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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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H01L2924/1461
MEMS
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Patents Grants
last 30 patents
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Patent Grant
Package structures and method of forming the same
Patent number
11,948,862
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with bonding
Patent number
11,923,230
Issue date
Mar 5, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Grant
Ovenized MEMS
Patent number
11,909,354
Issue date
Feb 20, 2024
SiTime Corporation
Carl Arft
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
3D semiconductor device and structure with memory
Patent number
11,901,210
Issue date
Feb 13, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Adhesive bonding composition and electronic components prepared fro...
Patent number
11,901,331
Issue date
Feb 13, 2024
Immunolight, LLC
Zakaryae Fathi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package
Patent number
11,894,306
Issue date
Feb 6, 2024
Ping-Jung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of controlling the placement of micro-objects
Patent number
11,891,299
Issue date
Feb 6, 2024
Xerox Corporation
Anne Plochowietz
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor device encapsulated by molding material attached to r...
Patent number
11,887,952
Issue date
Jan 30, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
Patent number
11,881,476
Issue date
Jan 23, 2024
Semtech Corporation
Changjun Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with metal layers and a conne...
Patent number
11,881,443
Issue date
Jan 23, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with single-crystal layers
Patent number
11,876,011
Issue date
Jan 16, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
Patent number
11,876,053
Issue date
Jan 16, 2024
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding process with inhibited oxide formation
Patent number
11,869,870
Issue date
Jan 9, 2024
SiTime Corporation
Paul M. Hagelin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate laminated body and method of manufacturing substrate lami...
Patent number
11,859,110
Issue date
Jan 2, 2024
Mitsui Chemicals, Inc.
Jun Kamada
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Method for producing a 3D semiconductor device and structure with m...
Patent number
11,862,503
Issue date
Jan 2, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and measurement device
Patent number
11,854,952
Issue date
Dec 26, 2023
Lapis Semiconductor Co., Ltd.
Toshihisa Sone
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure for heat dissipation
Patent number
11,854,785
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for producing a 3D semiconductor device and structure with...
Patent number
11,854,857
Issue date
Dec 26, 2023
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device with multi-layer contact and system
Patent number
11,842,975
Issue date
Dec 12, 2023
Infineon Technologies AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked dies and methods for forming bonded structures
Patent number
11,837,596
Issue date
Dec 5, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microfabricated ultrasonic transducers and related apparatus and me...
Patent number
11,828,729
Issue date
Nov 28, 2023
BFLY OPERATIONS, INC.
Jonathan M. Rothberg
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
3D semiconductor device and structure with bonding
Patent number
11,830,757
Issue date
Nov 28, 2023
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
Patent number
11,824,008
Issue date
Nov 21, 2023
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Composite structures
Patent number
11,814,284
Issue date
Nov 14, 2023
Cirrus Logic Inc.
Roberto Brioschi
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Sensor
Patent number
11,810,863
Issue date
Nov 7, 2023
TDK TAIWAN CORP.
An-Ping Tseng
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Silicon interposer sandwich structure for ESD, EMC, and EMC shieldi...
Patent number
11,810,893
Issue date
Nov 7, 2023
International Business Machines Corporation
William Emmett Bernier
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density substrate routing in package
Patent number
11,810,884
Issue date
Nov 7, 2023
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3DIC formation with dies bonded to formed RDLs
Patent number
11,810,899
Issue date
Nov 7, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for producing a 3D semiconductor device and structure with...
Patent number
11,804,396
Issue date
Oct 31, 2023
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Grant
Devices and methods related to stack structures including passivati...
Patent number
11,804,460
Issue date
Oct 31, 2023
Skyworks Solutions, Inc.
Jiro Yota
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
Publication number
20240132340
Publication date
Apr 25, 2024
STMicroelectronics (Malta) Ltd.
Roseanne DUCA
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240128179
Publication date
Apr 18, 2024
Unimicron Technology Corp.
Jyun-Hong CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...
Publication number
20240128165
Publication date
Apr 18, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
Publication number
20240120207
Publication date
Apr 11, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Lung-Kai Mao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STIFFENER PACKAGE AND METHOD OF FABRICATING STIFFENER PACKAGE
Publication number
20240120211
Publication date
Apr 11, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Jin Young Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRE BONDS FOR GALVANIC ISOLATION DEVICE
Publication number
20240113155
Publication date
Apr 4, 2024
TEXAS INSTRUMENTS INCORPORATED
Jeffrey Alan West
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
Publication number
20240088087
Publication date
Mar 14, 2024
INFINEON TECHNOLOGIES AG
Alexander HEINRICH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Packages and Methods of Forming the Same
Publication number
20240088093
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROFABRICATED ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND ME...
Publication number
20240044846
Publication date
Feb 8, 2024
BFLY OPERATIONS, INC.
Jonathan M. Rothberg
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240030145
Publication date
Jan 25, 2024
Samsung Electronics Co., Ltd.
Myungsam KANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND DEVICE FOR PRODUCING A SEMICONDUCTOR COMPONENT
Publication number
20230402412
Publication date
Dec 14, 2023
ROBERT BOSCH GmbH
Daniel Monteiro Diniz Reis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED ULTRASONIC TRANSDUCERS
Publication number
20230389897
Publication date
Dec 7, 2023
Exo Imaging, Inc.
Janusz Bryzek
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
STACKED-DIE MEMS RESONATOR
Publication number
20230391611
Publication date
Dec 7, 2023
SiTime Corporation
Pavan Gupta
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
HIGH REGISTRATION PARTICLES-TRANSFERRING SYSTEM
Publication number
20230366093
Publication date
Nov 16, 2023
Xerox Corporation
Yunda Wang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...
Publication number
20230343679
Publication date
Oct 26, 2023
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...
Publication number
20230253296
Publication date
Aug 10, 2023
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME
Publication number
20230238344
Publication date
Jul 27, 2023
Kabushiki Kaisha Toshiba
Tomohiro SAITO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TECHNIQUES TO ENABLE A FLIP CHIP UNDERFILL EXCLUSION ZONE
Publication number
20230207412
Publication date
Jun 29, 2023
Intel Corporation
Ronald SPREITZER
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...
Publication number
20230197573
Publication date
Jun 22, 2023
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE WITH DISSOLVABLE METAL LAYER
Publication number
20230187390
Publication date
Jun 15, 2023
TEXAS INSTRUMENTS INCORPORATED
Sebastian MEIER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED DIE PACKAGE AND METHODS OF FORMING THE SAME
Publication number
20230163103
Publication date
May 25, 2023
Qorvo US, Inc.
Julio C. Costa
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES
Publication number
20230131849
Publication date
Apr 27, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES
Publication number
20230130580
Publication date
Apr 27, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICRO DEVICE TRANSFER HEAD ASSEMBLY
Publication number
20230120136
Publication date
Apr 20, 2023
Apple Inc.
Andreas Bibl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER LEVEL PROCESSING FOR MICROELECTRONIC DEVICE PACKAGE WITH CAVITY
Publication number
20230092132
Publication date
Mar 23, 2023
TEXAS INSTRUMENTS INCORPORATED
Hau Nguyen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SOC PMUT SUITABLE FOR HIGH-DENSITY SYSTEM INTEGRATION, ARRAY CHIP,...
Publication number
20230060728
Publication date
Mar 2, 2023
NANJING SHENGXI XINYING TECHNOLOGY CO., LTD
Hui LI
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE WITH WARPAGE CONTROL USING CAVITY FORMED...
Publication number
20230046645
Publication date
Feb 16, 2023
STMicroelectronics (Malta) Ltd.
Roseanne DUCA
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20230005841
Publication date
Jan 5, 2023
Advanced Semiconductor Engineering, Inc.
Yencheng KUO
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MICRO-ELECTROMECHANICAL SYSTEM PACKAGE HAVING MOVABLE PLATFORM
Publication number
20230002214
Publication date
Jan 5, 2023
PIXART IMAGING INC.
Chih-Ming SUN
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SUPPORT STRUCTURE AND METHOD OF FORMING A SUPPORT STRUCTURE
Publication number
20220388105
Publication date
Dec 8, 2022
INFINEON TECHNOLOGIES AG
Alfons Dehe
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR