Metallic cylinders

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CPC
H05K2201/10242

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10242Metallic cylinders

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Metal component and ceramic substrate
- Patent number 12,207,400
- Issue date Jan 21, 2025
- Shinko Electric Industries Co., Ltd.
- Ayako Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display module and glass with undercut plastic frame
- Patent number 12,189,423
- Issue date Jan 7, 2025
- Apple Inc.
- Douglas G. Fournier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wiring substrate
- Patent number 12,089,330
- Issue date Sep 10, 2024
- Ibiden Co., Ltd.
- Masatoshi Kunieda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,004,287
- Issue date Jun 4, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Pinghua Duan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solid state relay
- Patent number 11,949,407
- Issue date Apr 2, 2024
- Zonit Structured Solutions, LLC
- Steve Chapel
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Solid state relay
- Patent number 11,522,534
- Issue date Dec 6, 2022
- Zonit Structured Solutions, LLC
- Steve Chapel
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Connectors for interconnecting microelectronic circuits
- Patent number 11,431,115
- Issue date Aug 30, 2022
- Centipede Systems, Inc.
- Thomas H. Di Stefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display module and glass with undercut plastic frame
- Patent number 11,392,175
- Issue date Jul 19, 2022
- Apple Inc.
- Douglas G. Fournier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Battery architecture in an electronic device
- Patent number 11,132,024
- Issue date Sep 28, 2021
- Apple Inc.
- David A. Pakula
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of integrating an electronic module with conductive fabric
- Patent number 11,051,401
- Issue date Jun 29, 2021
- Flextronics AP, LLC
- Weifeng Liu
- D03 - WEAVING
Information Patent Grant
Bottom package with metal post interconnections
- Patent number 10,971,476
- Issue date Apr 6, 2021
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bi-directional heatsink dampening force system
- Patent number 10,903,140
- Issue date Jan 26, 2021
- Cisco Technology, Inc.
- Phil Slight
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection assembly for connecting a thin conductor piece to a thic...
- Patent number 10,892,568
- Issue date Jan 12, 2021
- TE Connectivity Germany GmbH
- Tran-Son Don
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency connection arrangement
- Patent number 10,854,942
- Issue date Dec 1, 2020
- CAMBIUM NETWORKS LTD
- Paul Clark
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu column, Cu core column, solder joint, and through-silicon via
- Patent number 10,811,376
- Issue date Oct 20, 2020
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Flexible printed wiring board, electronic device having flexible pr...
- Patent number 10,784,642
- Issue date Sep 22, 2020
- Ibiden Co., Ltd.
- Takahisa Hirasawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical assembly with a multilayer bus board
- Patent number 10,779,392
- Issue date Sep 15, 2020
- INTERPLEX INDUSTRIES, INC.
- Richard Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Battery architecture in an electronic device
- Patent number 10,701,833
- Issue date Jun 30, 2020
- Apple Inc.
- David A. Pakula
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Sold state relay
- Patent number 10,673,429
- Issue date Jun 2, 2020
- Zonit Structured Solutions, LLC
- Steve Chapel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductor connection structure for plate-like routing members
- Patent number 10,638,607
- Issue date Apr 28, 2020
- Yazaki Corporation
- Masahito Ozaki
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Display module and glass with undercut plastic frame
- Patent number 10,631,437
- Issue date Apr 21, 2020
- Apple Inc.
- Douglas G. Fournier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Low-profile space-efficient shielding for SIP module
- Patent number 10,624,214
- Issue date Apr 14, 2020
- Apple Inc.
- Amir Salehi
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Battery bridge and method for activating an electronic device
- Patent number 10,615,523
- Issue date Apr 7, 2020
- Biotronik SE & Co. KG
- Martin Henschel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with embedded sensor
- Patent number 10,542,917
- Issue date Jan 28, 2020
- Battelle Memorial Institute
- Andrew M. Schimmoeller
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Multilayer bus board
- Patent number 10,485,092
- Issue date Nov 19, 2019
- INTERPLEX INDUSTRIES, INC.
- Richard Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked circuit board architecture in an electronic device
- Patent number 10,455,738
- Issue date Oct 22, 2019
- Apple Inc.
- David A. Pakula
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of enhancing fatigue life of grid arrays
- Patent number 10,433,429
- Issue date Oct 1, 2019
- Massachusetts Institute of Technology
- James H. Kelly
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Electronic component device and method for manufacturing the same
- Patent number 10,383,228
- Issue date Aug 13, 2019
- Shinko Electric Industries Co., Ltd.
- Masahiro Kyozuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sleeved coaxial printed circuit board vias
- Patent number 10,375,838
- Issue date Aug 6, 2019
- Massachusetts Institute of Technology
- Glenn A. Brigham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power supply board
- Patent number 10,331,161
- Issue date Jun 25, 2019
- Fujitsu Limited
- Yuki Kanai
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE INCLUDING SHIELDING STRUCTURE FOR REDUCING MOUNTI...
- Publication number 20240306354
- Publication date Sep 12, 2024
- Samsung Electronics Co., Ltd.
- Kwangho JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING EMBEDDED DEVICE PACKAGING SUBSTRATE, PACKA...
- Publication number 20240222245
- Publication date Jul 4, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE AND SUBSTRATE MODULE
- Publication number 20240107676
- Publication date Mar 28, 2024
- Murata Manufacturing Co., Ltd.
- Tomohiko SUGIYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROL DEVICE AND MANUFACTURING METHOD
- Publication number 20240049415
- Publication date Feb 8, 2024
- ROBERT BOSCH GmbH
- Jens Maerkle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240040691
- Publication date Feb 1, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Kwon Su YUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANTENNA ARRAY ARCHITECTURE WITH ELECTRICALLY CONDUCTIVE COLUMNS BET...
- Publication number 20230395967
- Publication date Dec 7, 2023
- ViaSat, Inc.
- Luis G. ASTORGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING MODULE AND ELECTRONIC DEVICE
- Publication number 20230209717
- Publication date Jun 29, 2023
- Huawei Technologies Co., Ltd
- Yatao LV
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL COMPONENT AND CERAMIC SUBSTRATE
- Publication number 20230134940
- Publication date May 4, 2023
- Shinko Electric Industries Co., Ltd.
- Ayako Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADDITIVE MANUFACTURING TECHNOLOGY MICROWAVE VERTICAL LAUNCH
- Publication number 20230121347
- Publication date Apr 20, 2023
- Raytheon Company
- Andrew R. Southworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20230051976
- Publication date Feb 16, 2023
- Telefonaktiebolaget LM Ericsson (publ)
- Pinghua DUAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STUD BUMPED PRINTED CIRCUIT ASSEMBLY
- Publication number 20230041747
- Publication date Feb 9, 2023
- James Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board Assembly
- Publication number 20230030311
- Publication date Feb 2, 2023
- Tyco Electronics (Shanghai) Co. Ltd.
- Ping Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20230007771
- Publication date Jan 5, 2023
- IBIDEN CO., LTD.
- Masatoshi KUNIEDA
- G02 - OPTICS
Information Patent Application
DISPLAY MODULE & GLASS WITH UNDERCUT PLASTIC FRAME
- Publication number 20220317728
- Publication date Oct 6, 2022
- Apple Inc.
- Douglas G. FOURNIER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Connectors for Interconnecting Microelectronic Circuits
- Publication number 20210257758
- Publication date Aug 19, 2021
- Centipede Systems, Inc.
- Thomas H. Di Stefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATTERY ARCHITECTURE IN AN ELECTRONIC DEVICE
- Publication number 20200281097
- Publication date Sep 3, 2020
- Apple Inc.
- David A. PAKULA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DISPLAY MODULE & GLASS WITH UNDERCUT PLASTIC FRAME
- Publication number 20200221609
- Publication date Jul 9, 2020
- Apple Inc.
- Douglas G. FOURNIER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRICAL ASSEMBLY WITH A MULTILAYER BUS BOARD
- Publication number 20200060022
- Publication date Feb 20, 2020
- Interplex Industries, Inc.
- Richard Schneider
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BI-DIRECTIONAL HEATSINK DAMPENING FORCE SYSTEM
- Publication number 20190244877
- Publication date Aug 8, 2019
- Cisco Technology, Inc.
- Phil Slight
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY CONNECTION ARRANGEMENT
- Publication number 20190190110
- Publication date Jun 20, 2019
- Cambium Networks Limited
- Paul Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SYSTEM OF AN ELECTRONIC MODULE AND CONDUCTIVE FABRIC AND...
- Publication number 20190098753
- Publication date Mar 28, 2019
- Flextronics AP, LLC
- Weifeng Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLID STATE RELAY
- Publication number 20180241386
- Publication date Aug 23, 2018
- Zonit Structured Solutions, LLC
- Steve Chapel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB MODULE WITH MULTI-SURFACE HEAT DISSIPATION STRUCTURE, HEAT DISS...
- Publication number 20180014426
- Publication date Jan 11, 2018
- Ku Yong KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR CONFIGURING A VERTICAL INTERCONNECTION ACC...
- Publication number 20170359896
- Publication date Dec 14, 2017
- Board of Regents, The University of Texas System
- Chi Yen Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A MICROELECTRONIC DEVICE STRUCTURE, AND RELATED...
- Publication number 20170311451
- Publication date Oct 26, 2017
- QUARTZDYNE, INC.
- Mark Hahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH DENSITY SENSOR MODULE
- Publication number 20170254680
- Publication date Sep 7, 2017
- HON HAI PRECISION INDUSTRY CO., LTD.
- TSUNG-JU WU
- G01 - MEASURING TESTING
Information Patent Application
MULTI-LAYER PCB HAVING FUNCTION OF DISSIPATING HEAT FROM POWER SEM...
- Publication number 20170208704
- Publication date Jul 20, 2017
- MDM Inc.
- Ku Yong KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sleeved Coaxial Printed Circuit Board Vias
- Publication number 20170208695
- Publication date Jul 20, 2017
- Massachusetts Institute of Technology
- Glenn A. Brigham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER FRAME WITH POLYMER MATRIX AND METHODS OF FABRICATION
- Publication number 20170127527
- Publication date May 4, 2017
- Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies C...
- Dror Hurwitz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COAXIAL COPPER PILLAR
- Publication number 20170047281
- Publication date Feb 16, 2017
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS

Metallic cylinders

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal component and ceramic substrate

Display module and glass with undercut plastic frame

Wiring substrate

Printed circuit board

Solid state relay

Solid state relay

Connectors for interconnecting microelectronic circuits

Display module and glass with undercut plastic frame

Battery architecture in an electronic device

Method of integrating an electronic module with conductive fabric

Bottom package with metal post interconnections

Bi-directional heatsink dampening force system

Connection assembly for connecting a thin conductor piece to a thic...

Radio frequency connection arrangement

Cu column, Cu core column, solder joint, and through-silicon via

Flexible printed wiring board, electronic device having flexible pr...

Electrical assembly with a multilayer bus board

Battery architecture in an electronic device

Sold state relay

Conductor connection structure for plate-like routing members

Display module and glass with undercut plastic frame

Low-profile space-efficient shielding for SIP module

Battery bridge and method for activating an electronic device

Printed circuit board with embedded sensor

Multilayer bus board

Stacked circuit board architecture in an electronic device

Method of enhancing fatigue life of grid arrays

Electronic component device and method for manufacturing the same

Sleeved coaxial printed circuit board vias

Power supply board

Patents Applicationslast 30 patents

ELECTRONIC DEVICE INCLUDING SHIELDING STRUCTURE FOR REDUCING MOUNTI...

METHOD FOR MANUFACTURING EMBEDDED DEVICE PACKAGING SUBSTRATE, PACKA...

CIRCUIT MODULE AND SUBSTRATE MODULE

CONTROL DEVICE AND MANUFACTURING METHOD

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

ANTENNA ARRAY ARCHITECTURE WITH ELECTRICALLY CONDUCTIVE COLUMNS BET...

PACKAGING MODULE AND ELECTRONIC DEVICE

METAL COMPONENT AND CERAMIC SUBSTRATE

ADDITIVE MANUFACTURING TECHNOLOGY MICROWAVE VERTICAL LAUNCH

PRINTED CIRCUIT BOARD

STUD BUMPED PRINTED CIRCUIT ASSEMBLY

Circuit Board Assembly

WIRING SUBSTRATE

DISPLAY MODULE & GLASS WITH UNDERCUT PLASTIC FRAME

Connectors for Interconnecting Microelectronic Circuits

BATTERY ARCHITECTURE IN AN ELECTRONIC DEVICE

DISPLAY MODULE & GLASS WITH UNDERCUT PLASTIC FRAME

ELECTRICAL ASSEMBLY WITH A MULTILAYER BUS BOARD

BI-DIRECTIONAL HEATSINK DAMPENING FORCE SYSTEM

RADIO FREQUENCY CONNECTION ARRANGEMENT

INTEGRATED SYSTEM OF AN ELECTRONIC MODULE AND CONDUCTIVE FABRIC AND...

SOLID STATE RELAY

PCB MODULE WITH MULTI-SURFACE HEAT DISSIPATION STRUCTURE, HEAT DISS...

APPARATUS AND METHOD FOR CONFIGURING A VERTICAL INTERCONNECTION ACC...

METHODS OF FORMING A MICROELECTRONIC DEVICE STRUCTURE, AND RELATED...

HIGH DENSITY SENSOR MODULE

MULTI-LAYER PCB HAVING FUNCTION OF DISSIPATING HEAT FROM POWER SEM...

Sleeved Coaxial Printed Circuit Board Vias

INTERPOSER FRAME WITH POLYMER MATRIX AND METHODS OF FABRICATION

COAXIAL COPPER PILLAR