Metallic part with specific elastic properties

Industry

CPC
H05K2201/0311

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0311Metallic part with specific elastic properties

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Stretchable laminate, material for stretchable device, and stretcha...
- Patent number 11,864,310
- Issue date Jan 2, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takatoshi Abe
- A41 - WEARING APPAREL
Information Patent Grant
Printed circuit board
- Patent number 11,439,022
- Issue date Sep 6, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Young Il Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly with thermal fuse, an electric motor and a driv...
- Patent number 11,393,650
- Issue date Jul 19, 2022
- Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Wuerzburg
- Matthias Markert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display module and display device
- Patent number 11,307,442
- Issue date Apr 19, 2022
- BOE Technology Group Co., Ltd.
- Yongda Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board interconnection and methods
- Patent number 11,304,308
- Issue date Apr 12, 2022
- Metrospec Technology, LLC
- Henry V. Holec
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly with thermal fuse, an electric motor and a driv...
- Patent number 10,784,067
- Issue date Sep 22, 2020
- Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Wuerzburg
- Matthias Markert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics assembly for coupling two circuit boards
- Patent number 10,749,283
- Issue date Aug 18, 2020
- Sevcon Limited
- Gary Squire
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deformable electrical contacts with conformable target pads
- Patent number 10,750,614
- Issue date Aug 18, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuse element
- Patent number 10,714,287
- Issue date Jul 14, 2020
- HKR AUTOMOTIVE GMBH
- Wolfgang Bass
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave module
- Patent number 10,707,910
- Issue date Jul 7, 2020
- Mitsubishi Electric Corporation
- Yukinobu Tarui
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method and device for coupling multiple ground planes
- Patent number 10,658,608
- Issue date May 19, 2020
- Intel Corporation
- Douglas G. Bennett
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module and method for producing an electronic module
- Patent number 10,653,020
- Issue date May 12, 2020
- Robert Bosch GmbH
- Uwe Liskow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated electronic component and mounting structure thereof
- Patent number 10,629,372
- Issue date Apr 21, 2020
- Murata Manufacturing Co., Ltd.
- Yasuo Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support structure including conductive paths and electronic device...
- Patent number 10,534,405
- Issue date Jan 14, 2020
- Samsung Electronics Co., Ltd.
- Min-Soo Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flexible circuit board interconnection and methods
- Patent number 10,499,511
- Issue date Dec 3, 2019
- Metrospec Technology, LLC
- Henry V. Holec
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric motor having SMD components and associated connection comp...
- Patent number 10,483,828
- Issue date Nov 19, 2019
- Continental Automotive GmbH
- Werner Wallrafen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High current flexible feedthrough for use with a power converter
- Patent number 10,463,863
- Issue date Nov 5, 2019
- General Electric Company
- Tobias Schuetz
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Printed circuit board assembly
- Patent number 10,347,451
- Issue date Jul 9, 2019
- Mando Corporation
- Moon Jung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit structure
- Patent number 10,285,274
- Issue date May 7, 2019
- AutoNetworks Technologies, Ltd.
- Arinobu Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power converter
- Patent number 10,244,617
- Issue date Mar 26, 2019
- Omron Corporation
- Shingo Nagaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optoelectronic assembly and method for producing an optoelectronic...
- Patent number 9,974,177
- Issue date May 15, 2018
- Osram GmbH
- Thomas Preuschl
- F21 - LIGHTING
Information Patent Grant
Integrated PCB interconnect system
- Patent number 9,941,567
- Issue date Apr 10, 2018
- L-3 Communications Corporation
- Brent A. Boudreaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic interference shielding and strain relief structures...
- Patent number 9,888,562
- Issue date Feb 6, 2018
- Apple Inc.
- Shayan Malek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and electronic apparatus
- Patent number 9,867,274
- Issue date Jan 9, 2018
- Fujitsu Limited
- Jun Taguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including wiring on a stretchable/contractible base
- Patent number 9,826,629
- Issue date Nov 21, 2017
- Samsung Display Co., Ltd.
- Won Il Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection member for an electronic device
- Patent number 9,799,975
- Issue date Oct 24, 2017
- Samsung Electronics Co., Ltd.
- Juneseok Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for coupling multiple ground planes
- Patent number 9,799,845
- Issue date Oct 24, 2017
- Intel Corporation
- Douglas G. Bennett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector with low-stress, reduced-electrical-length con...
- Patent number 9,787,039
- Issue date Oct 10, 2017
- Hubbell Incorporated
- Shadi Alex AbuGhazaleh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket with routed contacts
- Patent number 9,768,536
- Issue date Sep 19, 2017
- Hewlett Packard Enterprise Development LP
- Kevin Leigh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board interconnection and methods
- Patent number 9,736,946
- Issue date Aug 15, 2017
- Metrospec Technology, LLC
- Henry V. Holec
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HIGH PERFORMANCE INTERPOSER AND CHIP SOCKET
- Publication number 20230156917
- Publication date May 18, 2023
- Amphenol Corporation
- Paul R. Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRETCHABLE LAMINATE, MATERIAL FOR STRETCHABLE DEVICE, AND STRETCHA...
- Publication number 20220201850
- Publication date Jun 23, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- Takatoshi ABE
- A41 - WEARING APPAREL
Information Patent Application
DISPLAY MODULE AND DISPLAY DEVICE
- Publication number 20210333610
- Publication date Oct 28, 2021
- BOE TECHNOLOGY GROUP CO., LTD.
- Yongda Ma
- G02 - OPTICS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20210068261
- Publication date Mar 4, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Young Il Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLY WITH THERMAL FUSE, AN ELECTRIC MOTOR AND A DRIV...
- Publication number 20200381205
- Publication date Dec 3, 2020
- BROSE FAHRZEUGTEILE GMBH & CO. KOMMANDITGESELLSCHAFT, WUERZBURG
- MATTHIAS MARKERT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD INTERCONNECTION AND METHODS
- Publication number 20200275556
- Publication date Aug 27, 2020
- METROSPEC TECHNOLOGY, LLC
- Henry V. Holec
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Module and Method for Producing an Electronic Module
- Publication number 20200045839
- Publication date Feb 6, 2020
- ROBERT BOSCH GmbH
- Uwe Liskow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND DEVICE FOR COUPLING MULTIPLE GROUND PLANES
- Publication number 20180205033
- Publication date Jul 19, 2018
- Intel Corporation
- Douglas G. Bennett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT BOARD INTERCONNECTION AND METHODS
- Publication number 20180063968
- Publication date Mar 1, 2018
- METROSPEC TECHNOLOGY, LLC
- Henry V. Holec
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electric Motor Having SMD Components and Associated Connection Comp...
- Publication number 20170271959
- Publication date Sep 21, 2017
- CONTINENTAL AUTOMOTIVE GMBH
- Werner WALLRAFEN
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20160219696
- Publication date Jul 28, 2016
- SAMSUNG DISPLAY CO., LTD.
- Won Il Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20150366050
- Publication date Dec 17, 2015
- Samsung Electronics Co., Ltd.
- Bo-in Noh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Micro-Spring Chip Attachment Using Solder-Based Interconnect Struct...
- Publication number 20140374912
- Publication date Dec 25, 2014
- John C. Knights
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20140328036
- Publication date Nov 6, 2014
- Tyco Electronics Corporation
- David Bruce Sarraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED ELECTRONIC COMPONENT AND MOUNTING STRUCTURE THEREOF
- Publication number 20140284091
- Publication date Sep 25, 2014
- Murata Manufacturing Co., Ltd.
- Yasuo FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible Metal Interconnect Structure
- Publication number 20140268596
- Publication date Sep 18, 2014
- Palo Alto Research Center Incorporated
- Eugene M. Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Device and Assemblies Made Therewith
- Publication number 20140262498
- Publication date Sep 18, 2014
- USA as represented by the Administrator of the National Aeronautics and Space...
- Jim D. Hester
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL OVERLOAD PROTECTION APPARATUS
- Publication number 20140232511
- Publication date Aug 21, 2014
- Phoenix Contact GmbH & Co. KG
- Rainer Durth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING SYSTEM OF CIRCUIT BOARDS
- Publication number 20140198471
- Publication date Jul 17, 2014
- Fujitsu Limited
- Naohiko Kajio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electromagnetic Interference Shielding and Strain Relief Structures...
- Publication number 20140177180
- Publication date Jun 26, 2014
- Apple Inc.
- Shayan Malek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MOUNTED ON A CIRCUIT BOARD
- Publication number 20140159990
- Publication date Jun 12, 2014
- OPTICON SENSORS EUROPE B.V.
- Alexander Azhari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING PACKAGE STRUCTURE WITH ELECTRONIC COMPONENT
- Publication number 20140080256
- Publication date Mar 20, 2014
- AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.
- JUN-YI XIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY HAVING A SUBSTRATE, AN SMD COMPONENT, AND A LEAD FRAME PART
- Publication number 20140001897
- Publication date Jan 2, 2014
- Werner Wallrafen
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SPRING FINGER INTERCONNECT
- Publication number 20130319739
- Publication date Dec 5, 2013
- Apple Inc.
- Shawn X. ARNOLD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Planar Contact with Solder
- Publication number 20130283608
- Publication date Oct 31, 2013
- Jack Seidler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PARTITION POST USED ON PRINTED CIRCUIT BOARD
- Publication number 20130255993
- Publication date Oct 3, 2013
- Shu-Li HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY, COMPONENT FOR AN ASSEMBLY AND METHOD OF MANUFACTURING AN...
- Publication number 20130200783
- Publication date Aug 8, 2013
- Nederlandse Organisatie voor toegepast-natuurweten schappelijk Onderzoek TNO
- Gerardus Titus Van Heck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TILE, ASSEMBLY OF TILES WITH A CARRIER, METHOD OF MANUFACTURING AN...
- Publication number 20130201636
- Publication date Aug 8, 2013
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEKTNO
- Jeroen Van Den Brand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL OVERLOAD PROTECTION APPARATUS
- Publication number 20130200983
- Publication date Aug 8, 2013
- Phoenix Contact GmbH & Co. KG
- Thomas Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY, METHOD OF ASSEMBLING, AND TILE FOR USE IN ASSEMBLY
- Publication number 20130201637
- Publication date Aug 8, 2013
- Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO
- Margaretha Maria De Kok
- H01 - BASIC ELECTRIC ELEMENTS

Metallic part with specific elastic properties

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Stretchable laminate, material for stretchable device, and stretcha...

Printed circuit board

Electronic assembly with thermal fuse, an electric motor and a driv...

Display module and display device

Flexible circuit board interconnection and methods

Electronic assembly with thermal fuse, an electric motor and a driv...

Electronics assembly for coupling two circuit boards

Deformable electrical contacts with conformable target pads

Fuse element

Microwave module

Method and device for coupling multiple ground planes

Electronic module and method for producing an electronic module

Laminated electronic component and mounting structure thereof

Support structure including conductive paths and electronic device...

Flexible circuit board interconnection and methods

Electric motor having SMD components and associated connection comp...

High current flexible feedthrough for use with a power converter

Printed circuit board assembly

Circuit structure

Power converter

Optoelectronic assembly and method for producing an optoelectronic...

Integrated PCB interconnect system

Electromagnetic interference shielding and strain relief structures...

Circuit board and electronic apparatus

Electronic device including wiring on a stretchable/contractible base

Connection member for an electronic device

Method and device for coupling multiple ground planes

Electrical connector with low-stress, reduced-electrical-length con...

Socket with routed contacts

Flexible circuit board interconnection and methods

Patents Applicationslast 30 patents

HIGH PERFORMANCE INTERPOSER AND CHIP SOCKET

STRETCHABLE LAMINATE, MATERIAL FOR STRETCHABLE DEVICE, AND STRETCHA...

DISPLAY MODULE AND DISPLAY DEVICE

PRINTED CIRCUIT BOARD

ELECTRONIC ASSEMBLY WITH THERMAL FUSE, AN ELECTRIC MOTOR AND A DRIV...

FLEXIBLE CIRCUIT BOARD INTERCONNECTION AND METHODS

Electronic Module and Method for Producing an Electronic Module

METHOD AND DEVICE FOR COUPLING MULTIPLE GROUND PLANES

FLEXIBLE CIRCUIT BOARD INTERCONNECTION AND METHODS

Electric Motor Having SMD Components and Associated Connection Comp...

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE

Micro-Spring Chip Attachment Using Solder-Based Interconnect Struct...

ELECTRONIC DEVICE

LAMINATED ELECTRONIC COMPONENT AND MOUNTING STRUCTURE THEREOF

Flexible Metal Interconnect Structure

Interconnect Device and Assemblies Made Therewith

THERMAL OVERLOAD PROTECTION APPARATUS

CONNECTING SYSTEM OF CIRCUIT BOARDS

Electromagnetic Interference Shielding and Strain Relief Structures...

ANTENNA MOUNTED ON A CIRCUIT BOARD

METHOD FOR MANUFACTURING PACKAGE STRUCTURE WITH ELECTRONIC COMPONENT

ASSEMBLY HAVING A SUBSTRATE, AN SMD COMPONENT, AND A LEAD FRAME PART

SPRING FINGER INTERCONNECT

Planar Contact with Solder

PARTITION POST USED ON PRINTED CIRCUIT BOARD

ASSEMBLY, COMPONENT FOR AN ASSEMBLY AND METHOD OF MANUFACTURING AN...

TILE, ASSEMBLY OF TILES WITH A CARRIER, METHOD OF MANUFACTURING AN...

THERMAL OVERLOAD PROTECTION APPARATUS

ASSEMBLY, METHOD OF ASSEMBLING, AND TILE FOR USE IN ASSEMBLY