delta Electronics Int'l (Singapore) Pte Ltd
- Beng Beng Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming Same
- Publication number 20180145046
- Publication date May 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINAL PASSIVATION FOR WAFER LEVEL WARPAGE AND ULK STRESS REDUCTION
- Publication number 20180108626
- Publication date Apr 19, 2018
- International Business Machines Corporation
- Ekta Misra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHEET MOLDING PROCESS FOR WAFER LEVEL PACKAGING
- Publication number 20170372998
- Publication date Dec 28, 2017
- Yenhao Benjamin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming Same
- Publication number 20170271287
- Publication date Sep 21, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20170243910
- Publication date Aug 24, 2017
- KABUSHIKI KAISHA TOSHIBA
- Hiroaki ASHIDATE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A LAYER STRUCTURE HAVING PARTIALLY SEALED P...
- Publication number 20170194272
- Publication date Jul 6, 2017
- INFINEON TECHNOLOGIES AG
- Martin MISCHITZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH ORGANIC INTERPOSER
- Publication number 20160064356
- Publication date Mar 3, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PARTS AND METHOD FOR MANUFACTURING THE SAME, CIRCUIT ASSEMBLY...
- Publication number 20150243612
- Publication date Aug 27, 2015
- Rohm Co., Ltd.
- Hiroki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20140353820
- Publication date Dec 4, 2014
- Samsung Electronics Co., Ltd.
- Sung-Hun Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT INTERCONNECTS IN WAFERS
- Publication number 20140342503
- Publication date Nov 20, 2014
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT INTERCONNECTS IN WAFERS
- Publication number 20140099754
- Publication date Apr 10, 2014
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20130260551
- Publication date Oct 3, 2013
- Samsung Electronics Co., Ltd.
- Un-Byoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE
- Publication number 20130168870
- Publication date Jul 4, 2013
- INFINEON TECHNOLOGIES AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20130127047
- Publication date May 23, 2013
- CHIPMOS TECHNOLOGIES INC.
- Geng-Shin SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED WLP FOR SUPERIOR TEMP CYCLING, DROP TEST AND HIGH CURRENT...
- Publication number 20120326308
- Publication date Dec 27, 2012
- Maxim Integrated Products, Inc.
- REY ALVARADO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming the Same
- Publication number 20120153498
- Publication date Jun 21, 2012
- Un-Byoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT INTERCONNECTS IN WAFERS
- Publication number 20120146210
- Publication date Jun 14, 2012
- Tessera Research LLC
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED WLP FOR SUPERIOR TEMP CYCLING, DROP TEST AND HIGH CURRENT...
- Publication number 20110227219
- Publication date Sep 22, 2011
- MAXIM INTEGRATED PRODUCTS, INC.
- REY ALVARADO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A SEMICONDUCTOR DEVICE INCLUDING A DIFFUSION BAR...
- Publication number 20080274610
- Publication date Nov 6, 2008
- Samsung Electronics, Co., Ltd.
- Kyung-In Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to plate C4 to copper stud
- Publication number 20010032787
- Publication date Oct 25, 2001
- Cyprian E. Uzoh
- H01 - BASIC ELECTRIC ELEMENTS

Mechanical treatment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Flat metal features for microelectronics applications

Semiconductor device and method for manufacturing semiconductor device

Interconnect structure and method of forming same

Method for improving wire bonding strength of an image sensor

Flat metal features for microelectronics applications

Interconnect structure and method of forming same

Three-dimensional integrated circuit and method of manufacturing th...

Ultrathin layer for forming a capacitive interface between joined i...

Flat metal features for microelectronics applications

Packaging process

Pad structure and manufacturing method thereof

Interconnect structure and method of forming same

Semiconductor device having gaps within the conductive parts

Integrated device package comprising photo sensitive fill between a...

Method of manufacturing a layer structure having partially sealed p...

Semiconductor packaging structure and manufacturing method for the...

Semiconductor apparatus, solid state imaging device, imaging appara...

Final passivation for wafer level warpage and ULK stress reduction

Semiconductor device having a low-adhesive bond substrate pair

Interconnect structure and method of forming same

Method for bonding metallic contact areas with solution of a sacrif...

Plug via formation with grid features in the passivation layer

Wafer to wafer bonding process and structures

Semiconductor device package with organic interposer

Compliant interconnects in wafers

Semiconductor device and method of forming the same

Conductive structure and method for forming the same

Enhanced WLP for superior temp cycling, drop test and high current...

Conductive structure and method for forming the same

Method for manufacturing an electronic device by reducing thickness...

Patents Applicationslast 30 patents

CHIP PACKAGE WITH HIGHER BEARING CAPACITY IN WIRE BONDING

MANUFACTURING METHOD OF SEMICONDUCTOR CHIP

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Interconnect Structure and Method of Forming Same

THREE-DIMENSIONAL INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING TH...

PACKAGING PROCESS

Interconnect Structure and Method of Forming Same

FINAL PASSIVATION FOR WAFER LEVEL WARPAGE AND ULK STRESS REDUCTION

SHEET MOLDING PROCESS FOR WAFER LEVEL PACKAGING

Interconnect Structure and Method of Forming Same

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING A LAYER STRUCTURE HAVING PARTIALLY SEALED P...

SEMICONDUCTOR DEVICE PACKAGE WITH ORGANIC INTERPOSER

CHIP PARTS AND METHOD FOR MANUFACTURING THE SAME, CIRCUIT ASSEMBLY...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

COMPLIANT INTERCONNECTS IN WAFERS

COMPLIANT INTERCONNECTS IN WAFERS

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

DEVICE AND METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE

CONDUCTIVE STRUCTURE AND METHOD FOR FORMING THE SAME

ENHANCED WLP FOR SUPERIOR TEMP CYCLING, DROP TEST AND HIGH CURRENT...

Semiconductor Device and Method of Forming the Same

COMPLIANT INTERCONNECTS IN WAFERS

ENHANCED WLP FOR SUPERIOR TEMP CYCLING, DROP TEST AND HIGH CURRENT...

METHODS OF FORMING A SEMICONDUCTOR DEVICE INCLUDING A DIFFUSION BAR...

Method to plate C4 to copper stud