Metallic case or integral heatsink of component electrically connected to a pad on PCB

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CPC
H05K2201/10969

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10969Metallic case or integral heatsink of component electrically connected to a pad on PCB

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Assembly having a plurality of LEDs and video board
- Patent number 12,046,585
- Issue date Jul 23, 2024
- Screen Experts GmbH
- Werner Döker
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Circuit board, an image sensor module, a lens driving device, and a...
- Patent number 11,936,968
- Issue date Mar 19, 2024
- LG Innotek Co., Ltd
- Hae Sik Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Exposed pad integrated circuit package
- Patent number 11,769,247
- Issue date Sep 26, 2023
- Texas Instruments Incorporated
- Reynaldo Corpuz Javier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Exposed pad integrated circuit package
- Patent number 11,195,269
- Issue date Dec 7, 2021
- Texas Instruments Incorporated
- Reynaldo Corpuz Javier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Removing unwanted flux from an integrated circuit package
- Patent number 10,939,559
- Issue date Mar 2, 2021
- Schlage Lock Company LLC
- Russell L. Steiner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low-cost superior performance coinless RF power amplifier
- Patent number 10,912,185
- Issue date Feb 2, 2021
- Telefonaktiebolaget LM Ericsson (publ)
- Reginald Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Energy storage apparatus in device with conductive case structure
- Patent number 10,897,035
- Issue date Jan 19, 2021
- Seagate Technology, LLC
- Dana Lynn Simonson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for mounting a power amplifier (AP) assembly
- Patent number 10,842,028
- Issue date Nov 17, 2020
- Telefonaktiebolaget LM Ericsson (publ)
- Ronald Nehring
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate, electronic device, and a method for manufactu...
- Patent number 10,813,209
- Issue date Oct 20, 2020
- Murata Manufacturing Co., Ltd.
- Shuichi Kezuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-profile space-efficient shielding for SIP module
- Patent number 10,624,214
- Issue date Apr 14, 2020
- Apple Inc.
- Amir Salehi
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Electromagnetic interference shielding structure
- Patent number 10,531,599
- Issue date Jan 7, 2020
- Samsung Electronics Co., Ltd.
- Il-ju Mun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Removing unwanted flux from an integrated circuit package
- Patent number 10,512,167
- Issue date Dec 17, 2019
- Schlage Lock Company LLC
- Russell L. Steiner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed-circuit board, printed-wiring board, and electronic apparatus
- Patent number 10,375,816
- Issue date Aug 6, 2019
- Canon Kabushiki Kaisha
- Keita Yamazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light source module
- Patent number 10,317,068
- Issue date Jun 11, 2019
- LG Electronics Inc.
- Jaepyo Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light source module
- Patent number 10,228,119
- Issue date Mar 12, 2019
- LG Electronics Inc.
- Jaepyo Hong
- F21 - LIGHTING
Information Patent Grant
Energy storage apparatus in device with conductive case structure
- Patent number 10,224,536
- Issue date Mar 5, 2019
- Seagate Technology LLC
- Dana Lynn Simonson
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Head mounted computing device, adhesive joint system and method
- Patent number 10,187,977
- Issue date Jan 22, 2019
- Microsoft Technology Licensing, LLC
- Igor Markovsky
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board assembly, control device for a cooler fan module and...
- Patent number 10,028,384
- Issue date Jul 17, 2018
- Brose Fahrzeugteile GmbH & Co. KG, Wuerzburg
- Steffen Ehrmann
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Assembly comprising a hyperfrequency component and a printed circuit
- Patent number 9,867,281
- Issue date Jan 9, 2018
- RADIALL
- Alexandre Flaceau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder void reduction between electronic packages and printed circu...
- Patent number 9,839,128
- Issue date Dec 5, 2017
- International Business Machines Corporation
- Phillip D. Isaacs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light-source module and light-emitting device
- Patent number 9,743,521
- Issue date Aug 22, 2017
- Philips Lighting Holding B.V.
- Ralph Kurt
- G02 - OPTICS
Information Patent Grant
Device for assembling a chip on a substrate by providing a solder-f...
- Patent number 9,706,665
- Issue date Jul 11, 2017
- Valeo Etudes Electroniques
- Laurent Vivet
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid cooled metal core printed circuit board
- Patent number 9,686,887
- Issue date Jun 20, 2017
- Nicholas Michael D'Onofrio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and semiconductor package with thermally conducti...
- Patent number 9,674,940
- Issue date Jun 6, 2017
- Samsung Electronics Co., Ltd.
- Eung-chang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, method for manufacturing wiring board, and electronic...
- Patent number 9,655,238
- Issue date May 16, 2017
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connection arrangement
- Patent number 9,620,873
- Issue date Apr 11, 2017
- Delphi International Operations Luxembourg S.A.R.L.
- Peter Stoermer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit device and method for manufacturing same
- Patent number 9,572,294
- Issue date Feb 14, 2017
- Semiconductor Components Industries, LLC
- Nobuhisa Onai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board structure with heat dissipation function
- Patent number 9,554,453
- Issue date Jan 24, 2017
- Mediatek Inc.
- Shu-Wei Hsiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, printed circuit board, and method for manufac...
- Patent number 9,474,166
- Issue date Oct 18, 2016
- Canon Kabushiki Kaisha
- Keigo Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder void reduction between electronic packages and printed circu...
- Patent number 9,462,703
- Issue date Oct 4, 2016
- International Business Machines Corporation
- Phillip D. Isaacs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD, AN IMAGE SENSOR MODULE, A LENS DRIVING DEVICE, AND A...
- Publication number 20240171839
- Publication date May 23, 2024
- LG Innotek Co., Ltd.
- Hae Sik KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLY
- Publication number 20240064940
- Publication date Feb 22, 2024
- VALEO COMFORT AND DRIVING ASSISTANCE
- Matthias Wellens
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, AN IMAGE SENSOR MODULE, A LENS DRIVING DEVICE, AND A...
- Publication number 20220353389
- Publication date Nov 3, 2022
- LG Innotek Co., Ltd.
- Hae Sik KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
REMOVING UNWANTED FLUX FROM AN INTEGRATED CIRCUIT PACKAGE
- Publication number 20200236793
- Publication date Jul 23, 2020
- SCHLAGE LOCK COMPANY LLC
- Russell L. Steiner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURE
- Publication number 20190082562
- Publication date Mar 14, 2019
- Samsung Electronics Co., Ltd.
- Il-ju MUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SLIDE AND MOUNT MANUFACTURING FOR COINLESS RF POWER AMPLIFIER
- Publication number 20180310416
- Publication date Oct 25, 2018
- Telefonaktiebolaget LM Ericsson (publ)
- Ronald NEHRING
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER VOID REDUCTION BETWEEN ELECTRONIC PACKAGES AND PRINTED CIRCU...
- Publication number 20160338200
- Publication date Nov 17, 2016
- International Business Machines Corporation
- Phillip D. Isaacs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20160027724
- Publication date Jan 28, 2016
- KYOCERA Circuit Solutions, Inc.
- Takayuki ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR VOID REDUCTION IN A SOLDER JOINT
- Publication number 20140328039
- Publication date Nov 6, 2014
- Paul J. Koep
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ESCAPE ROUTES
- Publication number 20140312479
- Publication date Oct 23, 2014
- FLEXTRONICS AP, LLC
- Omar Garcia Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE ELECTRONIC COMPONENT
- Publication number 20140313682
- Publication date Oct 23, 2014
- NIHON DEMPA KOGYO CO., LTD.
- HIROYUKI MITOME
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE FOR ASSEMBLING A CHIP ON A SUBSTRATE BY PROVIDING A SOLDER-F...
- Publication number 20140304984
- Publication date Oct 16, 2014
- VALEO ETUDES ELECTRONIQUES
- Laurent VIVET
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Systems and Methods Providing Thermal Spreading for an LED Module
- Publication number 20140254180
- Publication date Sep 11, 2014
- Wei-Yu Yeh
- F21 - LIGHTING
Information Patent Application
LIGHT EMITTING DEVICE ARRAY
- Publication number 20140239322
- Publication date Aug 28, 2014
- LG Innotek Co., Ltd.
- Sangwoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD STRUCTURE WITH HEAT DISSIPATION FUNCTION
- Publication number 20140238729
- Publication date Aug 28, 2014
- MEDIATEK INC.
- Shu-Wei HSIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFAC...
- Publication number 20140174795
- Publication date Jun 26, 2014
- Canon Kabushiki Kaisha
- Keigo Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC HIGH-CURRENT CIRCUIT BY MEANS...
- Publication number 20140138124
- Publication date May 22, 2014
- CONTINENTAL AUTOMOTIVE GMBH
- Erich Mattmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Forming Thermal Conductive Pillar in Metal Core Printed C...
- Publication number 20140116613
- Publication date May 1, 2014
- COFAN USA, INC.
- Chang Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HOUSING FOR WAFER-LEVEL CAMERA MODULE
- Publication number 20140078387
- Publication date Mar 20, 2014
- OmniVision Technologies (Shanghai) Co., Ltd.
- Ye Tao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRICAL COMPONENT RESIN, SEMICONDUCTOR DEVICE, AND SUBSTRATE
- Publication number 20140054077
- Publication date Feb 27, 2014
- PANASONIC CORPORATION
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CAVITY WIRING BOARD FOR SEMICONDUCTOR ASSEMBLY WITH INTERNAL...
- Publication number 20140048326
- Publication date Feb 20, 2014
- Bridge Semiconductor Corporation
- Charles W.C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING A PRINTED CIRCUI...
- Publication number 20140027162
- Publication date Jan 30, 2014
- Wistron Corporation
- LUNG-MING CHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20130292165
- Publication date Nov 7, 2013
- WINTEK CORPORATION
- Chih-Chiang Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20130286594
- Publication date Oct 31, 2013
- ON SEMICONDUCTOR TRADING LTD.
- Nobuhisa Onai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED ARRAY MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20130271992
- Publication date Oct 17, 2013
- SHINWOO TECH CO., LTD.
- Hyo Tae Kim
- F21 - LIGHTING
Information Patent Application
RADIANT HEAT CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, HEAT...
- Publication number 20130188359
- Publication date Jul 25, 2013
- LG Innotek Co., Ltd.
- Hyun Gyu Park
- G02 - OPTICS
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD
- Publication number 20130168136
- Publication date Jul 4, 2013
- DENSO CORPORATION
- Masashi INABA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL CONNECTOR
- Publication number 20130170145
- Publication date Jul 4, 2013
- TEM PRODUCTS INC.
- Dean Gouramanis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Radiation-Emitting Semiconductor Body, Method for Producing a Radia...
- Publication number 20130134473
- Publication date May 30, 2013
- Osram Opto Semiconductors GmbH
- Herbert Brunner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNT TECHNOLOGY PROCESS FOR ADVANCED QUAD FLAT NO-LEAD PAC...
- Publication number 20130133193
- Publication date May 30, 2013
- MEDIATEK SINGAPORE PTE LTD
- Chih-Tai Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Metallic case or integral heatsink of component electrically connected to a pad on PCB

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Assembly having a plurality of LEDs and video board

Circuit board, an image sensor module, a lens driving device, and a...

Exposed pad integrated circuit package

Exposed pad integrated circuit package

Removing unwanted flux from an integrated circuit package

Low-cost superior performance coinless RF power amplifier

Energy storage apparatus in device with conductive case structure

Method for mounting a power amplifier (AP) assembly

Multilayer substrate, electronic device, and a method for manufactu...

Low-profile space-efficient shielding for SIP module

Electromagnetic interference shielding structure

Removing unwanted flux from an integrated circuit package

Printed-circuit board, printed-wiring board, and electronic apparatus

Light source module

Light source module

Energy storage apparatus in device with conductive case structure

Head mounted computing device, adhesive joint system and method

Circuit board assembly, control device for a cooler fan module and...

Assembly comprising a hyperfrequency component and a printed circuit

Solder void reduction between electronic packages and printed circu...

Light-source module and light-emitting device

Device for assembling a chip on a substrate by providing a solder-f...

Liquid cooled metal core printed circuit board

Electronic device and semiconductor package with thermally conducti...

Wiring board, method for manufacturing wiring board, and electronic...

Electrical connection arrangement

Circuit device and method for manufacturing same

Printed circuit board structure with heat dissipation function

Printed wiring board, printed circuit board, and method for manufac...

Solder void reduction between electronic packages and printed circu...

Patents Applicationslast 30 patents

CIRCUIT BOARD, AN IMAGE SENSOR MODULE, A LENS DRIVING DEVICE, AND A...

ELECTRONIC ASSEMBLY

CIRCUIT BOARD, AN IMAGE SENSOR MODULE, A LENS DRIVING DEVICE, AND A...

REMOVING UNWANTED FLUX FROM AN INTEGRATED CIRCUIT PACKAGE

ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURE

SLIDE AND MOUNT MANUFACTURING FOR COINLESS RF POWER AMPLIFIER

SOLDER VOID REDUCTION BETWEEN ELECTRONIC PACKAGES AND PRINTED CIRCU...

WIRING BOARD

SYSTEMS AND METHODS FOR VOID REDUCTION IN A SOLDER JOINT

ESCAPE ROUTES

COMPOSITE ELECTRONIC COMPONENT

DEVICE FOR ASSEMBLING A CHIP ON A SUBSTRATE BY PROVIDING A SOLDER-F...

Systems and Methods Providing Thermal Spreading for an LED Module

LIGHT EMITTING DEVICE ARRAY

PRINTED CIRCUIT BOARD STRUCTURE WITH HEAT DISSIPATION FUNCTION

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFAC...

METHOD OF MANUFACTURING AN ELECTRONIC HIGH-CURRENT CIRCUIT BY MEANS...

Method of Forming Thermal Conductive Pillar in Metal Core Printed C...

HOUSING FOR WAFER-LEVEL CAMERA MODULE

ELECTRICAL COMPONENT RESIN, SEMICONDUCTOR DEVICE, AND SUBSTRATE

MULTI-CAVITY WIRING BOARD FOR SEMICONDUCTOR ASSEMBLY WITH INTERNAL...

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING A PRINTED CIRCUI...

CIRCUIT BOARD

CIRCUIT DEVICE AND METHOD FOR MANUFACTURING SAME

LED ARRAY MODULE AND MANUFACTURING METHOD THEREOF

RADIANT HEAT CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, HEAT...

MULTILAYER PRINTED CIRCUIT BOARD

THERMAL CONNECTOR

Radiation-Emitting Semiconductor Body, Method for Producing a Radia...

SURFACE MOUNT TECHNOLOGY PROCESS FOR ADVANCED QUAD FLAT NO-LEAD PAC...