Metallic fillers

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CPC
H05K2201/0215

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/0215Metallic fillers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Process of fabricating a beaded path on the surface of a substrate,...
- Patent number 11,856,709
- Issue date Dec 26, 2023
- AGNIESZKA MAGDZIARZ CADENAS
- Zbigniew Rozynek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elastic printed conductors
- Patent number 11,849,540
- Issue date Dec 19, 2023
- The Governors of the University of Alberta
- Hyun-Joong Chung
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Printed circuit board and vehicle including the same
- Patent number 11,832,387
- Issue date Nov 28, 2023
- Hyundai Mobis Co., Ltd.
- Myeong Je Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 11,784,154
- Issue date Oct 10, 2023
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 11,710,716
- Issue date Jul 25, 2023
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency filtering of printed wiring board direct current di...
- Patent number 11,452,202
- Issue date Sep 20, 2022
- Raytheon Company
- John W. Hauff
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 11,404,391
- Issue date Aug 2, 2022
- Dexerials Corporation
- Seiichiro Shinohara
- B32 - LAYERED PRODUCTS
Information Patent Grant
Integrated electrical component within laminate
- Patent number 11,375,618
- Issue date Jun 28, 2022
- The Diller Corporation
- Robert Jacob Kramer
- B32 - LAYERED PRODUCTS
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 11,348,891
- Issue date May 31, 2022
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elastic printed conductors
- Patent number 11,343,910
- Issue date May 24, 2022
- The Governors of the University of Alberta
- Hyun-Joong Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board
- Patent number 11,324,120
- Issue date May 3, 2022
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Tsuyoshi Takemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and light emitting device including circuit board
- Patent number 11,304,291
- Issue date Apr 12, 2022
- Kyocera Corporation
- Yuichi Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of creating a flexible circuit
- Patent number 11,184,975
- Issue date Nov 23, 2021
- Carnegie Mellon University
- Alexandros Charalambides
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication process for flip chip bump bonds using nano-LEDs and co...
- Patent number 11,166,384
- Issue date Nov 2, 2021
- Konica Minolta Laboratory U.S.A., Inc.
- Karsten Bruening
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing anisotropic conductive film using vertical...
- Patent number 11,161,988
- Issue date Nov 2, 2021
- Korea Advanced Institute of Science and Technology
- KyoungWook Paik
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Metal-on-ceramic substrates
- Patent number 11,046,051
- Issue date Jun 29, 2021
- Materion Corporation
- Richard J. Koba
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipating device
- Patent number 11,051,392
- Issue date Jun 29, 2021
- TEAM GROUP INC.
- Chin Feng Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive sheet and conductive pattern
- Patent number 11,011,281
- Issue date May 18, 2021
- Dongwoo Fine-Chem Co., Ltd.
- Byung Hoon Song
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Sheet-shaped stretchable structure, and resin composition for stret...
- Patent number 10,966,317
- Issue date Mar 30, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takatoshi Abe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Printed wiring board and switching regulator
- Patent number 10,952,326
- Issue date Mar 16, 2021
- Murata Manufacturing Co., Ltd.
- Akinori Hamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal coating composition containing metal nanoparticles to pre...
- Patent number 10,800,930
- Issue date Oct 13, 2020
- International Business Machines Corporation
- Dylan J. Boday
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Packaged microelectronic component mounting using sinter attachment
- Patent number 10,806,021
- Issue date Oct 13, 2020
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and switching regulator
- Patent number 10,694,622
- Issue date Jun 23, 2020
- Murata Manufacturing Co., Ltd.
- Akinori Hamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry method of metallizing polymer thick film surfaces
- Patent number 10,588,220
- Issue date Mar 10, 2020
- Molex, LLC
- Patrick Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Producing an apparatus by covering an electronic component with a c...
- Patent number 10,479,897
- Issue date Nov 19, 2019
- International Business Machines Corporation
- Dylan J. Boday
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for the electrical passivation of electrode arrays and/or co...
- Patent number 10,448,514
- Issue date Oct 15, 2019
- Ecole Polytechnique Federale de Lausanne (EPFL)
- Ivan Rusev Minev
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated electrical component within laminate
- Patent number 10,440,828
- Issue date Oct 8, 2019
- The Diller Corporation
- Robert Jacob Kramer
- B32 - LAYERED PRODUCTS
Information Patent Grant
Conductive sheet and conductive pattern
- Patent number 10,430,003
- Issue date Oct 1, 2019
- DONGWOO FINE-CHEM CO.. LTD.
- Byung Hoon Song
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Packaged microelectronic component mounting using sinter attachment
- Patent number 10,405,417
- Issue date Sep 3, 2019
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board having conductive polymer
- Patent number 10,299,367
- Issue date May 21, 2019
- Avary Holding (Shenzhen) Co., Limited.
- Ming-Jaan Ho
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
THERMALLY IMPROVED PCB FOR SEMICONDUCTOR POWER DIE CONNECTED BY VIA...
- Publication number 20240237208
- Publication date Jul 11, 2024
- Mitsubishi Electric Corporation
- REMI PERRIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE HAVING AN IN-SUBSTRATE INDUCTOR AND METHOD FOR MAKING THE IN...
- Publication number 20240204039
- Publication date Jun 20, 2024
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL F...
- Publication number 20240182614
- Publication date Jun 6, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Masashi KODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSPARENT CONDUCTING FILM AND METHOD FOR FORMING TRANSPARENT COND...
- Publication number 20240188220
- Publication date Jun 6, 2024
- Resonac Corporation
- Shigeru YAMAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BEVELED OVERBURDEN FOR VIAS AND METHOD OF MAKING THE SAME
- Publication number 20230380062
- Publication date Nov 23, 2023
- Corning Incorporated
- DHANANJAY JOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRODE OR WIRING, ELECTRODE PAIR, AND METHOD FOR PRODUCING ELECT...
- Publication number 20230223165
- Publication date Jul 13, 2023
- Murata Manufacturing Co., Ltd.
- Yasunori HIOKI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20230217596
- Publication date Jul 6, 2023
- FLEXIUM INTERCONNECT, INC.
- Wei-Kuo CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND VEHICLE INCLUDING THE SAME
- Publication number 20230073345
- Publication date Mar 9, 2023
- HYUNDAI MOBIS CO., LTD.
- Myeong Je KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND METHOD OF PRODUCING THE SAME
- Publication number 20220262760
- Publication date Aug 18, 2022
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY FILTERING OF PRINTED WIRING BOARD DIRECT CURRENT DI...
- Publication number 20220192009
- Publication date Jun 16, 2022
- Raytheon Company
- John W. Hauff
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...
- Publication number 20210243893
- Publication date Aug 5, 2021
- YAZAKI CORPORATION
- Yukito AOYAMA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
STRETCHABLE WIRING BODY AND STRETCHABLE BOARD
- Publication number 20210136912
- Publication date May 6, 2021
- FUJIKURA LTD.
- Kazutoshi Koshimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATING DEVICE
- Publication number 20210100090
- Publication date Apr 1, 2021
- TEAM GROUP INC.
- CHIN FENG CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL COATING FOR ELECTRONIC DEVICES AND METHODS OF COATING
- Publication number 20210084770
- Publication date Mar 18, 2021
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Mark M. Swartz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND LIGHT EMITTING DEVICE PROVIDED WITH SAME
- Publication number 20210037644
- Publication date Feb 4, 2021
- KYOCERA CORPORATION
- Yuichi ABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRICATION PROCESS FOR FLIP CHIP BUMP BONDS USING NANO-LEDS AND CO...
- Publication number 20200305288
- Publication date Sep 24, 2020
- KONICA MINOLTA LABORATORY U.S.A., INC.
- Karsten Bruening
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND SWITCHING REGULATOR
- Publication number 20200260584
- Publication date Aug 13, 2020
- Murata Manufacturing Co., Ltd.
- Akinori HAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FREE SOLDER PASTE FOR THERMAL VIA FILLING
- Publication number 20200230750
- Publication date Jul 23, 2020
- Indium Corporation
- Ning-Cheng Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND LIGHT EMITTING DEVICE INCLUDING CIRCUIT BOARD
- Publication number 20200214123
- Publication date Jul 2, 2020
- KYOCERA CORPORATION
- Yuichi ABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND METHOD OF PRODUCING THE SAME
- Publication number 20200091105
- Publication date Mar 19, 2020
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- B32 - LAYERED PRODUCTS
Information Patent Application
INTEGRATED ELECTRICAL COMPONENT WITHIN LAMINATE
- Publication number 20200037449
- Publication date Jan 30, 2020
- THE DILLER CORPORATION
- Robert Jacob Kramer
- B32 - LAYERED PRODUCTS
Information Patent Application
A Flexible Circuit and a Method of Manufacture
- Publication number 20200022255
- Publication date Jan 16, 2020
- Carnegie Mellon University
- Alexandros Charalamides
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING ELEMENT
- Publication number 20190387616
- Publication date Dec 19, 2019
- CHUNGHWA PICTURE TUBES, LTD.
- Wen-Jiunn Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHEET-SHAPED STRETCHABLE STRUCTURE, AND RESIN COMPOSITION FOR STRET...
- Publication number 20190110361
- Publication date Apr 11, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- TAKATOSHI ABE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DRY METHOD OF METALLIZING POLYMER THICK FILM SURFACES
- Publication number 20190029119
- Publication date Jan 24, 2019
- Molex, LLC
- Patrick Weber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAGNETIC PARTICLE EMBEDDED FLEX OR PRINTED FLEX FOR MAGNETIC TRAY O...
- Publication number 20180376591
- Publication date Dec 27, 2018
- Intel Corporation
- Yoshihiro Tomita
- A41 - WEARING APPAREL
Information Patent Application
PACKAGED MICROELECTRONIC COMPONENT MOUNTING USING SINTER ATTACHMENT
- Publication number 20180317312
- Publication date Nov 1, 2018
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated electrical component within laminate
- Publication number 20180302987
- Publication date Oct 18, 2018
- THE DILLER CORPORATION
- Robert Jacob Kramer
- B32 - LAYERED PRODUCTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM INCLUDING POLYMER LAYER RESTRICTING MOV...
- Publication number 20180298206
- Publication date Oct 18, 2018
- Korea Advanced Institute of Science and Technology
- KyoungWook Paik
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD HAVING CONDUCTIVE POLYMER
- Publication number 20180070437
- Publication date Mar 8, 2018
- Avary Holding (Shenzhen) Co., Limited.
- MING-JAAN HO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Metallic fillers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Process of fabricating a beaded path on the surface of a substrate,...

Elastic printed conductors

Printed circuit board and vehicle including the same

Anisotropic conductive film and method of producing the same

Anisotropic conductive film and method of producing the same

Radio frequency filtering of printed wiring board direct current di...

Anisotropic conductive film and method of producing the same

Integrated electrical component within laminate

Anisotropic conductive film and method of producing the same

Elastic printed conductors

Flexible printed circuit board

Circuit board and light emitting device including circuit board

Method of creating a flexible circuit

Fabrication process for flip chip bump bonds using nano-LEDs and co...

Method of manufacturing anisotropic conductive film using vertical...

Metal-on-ceramic substrates

Heat dissipating device

Conductive sheet and conductive pattern

Sheet-shaped stretchable structure, and resin composition for stret...

Printed wiring board and switching regulator

Conformal coating composition containing metal nanoparticles to pre...

Packaged microelectronic component mounting using sinter attachment

Printed wiring board and switching regulator

Dry method of metallizing polymer thick film surfaces

Producing an apparatus by covering an electronic component with a c...

Method for the electrical passivation of electrode arrays and/or co...

Integrated electrical component within laminate

Conductive sheet and conductive pattern

Packaged microelectronic component mounting using sinter attachment

Circuit board having conductive polymer

Patents Applicationslast 30 patents

THERMALLY IMPROVED PCB FOR SEMICONDUCTOR POWER DIE CONNECTED BY VIA...

DEVICE HAVING AN IN-SUBSTRATE INDUCTOR AND METHOD FOR MAKING THE IN...

RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL F...

TRANSPARENT CONDUCTING FILM AND METHOD FOR FORMING TRANSPARENT COND...

BEVELED OVERBURDEN FOR VIAS AND METHOD OF MAKING THE SAME

ELECTRODE OR WIRING, ELECTRODE PAIR, AND METHOD FOR PRODUCING ELECT...

FLEXIBLE CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND VEHICLE INCLUDING THE SAME

ANISOTROPIC CONDUCTIVE FILM AND METHOD OF PRODUCING THE SAME

RADIO FREQUENCY FILTERING OF PRINTED WIRING BOARD DIRECT CURRENT DI...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...

STRETCHABLE WIRING BODY AND STRETCHABLE BOARD

HEAT DISSIPATING DEVICE

CONFORMAL COATING FOR ELECTRONIC DEVICES AND METHODS OF COATING

CIRCUIT BOARD AND LIGHT EMITTING DEVICE PROVIDED WITH SAME

FABRICATION PROCESS FOR FLIP CHIP BUMP BONDS USING NANO-LEDS AND CO...

PRINTED WIRING BOARD AND SWITCHING REGULATOR

LEAD-FREE SOLDER PASTE FOR THERMAL VIA FILLING

CIRCUIT BOARD AND LIGHT EMITTING DEVICE INCLUDING CIRCUIT BOARD

ANISOTROPIC CONDUCTIVE FILM AND METHOD OF PRODUCING THE SAME

INTEGRATED ELECTRICAL COMPONENT WITHIN LAMINATE

A Flexible Circuit and a Method of Manufacture

LIGHT EMITTING ELEMENT

SHEET-SHAPED STRETCHABLE STRUCTURE, AND RESIN COMPOSITION FOR STRET...

DRY METHOD OF METALLIZING POLYMER THICK FILM SURFACES

MAGNETIC PARTICLE EMBEDDED FLEX OR PRINTED FLEX FOR MAGNETIC TRAY O...

PACKAGED MICROELECTRONIC COMPONENT MOUNTING USING SINTER ATTACHMENT

Integrated electrical component within laminate

ANISOTROPIC CONDUCTIVE FILM INCLUDING POLYMER LAYER RESTRICTING MOV...

CIRCUIT BOARD HAVING CONDUCTIVE POLYMER