Metallised walls

Industry

CPC
H05K2201/09981

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09981Metallised walls

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electromagnetic wave transmission board comprising an inner board w...
- Patent number 12,074,357
- Issue date Aug 27, 2024
- BOARDTEK ELECTRONICS CORPORATION
- Chung-Hsing Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate
- Patent number 11,589,457
- Issue date Feb 21, 2023
- Kyocera Corporation
- Seiichirou Itou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display panel and method for manufacturing display panel
- Patent number 11,532,602
- Issue date Dec 20, 2022
- BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
- Chao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible cable including a transmission line having an air gap conf...
- Patent number 11,444,363
- Issue date Sep 13, 2022
- Samsung Electronics Co., Ltd.
- Bumhee Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including connection structure for electrically c...
- Patent number 11,445,597
- Issue date Sep 13, 2022
- Samsung Electronics Co., Ltd.
- Wonsub Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Connection substrate and interposer substrate including the same
- Patent number 11,206,736
- Issue date Dec 21, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yun Je Ji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power supplies including shielded multilayer power transmission boards
- Patent number 11,129,275
- Issue date Sep 21, 2021
- Astec International Limited
- Prabou Ranganathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating methods for modular and/or ganged waveguides for automatic...
- Patent number 10,944,148
- Issue date Mar 9, 2021
- Advantest Corporation
- Don Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power supplies including shielded multilayer power transmission boards
- Patent number 10,798,818
- Issue date Oct 6, 2020
- Astec International Limited
- Prabou Ranganathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure comprising an inductor and resistor
- Patent number 10,586,774
- Issue date Mar 10, 2020
- Rohm Co., Ltd.
- Takuma Shimoichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency coupling and transition structure
- Patent number 10,225,925
- Issue date Mar 5, 2019
- NXP USA, INC.
- Li Qiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Passive within via
- Patent number 9,960,079
- Issue date May 1, 2018
- Intel Corporation
- Todd B. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cortical implant system for brain stimulation and recording
- Patent number 9,949,376
- Issue date Apr 17, 2018
- Second Sight Medical Products, Inc.
- Robert J Greenberg
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Noise blocking printed circuit board and manufacturing method thereof
- Patent number 9,907,157
- Issue date Feb 27, 2018
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Se Jong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radio frequency coupling structure and a method of manufacturing th...
- Patent number 9,887,449
- Issue date Feb 6, 2018
- NXP USA, INC.
- Li Qiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a package for embedding one or more electro...
- Patent number 9,848,500
- Issue date Dec 19, 2017
- Sony Corporation
- Thomas Merkle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assigning control channels
- Patent number 9,723,709
- Issue date Aug 1, 2017
- Todd Steigerwald
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layered manufacturing of free-form multi-material micro-components
- Patent number 9,545,669
- Issue date Jan 17, 2017
- Digital Metal AB
- Thorbjörn Åklint
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of manufacturing a package for embedding one or more electro...
- Patent number 9,398,694
- Issue date Jul 19, 2016
- Sony Corporation
- Thomas Merkle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Making multi-layer micro-wire structure
- Patent number 9,345,144
- Issue date May 17, 2016
- Eastman Kodak Company
- Ronald Steven Cok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Guarded printed circuit board islands
- Patent number 9,326,369
- Issue date Apr 26, 2016
- Keithley Instruments, Inc.
- James A. Niemann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector pin on springs
- Patent number 9,257,765
- Issue date Feb 9, 2016
- Amazon Technologies, Inc.
- Nidhi Rathi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing wiring substrate having built-in component
- Patent number 9,167,702
- Issue date Oct 20, 2015
- NGK Spark Plug Co., Ltd.
- Kenji Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector pin on springs
- Patent number 8,995,141
- Issue date Mar 31, 2015
- Amazon Technologies, Inc.
- Nidhi Rathi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Proximity sensor
- Patent number 8,742,350
- Issue date Jun 3, 2014
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Yufeng Yao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for suppressing power plane noise
- Patent number 8,743,555
- Issue date Jun 3, 2014
- Micron Technology, Inc.
- Houfei Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for collective fabrication of 3D electronic modules comprisi...
- Patent number 8,716,036
- Issue date May 6, 2014
- 3D Plus
- Christian Val
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board
- Patent number 8,705,248
- Issue date Apr 22, 2014
- Ibiden Co., Ltd.
- Sotaro Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board having circumferential shielding layer
- Patent number 8,592,690
- Issue date Nov 26, 2013
- Hon Hai Precision Industry Co., Ltd.
- John Chow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrates, systems, and devices including structures for suppressi...
- Patent number 8,508,950
- Issue date Aug 13, 2013
- Micron Technology, Inc.
- Houfei Chen
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
Ultra-Thin Sandwich Component
- Publication number 20240314928
- Publication date Sep 19, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier For Waveguide Applications
- Publication number 20240292518
- Publication date Aug 29, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Heinrich Trischler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier For Waveguide Applications
- Publication number 20230413421
- Publication date Dec 21, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Heinrich Trischler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL MODULE ASSEMBLY, OPTICAL MODULE, PACKAGE FOR OPTICAL MODULE...
- Publication number 20230380057
- Publication date Nov 23, 2023
- Sumitomo Electric Industries, Ltd.
- Taichi MISAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE, CHIP, CIRCUIT PACKAGE AND FABRICATION PROCESS
- Publication number 20230262906
- Publication date Aug 17, 2023
- Alibaba (China) Co., Ltd.
- Hui LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSMISSION BOARD TO CARRY ELECTROMAGNETIC WAVE WITHOUT LEAKAGE AN...
- Publication number 20230025696
- Publication date Jan 26, 2023
- BOARDTEK ELECTRONICS CORPORATION
- CHUNG-HSING LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20210127486
- Publication date Apr 29, 2021
- KYOCERA CORPORATION
- Seiichirou ITOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SUPPLIES INCLUDING SHIELDED MULTILAYER POWER TRANSMISSION BOARDS
- Publication number 20210007221
- Publication date Jan 7, 2021
- Astec International Limited
- Prabou RANGANATHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING CONNECTION STRUCTURE FOR ELECTRICALLY C...
- Publication number 20200375020
- Publication date Nov 26, 2020
- Samsung Electronics Co., Ltd.
- Wonsub LIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLEXIBLE CABLE
- Publication number 20200359493
- Publication date Nov 12, 2020
- Samsung Electronics Co., Ltd.
- Bumhee BAE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY PANEL AND METHOD FOR MANUFACTURING DISPLAY PANEL
- Publication number 20200312820
- Publication date Oct 1, 2020
- BOE TECHNOLOGY GROUP CO., LTD.
- Chao LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING WIRING ON SIDE PORTION OF SUBSTRATE
- Publication number 20200022263
- Publication date Jan 16, 2020
- TETOS Co., Ltd.
- Kun Ho SONG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING A PACKAGE FOR EMBEDDING ONE OR MORE ELECTRO...
- Publication number 20160366770
- Publication date Dec 15, 2016
- SONY CORPORATION
- Thomas MERKLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR PIN ON SPRINGS
- Publication number 20150171531
- Publication date Jun 18, 2015
- AMAZON TECHNOLOGIES, INC.
- Nidhi Rathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUARDED PRINTED CIRCUIT BOARD ISLANDS
- Publication number 20140376201
- Publication date Dec 25, 2014
- James A. Niemann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAKING MULTI-LAYER MICRO-WIRE STRUCTURE
- Publication number 20140306382
- Publication date Oct 16, 2014
- Ronald Steven Cok
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS FOR SUPPRESSING POWER PLANE NOISE
- Publication number 20130326871
- Publication date Dec 12, 2013
- Micron Technology, Inc.
- Houfei Chen
- G11 - INFORMATION STORAGE
Information Patent Application
PASSIVE WITHIN VIA
- Publication number 20130249112
- Publication date Sep 26, 2013
- Todd B. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Collective Fabrication of 3D Electronic Modules Comprisi...
- Publication number 20130171752
- Publication date Jul 4, 2013
- 3D PLUS
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT ARRANGEMENT FOR ELECTRONIC AND/OR ELECTRICAL COMPONENTS
- Publication number 20130128480
- Publication date May 23, 2013
- ROBERT BOSCH GmbH
- Alexander Bareiss
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING WIRING SUBSTRATE HAVING BUILT-IN COMPONENT
- Publication number 20130074332
- Publication date Mar 28, 2013
- NGK Spark Plug Co., Ltd.
- Kenji SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD AND THE MANUFACTURING METHOD THEREOF
- Publication number 20130033837
- Publication date Feb 7, 2013
- Sotaro Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20130012145
- Publication date Jan 10, 2013
- NEC Corporation
- Akinobu Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD HAVING CIRCUMFERENTIAL SHIELDING LAYER
- Publication number 20120247826
- Publication date Oct 4, 2012
- HON HAI PRECISION INDUSTRY CO., LTD.
- JOHN CHOW
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A PACKAGE FOR EMBEDDING ONE OR MORE ELECTRO...
- Publication number 20120182066
- Publication date Jul 19, 2012
- SONY CORPORATION
- Thomas MERKLE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sensor Element Having Through-Hole Plating
- Publication number 20120111726
- Publication date May 10, 2012
- Dulce Maria Couto Petri
- G01 - MEASURING TESTING
Information Patent Application
THROUGH WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20120103677
- Publication date May 3, 2012
- FUJIKURA LTD.
- Satoshi YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Proximity Sensor
- Publication number 20110297832
- Publication date Dec 8, 2011
- Avago Technologies ECBU IP (Singapore) Pte. Ltd.
- Yufeng Yao
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD FOR EMBEDDING A COMPONENT IN A BASE
- Publication number 20110266041
- Publication date Nov 3, 2011
- Risto TUOMINEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF EMBEDDING PASSIVE COMPONENT WITHIN VIA
- Publication number 20110198723
- Publication date Aug 18, 2011
- Todd B. Myers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Metallised walls

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electromagnetic wave transmission board comprising an inner board w...

Wiring substrate

Display panel and method for manufacturing display panel

Flexible cable including a transmission line having an air gap conf...

Electronic device including connection structure for electrically c...

Connection substrate and interposer substrate including the same

Power supplies including shielded multilayer power transmission boards

Plating methods for modular and/or ganged waveguides for automatic...

Power supplies including shielded multilayer power transmission boards

Structure comprising an inductor and resistor

Radio frequency coupling and transition structure

Passive within via

Cortical implant system for brain stimulation and recording

Noise blocking printed circuit board and manufacturing method thereof

Radio frequency coupling structure and a method of manufacturing th...

Method of manufacturing a package for embedding one or more electro...

Method for assigning control channels

Layered manufacturing of free-form multi-material micro-components

Method of manufacturing a package for embedding one or more electro...

Making multi-layer micro-wire structure

Guarded printed circuit board islands

Connector pin on springs

Method of manufacturing wiring substrate having built-in component

Connector pin on springs

Proximity sensor

Methods for suppressing power plane noise

Method for collective fabrication of 3D electronic modules comprisi...

Multilayer printed circuit board

Circuit board having circumferential shielding layer

Substrates, systems, and devices including structures for suppressi...

Patents Applicationslast 30 patents

Ultra-Thin Sandwich Component

Component Carrier For Waveguide Applications

Component Carrier For Waveguide Applications

OPTICAL MODULE ASSEMBLY, OPTICAL MODULE, PACKAGE FOR OPTICAL MODULE...

SUBSTRATE, CHIP, CIRCUIT PACKAGE AND FABRICATION PROCESS

TRANSMISSION BOARD TO CARRY ELECTROMAGNETIC WAVE WITHOUT LEAKAGE AN...

WIRING BOARD

POWER SUPPLIES INCLUDING SHIELDED MULTILAYER POWER TRANSMISSION BOARDS

ELECTRONIC DEVICE INCLUDING CONNECTION STRUCTURE FOR ELECTRICALLY C...

FLEXIBLE CABLE

DISPLAY PANEL AND METHOD FOR MANUFACTURING DISPLAY PANEL

METHOD OF FORMING WIRING ON SIDE PORTION OF SUBSTRATE

METHOD OF MANUFACTURING A PACKAGE FOR EMBEDDING ONE OR MORE ELECTRO...

CONNECTOR PIN ON SPRINGS

GUARDED PRINTED CIRCUIT BOARD ISLANDS

MAKING MULTI-LAYER MICRO-WIRE STRUCTURE

METHODS FOR SUPPRESSING POWER PLANE NOISE

PASSIVE WITHIN VIA

Method for Collective Fabrication of 3D Electronic Modules Comprisi...

CIRCUIT ARRANGEMENT FOR ELECTRONIC AND/OR ELECTRICAL COMPONENTS

METHOD OF MANUFACTURING WIRING SUBSTRATE HAVING BUILT-IN COMPONENT

MULTILAYER PRINTED CIRCUIT BOARD AND THE MANUFACTURING METHOD THEREOF

RADIO MODULE AND MANUFACTURING METHOD THEREFOR

CIRCUIT BOARD HAVING CIRCUMFERENTIAL SHIELDING LAYER

METHOD OF MANUFACTURING A PACKAGE FOR EMBEDDING ONE OR MORE ELECTRO...

Sensor Element Having Through-Hole Plating

THROUGH WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF

Proximity Sensor

METHOD FOR EMBEDDING A COMPONENT IN A BASE

METHOD OF EMBEDDING PASSIVE COMPONENT WITHIN VIA