Mechanical treatment

Industry

CPC
H01L21/463

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/463Mechanical treatment

Industries

Patents Grantslast 30 patents

Information Patent Grant
Forming passivation stack having etch stop layer
- Patent number 12,142,481
- Issue date Nov 12, 2024
- Polar Semiconductor, LLC
- Roger Carroll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,142,485
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding method and semiconductor structure obtained by the same
- Patent number 11,978,641
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of patterning two-dimensional material layer on substrate, a...
- Patent number 11,961,898
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Van Luan Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the semiconductor...
- Patent number 11,776,966
- Issue date Oct 3, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Ryota Hodo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preparation method for accurate pattern of integrated circuit
- Patent number 11,699,594
- Issue date Jul 11, 2023
- Etownip Microelectronics (Beijing) Co., LTD.
- Hanming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and manufacturing method thereof
- Patent number 11,699,638
- Issue date Jul 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package comprising plurality of bumps and fabricating...
- Patent number 11,670,611
- Issue date Jun 6, 2023
- Powertech Technology Inc.
- Shang-Yu Chang-Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,594,420
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spin coating process and apparatus with ultrasonic viscosity control
- Patent number 11,387,099
- Issue date Jul 12, 2022
- SanDisk Technologies LLC
- Yutaka Ishiguro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, assembly structure and method for manufacturing...
- Patent number 11,282,772
- Issue date Mar 22, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and manufacturing method thereof
- Patent number 11,227,812
- Issue date Jan 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Element chip manufacturing method
- Patent number 11,189,480
- Issue date Nov 30, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shogo Okita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the semiconductor...
- Patent number 11,101,293
- Issue date Aug 24, 2021
- Semiconductor Energy Laboratory Co., Ltd.
- Ryota Hodo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer grinding apparatus and wafer grinding method
- Patent number 11,101,150
- Issue date Aug 24, 2021
- Mitsubishi Electric Corporation
- Naoyuki Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor substrate
- Patent number 11,081,344
- Issue date Aug 3, 2021
- FUJIFILM Business Innovation Corp.
- Atsushi Fukugawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for polishing semiconductor substrates that adjust for pad-...
- Patent number 11,081,359
- Issue date Aug 3, 2021
- GlobalWafers Co., Ltd.
- Ichiro Yoshimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated solder TSV insertion interconnect
- Patent number 11,018,056
- Issue date May 25, 2021
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device using an adhesive layer
- Patent number 10,991,597
- Issue date Apr 27, 2021
- Samsung Electronics Co, Ltd.
- Kyung-Hak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for contacting a buried interconnect rail of an integrated c...
- Patent number 10,985,057
- Issue date Apr 20, 2021
- Imec VZW
- Anne Jourdain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing semiconductor wafers using a grinding wheel
- Patent number 10,974,365
- Issue date Apr 13, 2021
- Infineon Technologies AG
- Rudolf Lehner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite particles, method of refining and use thereof
- Patent number 10,894,906
- Issue date Jan 19, 2021
- VERSUM MATERIALS US, LLC
- Hongjun Zhou
- B24 - GRINDING POLISHING
Information Patent Grant
Planarization and flip-chip fabrication process of fine-line-geomet...
- Patent number 10,840,106
- Issue date Nov 17, 2020
- OEPic Semiconductors, Inc.
- Yi-Ching Pao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plane polishing method of silicon wafer and processing method of si...
- Patent number 10,818,511
- Issue date Oct 27, 2020
- AAC Acoustic Technologies (Shenzhen) Co., Ltd.
- Lieng Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device fabrication method and semiconductor device
- Patent number 10,811,512
- Issue date Oct 20, 2020
- Lapis Semiconductor Co., Ltd.
- Masataka Yoshinari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor devices
- Patent number 10,710,210
- Issue date Jul 14, 2020
- Infineon Technologies AG
- Rudolf Lehner
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor device and method for manufacturing the semiconductor...
- Patent number 10,665,613
- Issue date May 26, 2020
- Semiconductor Energy Laboratory Co., Ltd.
- Ryota Hodo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for dividing substrate along division lines using abrasive m...
- Patent number 10,515,841
- Issue date Dec 24, 2019
- Disco Corporation
- Byeongdeck Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite particles, method of refining and use thereof
- Patent number 10,421,890
- Issue date Sep 24, 2019
- VERSUM MATERIALS US, LLC
- Hongjun Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of a chemical mechanical polishing (CMP) composition for polish...
- Patent number 10,385,236
- Issue date Aug 20, 2019
- BASF SE
- Robert Reichardt
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379374
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A PLURALITY OF ELECTRONIC COMPONENTS
- Publication number 20240321795
- Publication date Sep 26, 2024
- STMicroelectronics International N.V.
- Olivier ORY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATION METHOD OF BONDED SUBSTRATES
- Publication number 20240194492
- Publication date Jun 13, 2024
- SKY TECH INC.
- JUNG-HUA CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND METHOD FOR MANUFACTURING A SUBSTRATE
- Publication number 20240194493
- Publication date Jun 13, 2024
- Advanced Semiconductor Engineering, Inc.
- Yu-Hung YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240055311
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yueh-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER THINNED BY HORIZONTAL STEALTH LASING
- Publication number 20230411169
- Publication date Dec 21, 2023
- Western Digital Technologies, Inc.
- Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE OBTAINED BY THE SAME
- Publication number 20230395392
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei-Yu CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Thinning a Semiconductor Die
- Publication number 20230326906
- Publication date Oct 12, 2023
- Western Digital Technologies, Inc.
- Meiqin Hao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230298973
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
- Publication number 20230290648
- Publication date Sep 14, 2023
- KIOXIA Corporation
- Takashi WATANABE
- B24 - GRINDING POLISHING
Information Patent Application
FORMING PASSIVATION STACK HAVING ETCH STOP LAYER
- Publication number 20230215727
- Publication date Jul 6, 2023
- Polar Semiconductor, LLC
- Roger Carroll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230197464
- Publication date Jun 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTING A SEMICONDUCTOR DIE USING TEMPORARY TEST PADS APPLIED TO CO...
- Publication number 20230120305
- Publication date Apr 20, 2023
- ADVANCED MICRO DEVICES, INC.
- CHIA-HAO CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIVIDING METHOD OF SUBSTRATE
- Publication number 20230065412
- Publication date Mar 2, 2023
- Disco Corporation
- Jaeyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230063204
- Publication date Mar 2, 2023
- KIOXIA Corporation
- Eiji TAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20230069568
- Publication date Mar 2, 2023
- Fuji Electric Co., Ltd.
- Tsutomu KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230069214
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR MINIMIZING VOIDS FOR CHIP ON WAFER COMPON...
- Publication number 20230045597
- Publication date Feb 9, 2023
- Applied Materials, Inc.
- Ying WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD
- Publication number 20230013223
- Publication date Jan 19, 2023
- SATO HOLDINGS KABUSHIKI KAISHA
- Yoshimitsu MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELEMENT CHIP MANUFACTURING METHOD AND SUBSTRATE PROCESSING METHOD
- Publication number 20220384177
- Publication date Dec 1, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- Hidehiko KARASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE WITH POWER CONNECT...
- Publication number 20220375825
- Publication date Nov 24, 2022
- TZU-WEI CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20220302061
- Publication date Sep 22, 2022
- Powertech Technology Inc.
- Shang-Yu CHANG-CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PATTERNING TWO-DIMENSIONAL MATERIAL LAYER ON SUBSTRATE, A...
- Publication number 20220238692
- Publication date Jul 28, 2022
- Samsung Electronics Co., Ltd.
- Van Luan NGUYEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...
- Publication number 20220157660
- Publication date May 19, 2022
- Disco Corporation
- Youngsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220157707
- Publication date May 19, 2022
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220139807
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREPARATION METHOD FOR ACCURATE PATTERN OF INTEGRATED CIRCUIT
- Publication number 20220051903
- Publication date Feb 17, 2022
- Etownip Microelectronics (Beijing) Co.,LTD.
- Hanming WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM OXIDE SUBSTRATE AND METHOD OF MANUFACTURING GALLIUM OXIDE S...
- Publication number 20220028700
- Publication date Jan 27, 2022
- AGC Inc.
- Yusuke HIRABAYASHI
- C01 - INORGANIC CHEMISTRY
Information Patent Application
CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE
- Publication number 20220028699
- Publication date Jan 27, 2022
- Christian Fachmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS OF MAKING COMPONENTS FOR ELECTRONIC AND OPTICAL DEVICES USI...
- Publication number 20210301381
- Publication date Sep 30, 2021
- Government of the United States, as represented by the Secretary of the Air F...
- Nicholas R. Glavin
- H01 - BASIC ELECTRIC ELEMENTS

Mechanical treatment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Forming passivation stack having etch stop layer

Semiconductor structure and manufacturing method thereof

Wafer bonding method and semiconductor structure obtained by the same

Method of patterning two-dimensional material layer on substrate, a...

Semiconductor device and method for manufacturing the semiconductor...

Preparation method for accurate pattern of integrated circuit

Package and manufacturing method thereof

Semiconductor package comprising plurality of bumps and fabricating...

Semiconductor structure and manufacturing method thereof

Spin coating process and apparatus with ultrasonic viscosity control

Package structure, assembly structure and method for manufacturing...

Package and manufacturing method thereof

Element chip manufacturing method

Semiconductor device and method for manufacturing the semiconductor...

Wafer grinding apparatus and wafer grinding method

Method for manufacturing semiconductor substrate

Methods for polishing semiconductor substrates that adjust for pad-...

Encapsulated solder TSV insertion interconnect

Method of fabricating a semiconductor device using an adhesive layer

Method for contacting a buried interconnect rail of an integrated c...

Method for processing semiconductor wafers using a grinding wheel

Composite particles, method of refining and use thereof

Planarization and flip-chip fabrication process of fine-line-geomet...

Plane polishing method of silicon wafer and processing method of si...

Semiconductor device fabrication method and semiconductor device

Method for forming semiconductor devices

Semiconductor device and method for manufacturing the semiconductor...

Method for dividing substrate along division lines using abrasive m...

Composite particles, method of refining and use thereof

Use of a chemical mechanical polishing (CMP) composition for polish...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING A PLURALITY OF ELECTRONIC COMPONENTS

SEPARATION METHOD OF BONDED SUBSTRATES

SUBSTRATE AND METHOD FOR MANUFACTURING A SUBSTRATE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR WAFER THINNED BY HORIZONTAL STEALTH LASING

WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE OBTAINED BY THE SAME

Method of Thinning a Semiconductor Die

PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...

FORMING PASSIVATION STACK HAVING ETCH STOP LAYER

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

TESTING A SEMICONDUCTOR DIE USING TEMPORARY TEST PADS APPLIED TO CO...

DIVIDING METHOD OF SUBSTRATE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHODS AND APPARATUS FOR MINIMIZING VOIDS FOR CHIP ON WAFER COMPON...

IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD

ELEMENT CHIP MANUFACTURING METHOD AND SUBSTRATE PROCESSING METHOD

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE WITH POWER CONNECT...

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

METHOD OF PATTERNING TWO-DIMENSIONAL MATERIAL LAYER ON SUBSTRATE, A...

WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...

THIN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE AND MANUFACTURING METHOD THEREOF

PREPARATION METHOD FOR ACCURATE PATTERN OF INTEGRATED CIRCUIT

GALLIUM OXIDE SUBSTRATE AND METHOD OF MANUFACTURING GALLIUM OXIDE S...

CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE

PROCESS OF MAKING COMPONENTS FOR ELECTRONIC AND OPTICAL DEVICES USI...