TREA

Metallic bump or raised conductor not used as solder bump

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Industry

  • CPC
  • H05K2201/0367
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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0367Metallic bump or raised conductor not used as solder bump
Industries