Memory

Industry

CPC
H05K2201/10159

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10159Memory

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor apparatus with inspection terminals
- Patent number 12,171,061
- Issue date Dec 17, 2024
- Seiko Epson Corporation
- Kyosuke Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage system
- Patent number 12,166,320
- Issue date Dec 10, 2024
- Kioxia Corporation
- Kazuyuki Matsuzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board with single rank memory configuration using p...
- Patent number 12,154,891
- Issue date Nov 26, 2024
- GM CRUISE HOLDINGS LLC
- Ajith Sreenilayam
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Micro-OLED display module thermal management
- Patent number 12,127,430
- Issue date Oct 22, 2024
- Meta Platforms Technologies, LLC
- Giti Karimi Moghaddam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate and memory system
- Patent number 12,127,346
- Issue date Oct 22, 2024
- Kioxia Corporation
- Kazuyuki Niitsuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mouth guard having user-notification feature of impact force
- Patent number 12,109,045
- Issue date Oct 8, 2024
- Force Impact Technologies, Inc.
- Anthony M. Gonzales
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device capable of folding motion and sliding motion
- Patent number 12,107,979
- Issue date Oct 1, 2024
- Samsung Electronics Co., Ltd.
- Seungjoon Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Double stub transmission line for suppression of harmonics
- Patent number 12,101,875
- Issue date Sep 24, 2024
- Hewlett Packard Enterprise Development LP
- David P. Kopp
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor memory system
- Patent number 12,094,866
- Issue date Sep 17, 2024
- Kioxia Corporation
- Hayato Masubuchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Solid state drive apparatus and data storage apparatus including th...
- Patent number 12,094,803
- Issue date Sep 17, 2024
- Samsung Electronics Co., Ltd.
- Sungchul Hur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques to control system updates and configuration changes via...
- Patent number 12,081,323
- Issue date Sep 3, 2024
- Intel Corporation
- Murugasamy K. Nachimuthu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and memory system
- Patent number 12,082,340
- Issue date Sep 3, 2024
- Kioxia Corporation
- Yuta Tsubouchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera apparatus and method for reducing latency in plant detection...
- Patent number 12,080,064
- Issue date Sep 3, 2024
- Tartan Aerial Sense Tech Private Limited
- Gunasekaran Srinivasan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-level printed circuit boards and memory modules including the...
- Patent number 12,075,560
- Issue date Aug 27, 2024
- Samsung Electronics Co., Ltd.
- Jong-Hyun Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage device unit
- Patent number 12,069,796
- Issue date Aug 20, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shigehito Morita
- G11 - INFORMATION STORAGE
Information Patent Grant
Module board and memory module including the same
- Patent number 12,063,736
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Wonseop Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Compact memory device having a backup power source
- Patent number 12,062,409
- Issue date Aug 13, 2024
- Pliops Ltd
- Naseem Jamal
- G11 - INFORMATION STORAGE
Information Patent Grant
Technologies for switching network traffic in a data center
- Patent number 12,040,889
- Issue date Jul 16, 2024
- Intel Corporation
- Matthew Adiletta
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Memory system
- Patent number 12,041,719
- Issue date Jul 16, 2024
- Kioxia Corporation
- Gen Watari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabric-mounted components
- Patent number 12,028,982
- Issue date Jul 2, 2024
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor apparatus
- Patent number 12,028,971
- Issue date Jul 2, 2024
- Seiko Epson Corporation
- Kyosuke Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board with stacked passive components
- Patent number 12,022,618
- Issue date Jun 25, 2024
- Western Digital Technologies, Inc.
- Chien Te Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip module
- Patent number 12,022,619
- Issue date Jun 25, 2024
- Samsung Electronics Co., Ltd.
- Jong-Hyun Seok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Using a thermoelectric component to improve memory sub-system perfo...
- Patent number 12,013,734
- Issue date Jun 18, 2024
- Micron Technology, Inc.
- Michael R. Spica
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Pluggable CPU modules with vertical power
- Patent number 12,002,795
- Issue date Jun 4, 2024
- Google LLC
- Houle Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating system in package (SiP) with input/output (IO) board fo...
- Patent number 12,002,793
- Issue date Jun 4, 2024
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor device and methods of making and using the same
- Patent number 12,004,298
- Issue date Jun 4, 2024
- Shinkawa Electric Co., Ltd.
- Kotaro Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods providing high-density memory arrangements with...
- Patent number 11,997,792
- Issue date May 28, 2024
- TORmem Inc.
- Steven White
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally conductive label for circuit
- Patent number 11,997,782
- Issue date May 28, 2024
- Micron Technology, Inc.
- Kaleb A. Wilson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Driver for motors
- Patent number 11,984,773
- Issue date May 14, 2024
- Mitsuba Corporation
- Tomoya Ikariya
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CLOUD COMPUTING AND INTERNET OF THINGS-BASED MONITORING TECHNIQUES...
- Publication number 20240422915
- Publication date Dec 19, 2024
- CDW LLC
- Donald L. Doyle
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
TECHNIQUES FOR A MODULE CONNECTOR DESIGN TO IMPROVE PIN CONNECTION
- Publication number 20240421516
- Publication date Dec 19, 2024
- Intel Corporation
- Xiang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT HARVESTING IN DATA STORAGE DEVICES
- Publication number 20240422938
- Publication date Dec 19, 2024
- Western Digital Technologies, Inc.
- Uthayarajan A/L Rasalingam
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
PRINTED CIRCUIT BOARD WITH ENHANCED STRUCTURAL SUPPORT
- Publication number 20240407080
- Publication date Dec 5, 2024
- Micron Technology, Inc.
- Quang Nguyen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MEMORY SYSTEM
- Publication number 20240405010
- Publication date Dec 5, 2024
- KIOXIA Corporation
- Hayato MASUBUCHI
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRICALLY COUPLING PRINTED CIRCUIT BOARDS USING A SNAP-FIT CONNE...
- Publication number 20240397624
- Publication date Nov 28, 2024
- Western Digital Technologies, Inc.
- Tew Wei Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD UNIT, MEMORY SYSTEM, AND ELECTRONIC DEVICE
- Publication number 20240397627
- Publication date Nov 28, 2024
- KIOXIA Corporation
- Shiro HARASHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE MEMORY MODULE NOTCH AND CONNECTOR-TO-MOTHERBOARD PINS FO...
- Publication number 20240397628
- Publication date Nov 28, 2024
- Intel Corporation
- Landon HANKS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB SPACER
- Publication number 20240373556
- Publication date Nov 7, 2024
- Intel Corporation
- Gabriel Khouri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TECHNIQUES TO CONTROL SYSTEM UPDATES AND CONFIGURATION CHANGES VIA...
- Publication number 20240372792
- Publication date Nov 7, 2024
- Intel Corporation
- MURUGASAMY K. NACHIMUTHU
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
HIGH CAPACITANCE MEMORY DEVICE
- Publication number 20240357745
- Publication date Oct 24, 2024
- INNODISK CORPORATION
- CHIH-CHIEH KAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMORY AND SEMICONDUCTOR PACKAGE
- Publication number 20240355776
- Publication date Oct 24, 2024
- SK HYNIX INC.
- Dong Sop LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING PLURALITY OF PRINTED CIRCUIT BOARDS
- Publication number 20240334588
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Jichul KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARDS INCLUDING DIRECT ROUTING FROM INTEGRATED CIR...
- Publication number 20240334600
- Publication date Oct 3, 2024
- Intel Corporation
- Min Suet Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods Providing High-Density Memory Arrangements with...
- Publication number 20240306305
- Publication date Sep 12, 2024
- TORmem Inc.
- Steven White
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE COMPRISING PRINTED CIRCUIT BOARD STRUCTURE ACCOMM...
- Publication number 20240292571
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Bongkyu MIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC DEVICE PACKAGE ASSEMBLIES INCLUDING STIFFENER DEVIC...
- Publication number 20240292522
- Publication date Aug 29, 2024
- Micron Technology, Inc.
- Prasad Nagavenkata Nune
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pluggable CPU Modules with Vertical Power
- Publication number 20240290763
- Publication date Aug 29, 2024
- Google LLC
- Houle Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOAD REDUCED MEMORY MODULE
- Publication number 20240276639
- Publication date Aug 15, 2024
- Rambus Inc.
- Frederick A. Ware
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
AUTOMATED MEMORY CARD PRESS FIXTURE
- Publication number 20240276693
- Publication date Aug 15, 2024
- Tuong Vinh Ngoc Pham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED DUAL IN-LINE MEMORY MODULE
- Publication number 20240260195
- Publication date Aug 1, 2024
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE INCLUDING PCB EDGE HEAT DISSIPATION
- Publication number 20240260237
- Publication date Aug 1, 2024
- Western Digital Technologies, Inc.
- Wei Hong Tew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOOLLESS COMPRESSION ATTACHED MEMORY MODULE INSTALLATION IN INFORMA...
- Publication number 20240258725
- Publication date Aug 1, 2024
- Dell Products L.P.
- Glenn Chiappe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE INCLUDING STAGGERED SEMICONDUCTOR MEMO...
- Publication number 20240260194
- Publication date Aug 1, 2024
- Western Digital Technologies, Inc.
- Fu Xing Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240260197
- Publication date Aug 1, 2024
- IBIDEN CO., LTD.
- Nobuhisa KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL IN-LINE MEMORY MODULE RETAINER
- Publication number 20240242740
- Publication date Jul 18, 2024
- Intel Corporation
- Phil GENG
- G11 - INFORMATION STORAGE
Information Patent Application
APPARATUSES INCLUDING ONE OR MORE SEMICONDUCTOR DEVICES AND RELATED...
- Publication number 20240224461
- Publication date Jul 4, 2024
- Micron Technology, Inc.
- Michael G. Placke
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING LOOKUP TABLE DECODERS FOR FPGAS
- Publication number 20240222276
- Publication date Jul 4, 2024
- Intel Corporation
- Abhishek Anil SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC DEVICE THEREOF
- Publication number 20240206050
- Publication date Jun 20, 2024
- WUHAN TIANMA MICROELECTRONICS CO., LTD.
- Xuejing XIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20240206074
- Publication date Jun 20, 2024
- KIOXIA Corporation
- Koji UENO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor apparatus with inspection terminals

Storage system

Printed circuit board with single rank memory configuration using p...

Micro-OLED display module thermal management

Substrate and memory system

Mouth guard having user-notification feature of impact force

Electronic device capable of folding motion and sliding motion

Double stub transmission line for suppression of harmonics

Semiconductor memory system

Solid state drive apparatus and data storage apparatus including th...

Techniques to control system updates and configuration changes via...

Semiconductor device and memory system

Camera apparatus and method for reducing latency in plant detection...

Multi-level printed circuit boards and memory modules including the...

Storage device unit

Module board and memory module including the same

Compact memory device having a backup power source

Technologies for switching network traffic in a data center

Memory system

Fabric-mounted components

Semiconductor apparatus

Printed circuit board with stacked passive components

Semiconductor chip module

Using a thermoelectric component to improve memory sub-system perfo...

Pluggable CPU modules with vertical power

Integrating system in package (SiP) with input/output (IO) board fo...

Sensor device and methods of making and using the same

Systems and methods providing high-density memory arrangements with...

Thermally conductive label for circuit

Driver for motors

Patents Applicationslast 30 patents

CLOUD COMPUTING AND INTERNET OF THINGS-BASED MONITORING TECHNIQUES...

TECHNIQUES FOR A MODULE CONNECTOR DESIGN TO IMPROVE PIN CONNECTION

HEAT HARVESTING IN DATA STORAGE DEVICES

PRINTED CIRCUIT BOARD WITH ENHANCED STRUCTURAL SUPPORT

SEMICONDUCTOR MEMORY SYSTEM

ELECTRICALLY COUPLING PRINTED CIRCUIT BOARDS USING A SNAP-FIT CONNE...

BOARD UNIT, MEMORY SYSTEM, AND ELECTRONIC DEVICE

CONDUCTIVE MEMORY MODULE NOTCH AND CONNECTOR-TO-MOTHERBOARD PINS FO...

PCB SPACER

TECHNIQUES TO CONTROL SYSTEM UPDATES AND CONFIGURATION CHANGES VIA...

HIGH CAPACITANCE MEMORY DEVICE

MEMORY AND SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE COMPRISING PLURALITY OF PRINTED CIRCUIT BOARDS

PRINTED CIRCUIT BOARDS INCLUDING DIRECT ROUTING FROM INTEGRATED CIR...

Systems and Methods Providing High-Density Memory Arrangements with...

ELECTRONIC DEVICE COMPRISING PRINTED CIRCUIT BOARD STRUCTURE ACCOMM...

MICROELECTRONIC DEVICE PACKAGE ASSEMBLIES INCLUDING STIFFENER DEVIC...

Pluggable CPU Modules with Vertical Power

LOAD REDUCED MEMORY MODULE

AUTOMATED MEMORY CARD PRESS FIXTURE

EMBEDDED DUAL IN-LINE MEMORY MODULE

SEMICONDUCTOR STORAGE DEVICE INCLUDING PCB EDGE HEAT DISSIPATION

TOOLLESS COMPRESSION ATTACHED MEMORY MODULE INSTALLATION IN INFORMA...

SEMICONDUCTOR STORAGE DEVICE INCLUDING STAGGERED SEMICONDUCTOR MEMO...

WIRING SUBSTRATE

DUAL IN-LINE MEMORY MODULE RETAINER

APPARATUSES INCLUDING ONE OR MORE SEMICONDUCTOR DEVICES AND RELATED...

INTEGRATED CIRCUIT STRUCTURES HAVING LOOKUP TABLE DECODERS FOR FPGAS

CIRCUIT BOARD AND ELECTRONIC DEVICE THEREOF

SEMICONDUCTOR STORAGE DEVICE