Metal processing

Industry

CPC
H05K2203/03

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/03Metal processing

Industries

Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,144,121
- Issue date Nov 12, 2024
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for double-sided wiring circuit board and doub...
- Patent number 12,114,438
- Issue date Oct 8, 2024
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 12,101,890
- Issue date Sep 24, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Myung Ju Gi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Catalyzed metal foil and uses thereof to produce electrical circuits
- Patent number 12,063,748
- Issue date Aug 13, 2024
- AVERATEK CORPORATION
- Shinichi Iketani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for producing a metal-ceramic substrate, and metal-ceramic s...
- Patent number 12,058,816
- Issue date Aug 6, 2024
- Rogers Germany GmbH
- Andreas Meyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit board
- Patent number 12,035,484
- Issue date Jul 9, 2024
- Nitto Denko Corporation
- Kenya Takimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Redistribution plate
- Patent number 11,997,789
- Issue date May 28, 2024
- Dominik Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Catalyzed metal foil and uses thereof
- Patent number 11,877,404
- Issue date Jan 16, 2024
- AVERATEK CORPORATION
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for manufacturing ultrasound transducers and other components
- Patent number 11,845,108
- Issue date Dec 19, 2023
- FUJIFILM SonoSite, Inc.
- N. Christopher Chaggares
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Methods for producing an etch resist pattern on a metallic surface
- Patent number 11,807,947
- Issue date Nov 7, 2023
- Kateeva, Inc.
- Nava Shpaisman
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for printing solder paste and other viscous materials at hi...
- Patent number 11,697,166
- Issue date Jul 11, 2023
- IO Tech Group Ltd.
- Michael Zenou
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultra-thin copper foil, ultra-thin copper foil with carrier, and me...
- Patent number 11,576,267
- Issue date Feb 7, 2023
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Redistribution plate
- Patent number 11,510,318
- Issue date Nov 22, 2022
- Dominik Schmidt
- G01 - MEASURING TESTING
Information Patent Grant
LED lamp having metal PCB bent polyhedrally and manufacturing metho...
- Patent number 11,480,328
- Issue date Oct 25, 2022
- ECOCAB.CO., LTD
- Young Cheon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sheet material, metal mesh and manufacturing methods thereof
- Patent number 11,466,368
- Issue date Oct 11, 2022
- TDK Corporation
- Makoto Orikasa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturing method of copper foil and circuit board assembly for...
- Patent number 11,466,379
- Issue date Oct 11, 2022
- Nan Ya Plastics Corporation
- Shih-Ching Lin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Systems for printing solder paste and other viscous materials at hi...
- Patent number 11,446,750
- Issue date Sep 20, 2022
- IO TECH GROUP LTD.
- Michael Zenou
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit board, producing method thereof, and wiring circuit...
- Patent number 11,452,215
- Issue date Sep 20, 2022
- Nitto Denko Corporation
- Ryosuke Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Localized rework using liquid media soldering
- Patent number 11,445,650
- Issue date Sep 13, 2022
- International Business Machines Corporation
- Theron Lee Lewis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of etching conductive features, and related devices and sys...
- Patent number 11,425,822
- Issue date Aug 23, 2022
- Kateeva, Inc.
- Nava Shpaisman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing circuit board
- Patent number 11,419,222
- Issue date Aug 16, 2022
- Unimicron Technology Corp.
- Hsin-Chi Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface-treated copper foil, copper foil having carrier, laminated...
- Patent number 11,401,612
- Issue date Aug 2, 2022
- JX Nippon Mining & Metals Corporation
- Terumasa Moriyama
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface treated copper foil, copper clad laminate, and printed circ...
- Patent number 11,382,217
- Issue date Jul 5, 2022
- JX Nippon Mining & Metals Corporation
- Nobuaki Miyamoto
- B32 - LAYERED PRODUCTS
Information Patent Grant
Surface treated copper foil, copper clad laminate, and printed circ...
- Patent number 11,375,624
- Issue date Jun 28, 2022
- JX Nippon Mining & Metals Corporation
- Nobuaki Miyamoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Fluororesin base material, printed wiring board, and circuit module
- Patent number 11,364,714
- Issue date Jun 21, 2022
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Satoshi Kiya
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electrodeposited copper foil and electrode, and lithium-ion seconda...
- Patent number 11,362,337
- Issue date Jun 14, 2022
- Chang Chun Petrochemical Co., Ltd.
- Huei-Fang Huang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Surface treated copper foil, copper clad laminate, and printed circ...
- Patent number 11,337,314
- Issue date May 17, 2022
- JX Nippon Mining & Metals Corporation
- Nobuaki Miyamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Surface treated copper foil, copper clad laminate, and printed circ...
- Patent number 11,337,315
- Issue date May 17, 2022
- JX Nippon Mining & Metals Corporation
- Nobuaki Miyamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Circuit board
- Patent number 11,291,123
- Issue date Mar 29, 2022
- SAMWON ACT CO., LTD.
- Kyung Yul Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE MULTILA...
- Publication number 20240349427
- Publication date Oct 17, 2024
- TOPPAN Holdings Inc.
- Takehisa TAKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...
- Publication number 20240341042
- Publication date Oct 10, 2024
- Atotech Deutschland GmbH & Co. KG
- Bert REENTS
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF ELECTRONIC COMPONE...
- Publication number 20240334599
- Publication date Oct 3, 2024
- Taiyo Yuden Co., Ltd.
- Takayuki Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR MANUFACTURING POWER MODULE
- Publication number 20240306304
- Publication date Sep 12, 2024
- HYUNDAI MOBIS CO., LTD.
- Chan Yang CHOE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240306296
- Publication date Sep 12, 2024
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240284604
- Publication date Aug 22, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Myungju Gi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, MANUFACTURING METHOD, AND DISPLAY MODULE
- Publication number 20240284608
- Publication date Aug 22, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Gang Yuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-HUNDRED OR THOUSAND CHANNEL ELECTRODE ELECTROPHYSIOLOGICAL AR...
- Publication number 20240226565
- Publication date Jul 11, 2024
- The Regents of the University of California
- Shadi A. Dayeh
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240215158
- Publication date Jun 27, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Mi Jeong JEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRA-THIN COPPER FOIL WITH CARRIER FOIL AND METHOD FOR MANUFACTURI...
- Publication number 20240206062
- Publication date Jun 20, 2024
- Lotte Energy Materials Corporation
- Chang Yol YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODIFIED COPPER SURFACE, HETEROAROMATIC SILANE COMPOUNDS AND THEIR...
- Publication number 20240179851
- Publication date May 30, 2024
- Atotech Deutschland GmbH & Co. KG
- Valentina BELOVA-MAGRI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240155778
- Publication date May 9, 2024
- Shinko Electric Industries Co., Ltd.
- Akihiro TAKEUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE WITH CONDUCTIVE PATTERN ATTACHED...
- Publication number 20240147627
- Publication date May 2, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Tomohiro FUKAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-HUNDRED OR THOUSAND CHANNEL ELECTRODE ELECTROPHYSIOLOGICAL AR...
- Publication number 20240131339
- Publication date Apr 25, 2024
- The Regents of the University of California
- Shadi A. Dayeh
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
AUTOMATIC PROCESSING METHOD FOR PRINTED CIRCUIT BOARD DATA AND ELEC...
- Publication number 20240114624
- Publication date Apr 4, 2024
- ISCOOLLAB CO., LTD.
- YAN-MEI JIANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240107685
- Publication date Mar 28, 2024
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD
- Publication number 20240107667
- Publication date Mar 28, 2024
- Nitto Denko Corporation
- Kenta FUKUSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE
- Publication number 20240035167
- Publication date Feb 1, 2024
- Kateeva, Inc.
- Nava Shpaisman
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CIRCUIT PATTERN, SEMI-FINISHED BASE MATERIAL FOR CIRCUIT SUBSTRATE,...
- Publication number 20240023234
- Publication date Jan 18, 2024
- NHK Spring Co., Ltd.
- Shinya YANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE
- Publication number 20230422411
- Publication date Dec 28, 2023
- Subtron Technology Co., Ltd.
- Chung Ying Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20230422397
- Publication date Dec 28, 2023
- Nitto Denko Corporation
- Takahiro IKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A CIRCUIT BOARD AND A SHAPED PART FOR USE IN T...
- Publication number 20230397332
- Publication date Dec 7, 2023
- JUMATECH GMBH
- Philipp WÖLFEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER-CLAD LAMINATE PLATE AND PRINTED WIRING BOARD
- Publication number 20230276571
- Publication date Aug 31, 2023
- Mitsui Mining and Smelting Co., Ltd.
- Daisuke NAKAJIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20230209719
- Publication date Jun 29, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Myung Ju GI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLATED MOLDED ARTICLE AND METHOD FOR MANUFACTURING PLATED MOLDED AR...
- Publication number 20230156923
- Publication date May 18, 2023
- SANKEI GIKEN KOGYO CO., LTD.
- Toshiyuki Kitamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE COPPER COMPONENTS
- Publication number 20230142375
- Publication date May 11, 2023
- Namics Corporation
- Naoki OBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20230113278
- Publication date Apr 13, 2023
- IBIDEN CO., LTD.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD FOR DOUBLE-SIDED WIRING CIRCUIT BOARD AND DOUB...
- Publication number 20230008736
- Publication date Jan 12, 2023
- Nitto Denko Corporation
- Shusaku SHIBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for producing a metal-ceramic substrate, and metal-ceramic s...
- Publication number 20220295641
- Publication date Sep 15, 2022
- Rogers Germany GmbH
- Andreas Meyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER-CLAD LAMINATED PLATE, RESIN-CLAD COPPER FOIL, AND CIRCUIT SU...
- Publication number 20220220272
- Publication date Jul 14, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- Yuki KITAI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Metal processing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring substrate and method for manufacturing wiring substrate

Manufacturing method for double-sided wiring circuit board and doub...

Method of manufacturing printed circuit board

Catalyzed metal foil and uses thereof to produce electrical circuits

Method for producing a metal-ceramic substrate, and metal-ceramic s...

Wiring circuit board

Redistribution plate

Catalyzed metal foil and uses thereof

Methods for manufacturing ultrasound transducers and other components

Methods for producing an etch resist pattern on a metallic surface

Circuit board structure and method for manufacturing a circuit boar...

Methods for printing solder paste and other viscous materials at hi...

Ultra-thin copper foil, ultra-thin copper foil with carrier, and me...

Redistribution plate

LED lamp having metal PCB bent polyhedrally and manufacturing metho...

Sheet material, metal mesh and manufacturing methods thereof

Manufacturing method of copper foil and circuit board assembly for...

Systems for printing solder paste and other viscous materials at hi...

Wiring circuit board, producing method thereof, and wiring circuit...

Localized rework using liquid media soldering

Methods of etching conductive features, and related devices and sys...

Method of manufacturing circuit board

Surface-treated copper foil, copper foil having carrier, laminated...

Surface treated copper foil, copper clad laminate, and printed circ...

Surface treated copper foil, copper clad laminate, and printed circ...

Fluororesin base material, printed wiring board, and circuit module

Electrodeposited copper foil and electrode, and lithium-ion seconda...

Surface treated copper foil, copper clad laminate, and printed circ...

Surface treated copper foil, copper clad laminate, and printed circ...

Circuit board

Patents Applicationslast 30 patents

MULTILAYER WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE MULTILA...

METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...

ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF ELECTRONIC COMPONE...

APPARATUS AND METHOD FOR MANUFACTURING POWER MODULE

WIRING SUBSTRATE

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT BOARD, MANUFACTURING METHOD, AND DISPLAY MODULE

MULTI-HUNDRED OR THOUSAND CHANNEL ELECTRODE ELECTROPHYSIOLOGICAL AR...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

ULTRA-THIN COPPER FOIL WITH CARRIER FOIL AND METHOD FOR MANUFACTURI...

MODIFIED COPPER SURFACE, HETEROAROMATIC SILANE COMPOUNDS AND THEIR...

WIRING SUBSTRATE

METHOD FOR MANUFACTURING SUBSTRATE WITH CONDUCTIVE PATTERN ATTACHED...

MULTI-HUNDRED OR THOUSAND CHANNEL ELECTRODE ELECTROPHYSIOLOGICAL AR...

AUTOMATIC PROCESSING METHOD FOR PRINTED CIRCUIT BOARD DATA AND ELEC...

PRINTED WIRING BOARD

METHOD FOR PRODUCING WIRING CIRCUIT BOARD

METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE

CIRCUIT PATTERN, SEMI-FINISHED BASE MATERIAL FOR CIRCUIT SUBSTRATE,...

SUBSTRATE STRUCTURE

WIRING CIRCUIT BOARD

METHOD FOR PRODUCING A CIRCUIT BOARD AND A SHAPED PART FOR USE IN T...

COPPER-CLAD LAMINATE PLATE AND PRINTED WIRING BOARD

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

PLATED MOLDED ARTICLE AND METHOD FOR MANUFACTURING PLATED MOLDED AR...

COMPOSITE COPPER COMPONENTS

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

MANUFACTURING METHOD FOR DOUBLE-SIDED WIRING CIRCUIT BOARD AND DOUB...

Method for producing a metal-ceramic substrate, and metal-ceramic s...

COPPER-CLAD LAMINATED PLATE, RESIN-CLAD COPPER FOIL, AND CIRCUIT SU...