Metal-insulator-semiconductors

Industry

CPC
H01L29/94

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier

Current Industry

H01L29/94Metal-insulator-semiconductors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Metal-insulator-metal structure
- Patent number 12,230,566
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact capacitor structure
- Patent number 12,218,257
- Issue date Feb 4, 2025
- Realtek Semiconductor Corporation
- Jian Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip parts
- Patent number 12,218,123
- Issue date Feb 4, 2025
- Rohm Co., Ltd.
- Keisuke Fukae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench pattern for trench capacitor yield improvement
- Patent number 12,205,982
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitor film scheme to reduce substrate warpage
- Patent number 12,199,139
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET MOS capacitor
- Patent number 12,199,193
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device structure and manufacturing method thereof
- Patent number 12,200,943
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei Ting Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitor profile to decrease substrate warpage
- Patent number 12,176,387
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Li Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor cell and structure thereof
- Patent number 12,170,283
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embeddable semiconductor-based capacitor
- Patent number 12,159,945
- Issue date Dec 3, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High capacitance MIM device with self aligned spacer
- Patent number 12,154,939
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing capacitor structure
- Patent number 12,125,642
- Issue date Oct 22, 2024
- NANYA TECHNOLOGY CORPORATION
- Chien-Chung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor trench capacitor structure and manufacturing method t...
- Patent number 12,119,414
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Fu-Chiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing semiconductor...
- Patent number 12,113,100
- Issue date Oct 8, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hongmin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitor including stress-relief voids and methods of...
- Patent number 12,113,099
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Fu-Chiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,100,671
- Issue date Sep 24, 2024
- Murata Manufacturing Co., Ltd.
- Yohei Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor, memory device, and method
- Patent number 12,101,926
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling capacitor circuits
- Patent number 12,101,091
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Szu-Lin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-oxide-semiconductor capacitor and circuit board including the...
- Patent number 12,080,809
- Issue date Sep 3, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including deep trench capacitors and via contacts
- Patent number 12,074,227
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including a capacitive element and corresponding...
- Patent number 12,057,513
- Issue date Aug 6, 2024
- STMicroelectronics (Rousset) SAS
- Christian Rivero
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling capacitor inside gate cut trench
- Patent number 12,057,387
- Issue date Aug 6, 2024
- International Business Machines Corporation
- Reinaldo Vega
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contaminant collection on SOI
- Patent number 12,046,602
- Issue date Jul 23, 2024
- Texas Instruments Incorporated
- Honglin Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D capacitor and method of manufacturing same
- Patent number 12,040,379
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferroelectric or anti-ferroelectric trench capacitor with spacers f...
- Patent number 12,040,378
- Issue date Jul 16, 2024
- Intel Corporation
- Nazila Haratipour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitors with continuous dielectric layer and methods of f...
- Patent number 12,034,086
- Issue date Jul 9, 2024
- Somilkumar J. Rathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming monolithic surge protect...
- Patent number 12,015,051
- Issue date Jun 18, 2024
- MACOM Technology Solutions Holdings, Inc.
- James J. Brogle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 11,973,149
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Hsing Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for semiconductor device
- Patent number 11,961,921
- Issue date Apr 16, 2024
- Lapis Semiconductor Co., Ltd.
- Hiroshi Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect layout for semiconductor device
- Patent number 11,961,878
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Vertically Stacked Capacitors
- Publication number 20250062220
- Publication date Feb 20, 2025
- Ampleon Netherlands B.V.
- Daniel Maassen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CAPACITOR PROFILE TO DECREASE SUBSTRATE WARPAGE
- Publication number 20250063744
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Li Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250056819
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Lun Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250056818
- Publication date Feb 13, 2025
- UNITED MICROELECTRONICS CORP.
- Chang-Yih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250048659
- Publication date Feb 6, 2025
- UNITED MICROELECTRONICS CORP.
- Chang-Yih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH CAPACITORS
- Publication number 20250038104
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250040190
- Publication date Jan 30, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Shou-Zen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-Oxide-Semiconductor Capacitors and Methods of Fabricating The...
- Publication number 20250040157
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Liang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITOR INCLUDING STRESS-RELIEF VOIDS AND METHODS OF...
- Publication number 20250031393
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Fu-Chiang KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE
- Publication number 20250014824
- Publication date Jan 9, 2025
- NANYA TECHNOLOGY CORPORATION
- Chien-Chung WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLING CAPACITOR CIRCUITS
- Publication number 20240396538
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Lin LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED STACKED DTC STRUCTURE
- Publication number 20240395948
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINFET MOS CAPACITOR
- Publication number 20240395947
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240389349
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Ting Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR AND METHODS OF MANUFACTURING
- Publication number 20240387614
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Ying TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR DEVICE WITH SELF ALIGNED SPACER
- Publication number 20240387613
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR, MEMORY DEVICE, AND METHOD
- Publication number 20240381621
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC STRUCTURE FOR CONNECTED CAPACITANCES AND METHOD OF FORMING SAME
- Publication number 20240371879
- Publication date Nov 7, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Germain Bossu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING DEEP TRENCH CAPACITORS AND VIA CONTACTS
- Publication number 20240372013
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR TRENCH CAPACITOR STRUCTURE AND MANUFACTURING METHOD T...
- Publication number 20240372014
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- FU-CHIANG KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS INTEGRATION CAPACITOR AND MoM CAPACITOR
- Publication number 20240347532
- Publication date Oct 17, 2024
- National Tsing-Hua University
- Ho-Chun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CAPACITOR AND METHOD OF MANUFACTURING SAME
- Publication number 20240347619
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTAMINANT COLLECTION ON SOI
- Publication number 20240339457
- Publication date Oct 10, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Honglin Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20240332395
- Publication date Oct 3, 2024
- GUANGZHOU CANSEMI TECHNOLOGY INC.
- Yohtz Julian CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR EMBEDDING FOR FLIP CHIP PACKAGES
- Publication number 20240332433
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Li Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A TRENCH CAPA...
- Publication number 20240322001
- Publication date Sep 26, 2024
- SK keyfoundry Inc.
- Jong Hyuk OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE DECOUPLING CAPACITOR INTEGRATION WITH BACKSIDE CONTACT
- Publication number 20240321687
- Publication date Sep 26, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHOD FOR MANUFACTURING A SEMICONDUCT...
- Publication number 20240312874
- Publication date Sep 19, 2024
- SERIPHY TECHNOLOGY CORPORATION
- TZU-WEI CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240290780
- Publication date Aug 29, 2024
- MEDIATEK INC.
- Zheng ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE ELEMENT AND ELECTRONIC DEVICE
- Publication number 20240282866
- Publication date Aug 22, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Kento KAWASAKI
- H01 - BASIC ELECTRIC ELEMENTS

Metal-insulator-semiconductors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal-insulator-metal structure

Compact capacitor structure

Chip parts

Trench pattern for trench capacitor yield improvement

Trench capacitor film scheme to reduce substrate warpage

FinFET MOS capacitor

Memory device structure and manufacturing method thereof

Trench capacitor profile to decrease substrate warpage

Capacitor cell and structure thereof

Embeddable semiconductor-based capacitor

High capacitance MIM device with self aligned spacer

Method of manufacturing capacitor structure

Semiconductor trench capacitor structure and manufacturing method t...

Semiconductor structure and method for manufacturing semiconductor...

Deep trench capacitor including stress-relief voids and methods of...

Semiconductor device

Capacitor, memory device, and method

Decoupling capacitor circuits

Metal-oxide-semiconductor capacitor and circuit board including the...

Semiconductor device including deep trench capacitors and via contacts

Integrated circuit including a capacitive element and corresponding...

Decoupling capacitor inside gate cut trench

Contaminant collection on SOI

3D capacitor and method of manufacturing same

Ferroelectric or anti-ferroelectric trench capacitor with spacers f...

Trench capacitors with continuous dielectric layer and methods of f...

Semiconductor device and method of forming monolithic surge protect...

Semiconductor device and method of forming the same

Semiconductor device and manufacturing method for semiconductor device

Interconnect layout for semiconductor device

Patents Applicationslast 30 patents

Vertically Stacked Capacitors

TRENCH CAPACITOR PROFILE TO DECREASE SUBSTRATE WARPAGE

CAPACITOR STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

INTEGRATED CIRCUITS WITH CAPACITORS

SEMICONDUCTOR STRUCTURE

Metal-Oxide-Semiconductor Capacitors and Methods of Fabricating The...

DEEP TRENCH CAPACITOR INCLUDING STRESS-RELIEF VOIDS AND METHODS OF...

CAPACITOR STRUCTURE

DECOUPLING CAPACITOR CIRCUITS

DOUBLE-SIDED STACKED DTC STRUCTURE

FINFET MOS CAPACITOR

MEMORY DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF

METAL-INSULATOR-METAL CAPACITOR AND METHODS OF MANUFACTURING

CAPACITOR DEVICE WITH SELF ALIGNED SPACER

CAPACITOR, MEMORY DEVICE, AND METHOD

IC STRUCTURE FOR CONNECTED CAPACITANCES AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE INCLUDING DEEP TRENCH CAPACITORS AND VIA CONTACTS

SEMICONDUCTOR TRENCH CAPACITOR STRUCTURE AND MANUFACTURING METHOD T...

HETEROGENEOUS INTEGRATION CAPACITOR AND MoM CAPACITOR

3D CAPACITOR AND METHOD OF MANUFACTURING SAME

CONTAMINANT COLLECTION ON SOI

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING SAME

CAPACITOR EMBEDDING FOR FLIP CHIP PACKAGES

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A TRENCH CAPA...

BACKSIDE DECOUPLING CAPACITOR INTEGRATION WITH BACKSIDE CONTACT

SEMICONDUCTOR STRUCTURES AND METHOD FOR MANUFACTURING A SEMICONDUCT...

SEMICONDUCTOR STRUCTURE

PASSIVE ELEMENT AND ELECTRONIC DEVICE