Metal over component

Industry

CPC
H05K2201/1056

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/1056Metal over component

Industries

Patents Grantslast 30 patents

Information Patent Grant
Technique to improve waterproofness and dust resistance for circuit...
- Patent number 11,997,958
- Issue date Jun 4, 2024
- Makita Corporation
- Akihiro Hozumi
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Module
- Patent number 11,968,815
- Issue date Apr 23, 2024
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for underfilling using spacers
- Patent number 11,948,809
- Issue date Apr 2, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Whei Sheng Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric compressor with inverter circuit section and filter circui...
- Patent number 11,936,251
- Issue date Mar 19, 2024
- SANDEN AUTOMOTIVE COMPONENTS CORPORATION
- Mikio Kobayashi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method for fabricating carrier structure
- Patent number 11,792,938
- Issue date Oct 17, 2023
- Silicon Precision Industries Co., Ltd.
- Yu-Lung Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier for arranging electrical components on a circuit...
- Patent number 11,770,896
- Issue date Sep 26, 2023
- HARTING AG
- Thomas Hess
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power electronics assemblies having vapor chambers with integrated...
- Patent number 11,721,608
- Issue date Aug 8, 2023
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics assemblies and methods of manufacturing electronics ass...
- Patent number 11,710,676
- Issue date Jul 25, 2023
- INTELLIGENT PLATFORMS, LLC
- Bernd Sporer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component package and printed circuit board for the same
- Patent number 11,638,346
- Issue date Apr 25, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seon Ha Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module having metallic heat-dissipation substrate
- Patent number 11,622,475
- Issue date Apr 4, 2023
- Delta Electronics, Inc.
- Da Jin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,562,970
- Issue date Jan 24, 2023
- Fuji Electric Co., Ltd.
- Tadahiko Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic foil
- Patent number 11,388,815
- Issue date Jul 12, 2022
- Teknologian tutkimuskeskus VTT Oy
- Vesa Pentikäinen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bracket, input/output assembly and terminal
- Patent number 11,330,090
- Issue date May 10, 2022
- Guangdong Oppo Mobile Telecommunications Corp., Ltd.
- Yuhu Jia
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrical junction box and wire harness
- Patent number 11,304,301
- Issue date Apr 12, 2022
- Yazaki Corporation
- Keisuke Kimura
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Reliable interconnect for camera image sensors
- Patent number 11,206,732
- Issue date Dec 21, 2021
- Waymo LLC
- Matthew Last
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrating Josephson amplifiers or Josephson mixers into printed c...
- Patent number 11,178,771
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Baleegh Abdo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power module having metallic heat-dissipation substrate
- Patent number 11,122,714
- Issue date Sep 14, 2021
- Delta Electronics, Inc.
- Da Jin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronics assemblies and methods of manufacturing electronics ass...
- Patent number 11,114,361
- Issue date Sep 7, 2021
- INTELLIGENT PLATFORMS, LLC
- Bernd Sporer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-board modular lighting system and method of manufacture
- Patent number 11,092,321
- Issue date Aug 17, 2021
- Lumileds LLC
- Ronald Bonne
- F21 - LIGHTING
Information Patent Grant
Electronic component and method for producing an electronic component
- Patent number 11,058,005
- Issue date Jul 6, 2021
- VITESCO TECHNOLOGIES GERMANY GMBH
- Helmut Karrer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shielded package assemblies with integrated capacitor
- Patent number 11,049,819
- Issue date Jun 29, 2021
- International Business Machines Corporation
- Mark C. Lamorey
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electronic device including shield can
- Patent number 11,032,952
- Issue date Jun 8, 2021
- Samsung Electronics Co., Ltd.
- Chang Joon Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrating Josephson amplifiers or Josephson mixers into printed c...
- Patent number 11,006,527
- Issue date May 11, 2021
- International Business Machines Corporation
- Baleegh Abdo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus related to conformal coating implemented with surface mou...
- Patent number 10,980,106
- Issue date Apr 13, 2021
- Skyworks Solutions, Inc.
- Anthony James Lobianco
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board assembly
- Patent number 10,925,148
- Issue date Feb 16, 2021
- Samsung Electronics Co., Ltd.
- Seok-hun Kang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Switching device and electronic device
- Patent number 10,917,972
- Issue date Feb 9, 2021
- Kabushiki Kaisha Toshiba
- Hiroshi Ota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package carrier structure thereof, and method for fabric...
- Patent number 10,863,626
- Issue date Dec 8, 2020
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting structure
- Patent number 10,827,616
- Issue date Nov 3, 2020
- Kyocera Corporation
- Seiji Hattori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrating josephson amplifiers or josephson mixers into printed c...
- Patent number 10,813,219
- Issue date Oct 20, 2020
- International Business Machines Corporation
- Baleegh Abdo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing a component embedded package carrier
- Patent number 10,798,822
- Issue date Oct 6, 2020
- Subtron Technology Co., Ltd.
- Jing-Cyuan Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE COMPRISING PLURALITY OF PRINTED CIRCUIT BOARDS
- Publication number 20240334588
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Jichul KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE
- Publication number 20240237188
- Publication date Jul 11, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE
- Publication number 20240138052
- Publication date Apr 25, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS MODULE, ELECTRICAL SYSTEM HAVING SUCH A MODULE, C...
- Publication number 20230274994
- Publication date Aug 31, 2023
- Valeo eAutomotive France SAS
- Aurelien POUILLY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGED BATTERY
- Publication number 20230262899
- Publication date Aug 17, 2023
- The Johns Hopkins University
- Konstantinos Gerasopoulos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR UNDERFILLING USING SPACERS
- Publication number 20230082626
- Publication date Mar 16, 2023
- DELPHI TECHNOLOGIES IP LIMITED
- Whei Sheng TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT CARRIER FOR ARRANGING ELECTRICAL COMPONENTS ON A CIRCUIT...
- Publication number 20230061125
- Publication date Mar 2, 2023
- HARTING AG
- Thomas HESS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal Transfer, Management and Integrated Control Structure
- Publication number 20230025988
- Publication date Jan 26, 2023
- 3D GLASS SOLUTIONS, INC
- Jeb H. Flemming
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS ASSEMBLIES HAVING VAPOR CHAMBERS WITH INTEGRATED...
- Publication number 20220246492
- Publication date Aug 4, 2022
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposer For Printed Circuit Boards
- Publication number 20220104361
- Publication date Mar 31, 2022
- SoftIron Limited
- Robert Drury
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE
- Publication number 20220095496
- Publication date Mar 24, 2022
- Murata Manufacturing Co., Ltd.
- Tadashi NOMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT PACKAGE AND PRINTED CIRCUIT BOARD FOR THE SAME
- Publication number 20220053631
- Publication date Feb 17, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Seon Ha Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTORS INCLUDING ELECTRICALLY CONDUCTIVE STANDOFFS
- Publication number 20210391113
- Publication date Dec 16, 2021
- Maxim Integrated Products, Inc.
- Alexandr Ikriannikov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronics Assemblies and Methods of Manufacturing Electronics Ass...
- Publication number 20210384098
- Publication date Dec 9, 2021
- INTELLIGENT PLATFORMS, LLC
- Bernd Sporer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210358869
- Publication date Nov 18, 2021
- Fuji Electric Co., Ltd.
- Tadahiko SATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bracket, Input/Output Assembly and Terminal
- Publication number 20210329108
- Publication date Oct 21, 2021
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
- Yuhu Jia
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR FABRICATING CARRIER STRUCTURE
- Publication number 20210068260
- Publication date Mar 4, 2021
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronics Assemblies and Methods of Manufacturing Electronics Ass...
- Publication number 20210043531
- Publication date Feb 11, 2021
- INTELLIGENT PLATFORMS, LLC
- Bernd Sporer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reliable Interconnect for Camera Image Sensors
- Publication number 20210007216
- Publication date Jan 7, 2021
- WAYMO LLC
- Matthew Last
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SWITCHING DEVICE AND ELECTRONIC DEVICE
- Publication number 20200267840
- Publication date Aug 20, 2020
- Kabushiki Kaisha Toshiba
- Hiroshi Ota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC FOIL
- Publication number 20200260567
- Publication date Aug 13, 2020
- Teknologian Tutkimuskeskus VTT Oy
- Vesa PENTIKÄINEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING STRUCTURE
- Publication number 20200245464
- Publication date Jul 30, 2020
- Kyocera Corporation
- Seiji HATTORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY APPARATUS
- Publication number 20200119655
- Publication date Apr 16, 2020
- Atsushi ICHINOSE
- B60 - VEHICLES IN GENERAL
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN ELECTRONIC COMPONENT
- Publication number 20200100364
- Publication date Mar 26, 2020
- Vitesco Technologies Germany GmbH
- Helmut Karrer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHIELDED PACKAGE ASSEMBLIES WITH INTEGRATED CAPACITOR
- Publication number 20200083177
- Publication date Mar 12, 2020
- International Business Machines Corporation
- Mark C. Lamorey
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
THINNED AND FLEXIBLE SEMICONDUCTOR ELEMENTS ON THREE DIMENSIONAL SU...
- Publication number 20200004048
- Publication date Jan 2, 2020
- Johnson & Johnson Vision Care, Inc.
- Randall B Pugh
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ELECTRICAL JUNCTION BOX AND WIRE HARNESS
- Publication number 20190380206
- Publication date Dec 12, 2019
- YAZAKI CORPORATION
- Keisuke Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Attaching a Component to a Circuit Board Using an Over-filled Cavit...
- Publication number 20190307029
- Publication date Oct 3, 2019
- Google LLC
- Nael Hannan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BRACKET FOR ELECTRONIC COMPONENT, ELECTRONIC COMPONENT ASSEMBLY AND...
- Publication number 20190289720
- Publication date Sep 19, 2019
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
- Zeshuo Qiu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING ELECTROMAGNETIC INTERFERENCE (EMI...
- Publication number 20190246492
- Publication date Aug 8, 2019
- Avago Technologies International Sales Pte. Limited
- Deog-Soon Choi
- H01 - BASIC ELECTRIC ELEMENTS

Metal over component

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Technique to improve waterproofness and dust resistance for circuit...

Module

Method for underfilling using spacers

Electric compressor with inverter circuit section and filter circui...

Method for fabricating carrier structure

Component carrier for arranging electrical components on a circuit...

Power electronics assemblies having vapor chambers with integrated...

Electronics assemblies and methods of manufacturing electronics ass...

Component package and printed circuit board for the same

Power module having metallic heat-dissipation substrate

Semiconductor device and manufacturing method thereof

Electronic foil

Bracket, input/output assembly and terminal

Electrical junction box and wire harness

Reliable interconnect for camera image sensors

Integrating Josephson amplifiers or Josephson mixers into printed c...

Power module having metallic heat-dissipation substrate

Electronics assemblies and methods of manufacturing electronics ass...

Chip-on-board modular lighting system and method of manufacture

Electronic component and method for producing an electronic component

Shielded package assemblies with integrated capacitor

Electronic device including shield can

Integrating Josephson amplifiers or Josephson mixers into printed c...

Apparatus related to conformal coating implemented with surface mou...

Printed circuit board assembly

Switching device and electronic device

Electronic package carrier structure thereof, and method for fabric...

Mounting structure

Integrating josephson amplifiers or josephson mixers into printed c...

Method of manufacturing a component embedded package carrier

Patents Applicationslast 30 patents

ELECTRONIC DEVICE COMPRISING PLURALITY OF PRINTED CIRCUIT BOARDS

CIRCUIT MODULE

CIRCUIT MODULE

POWER ELECTRONICS MODULE, ELECTRICAL SYSTEM HAVING SUCH A MODULE, C...

CHIP PACKAGED BATTERY

METHOD FOR UNDERFILLING USING SPACERS

COMPONENT CARRIER FOR ARRANGING ELECTRICAL COMPONENTS ON A CIRCUIT...

Thermal Transfer, Management and Integrated Control Structure

POWER ELECTRONICS ASSEMBLIES HAVING VAPOR CHAMBERS WITH INTEGRATED...

Interposer For Printed Circuit Boards

MODULE

COMPONENT PACKAGE AND PRINTED CIRCUIT BOARD FOR THE SAME

INDUCTORS INCLUDING ELECTRICALLY CONDUCTIVE STANDOFFS

Electronics Assemblies and Methods of Manufacturing Electronics Ass...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Bracket, Input/Output Assembly and Terminal

METHOD FOR FABRICATING CARRIER STRUCTURE

Electronics Assemblies and Methods of Manufacturing Electronics Ass...

Reliable Interconnect for Camera Image Sensors

SWITCHING DEVICE AND ELECTRONIC DEVICE

ELECTRONIC FOIL

MOUNTING STRUCTURE

POWER SUPPLY APPARATUS

ELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN ELECTRONIC COMPONENT

SHIELDED PACKAGE ASSEMBLIES WITH INTEGRATED CAPACITOR

THINNED AND FLEXIBLE SEMICONDUCTOR ELEMENTS ON THREE DIMENSIONAL SU...

ELECTRICAL JUNCTION BOX AND WIRE HARNESS

Attaching a Component to a Circuit Board Using an Over-filled Cavit...

BRACKET FOR ELECTRONIC COMPONENT, ELECTRONIC COMPONENT ASSEMBLY AND...

SYSTEMS AND METHODS FOR PROVIDING ELECTROMAGNETIC INTERFERENCE (EMI...