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Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/80
Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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Patents Grants
last 30 patents
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Patent Grant
Embedded cooling systems for advanced device packaging and methods...
Patent number
12,368,087
Issue date
Jul 22, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor memory device
Patent number
12,368,121
Issue date
Jul 22, 2025
SK hynix Inc.
Yu Jin Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device bonding apparatus and method of manufacturing a package usin...
Patent number
12,368,128
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Yi-Jung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded nanoparticles for on-die thermal enhancement of hybrid bon...
Patent number
12,368,131
Issue date
Jul 22, 2025
Micron Technology, Inc.
Bang-Ning Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded memory devices and methods of making the same
Patent number
12,362,301
Issue date
Jul 15, 2025
SanDisk Technologies, Inc.
Adarsh Rajashekhar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding layer and process of making
Patent number
12,362,304
Issue date
Jul 15, 2025
Tokyo Electron Limited
Robert D. Clark
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacture
Patent number
12,362,261
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Chia Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices and data storage systems including the same
Patent number
12,362,302
Issue date
Jul 15, 2025
Samsung Electronics Co., Ltd.
Moorym Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing the same
Patent number
12,362,344
Issue date
Jul 15, 2025
Samsung Electronics Co., Ltd.
Juhyeon Kim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
Patent number
12,362,326
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Image sensor and method of manufacturing the same
Patent number
12,364,047
Issue date
Jul 15, 2025
Samsung Electronics Co., Ltd.
Doowon Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
12,364,040
Issue date
Jul 15, 2025
Samsung Electronics Co., Ltd.
Donghoon Gang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heterogeneous dielectric bonding scheme
Patent number
12,362,315
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stack type semiconductor device and method of testing the stack typ...
Patent number
12,362,324
Issue date
Jul 15, 2025
SK hynix Inc.
Seong Hwi Song
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method
Patent number
12,362,291
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Kuo-Chiang Ting
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with redistribution structure and method for f...
Patent number
12,354,965
Issue date
Jul 8, 2025
NANYA TECHNOLOGY CORPORATION
Shing-Yih Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package structure and storage system
Patent number
12,354,941
Issue date
Jul 8, 2025
CHANGXIN MEMORY TECHNOLOGIES, INC.
Shu-Liang Ning
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and manufacturing method thereof
Patent number
12,354,929
Issue date
Jul 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Kai-Fung Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Memory device including memory chip and peripheral memory chip and...
Patent number
12,354,985
Issue date
Jul 8, 2025
Samsung Electronics Co., Ltd.
Jooyong Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three-dimensional memory device and fabrication method
Patent number
12,354,994
Issue date
Jul 8, 2025
Yangtze Memory Technologies Co., Ltd.
Zhiyong Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of fabricating package structure
Patent number
12,355,008
Issue date
Jul 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-role semiconductor device substrates, semiconductor device as...
Patent number
12,354,939
Issue date
Jul 8, 2025
Micron Technology, Inc.
Hong Wan Ng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package and method of fabricating the same
Patent number
12,355,007
Issue date
Jul 8, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Signal routing between memory die and logic die for performing oper...
Patent number
12,354,649
Issue date
Jul 8, 2025
Micron Technology, Inc.
Aliasger T. Zaidy
G06 - COMPUTING CALCULATING COUNTING
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Patent Grant
Semiconductor structure and method for fabricating same
Patent number
12,347,765
Issue date
Jul 1, 2025
CHANGXIN MEMORY TECHNOLOGIES, INC.
Ling-Yi Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dummy pattern structure for reducing dishing
Patent number
12,347,792
Issue date
Jul 1, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Jen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, manufacturing method, solid state image senso...
Patent number
12,347,798
Issue date
Jul 1, 2025
Sony Group Corporation
Masaki Haneda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded assembly including interconnect-level bonding pads and metho...
Patent number
12,347,804
Issue date
Jul 1, 2025
SanDisk Technologies, Inc.
Lin Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three dimensional (3D) memory device and fabrication method
Patent number
12,347,787
Issue date
Jul 1, 2025
Yangtze Memory Technologies Co., Ltd.
Chuanhai Shan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor memory device and manufacturing method thereof
Patent number
12,349,354
Issue date
Jul 1, 2025
SK hynix Inc.
Dong Hwan Lee
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHO...
Publication number
20250239504
Publication date
Jul 24, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE STRUCTURE HAVING HYBRID BOND STRUCTURE WITH AI...
Publication number
20250239544
Publication date
Jul 24, 2025
NANYA TECHNOLOGY CORPORATION
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TREATMENT PROCESS FOR WAFER BONDING PROCESSES
Publication number
20250239564
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FRONT-TO-FRONT BONDING IN A STACKED MEMORY SYSTEM
Publication number
20250239574
Publication date
Jul 24, 2025
Micron Technology, Inc.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY DEVICE
Publication number
20250240979
Publication date
Jul 24, 2025
Samsung Electronics Co., Ltd.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MEMORY DEVICE, METHOD OF FABRICATING THE SAME, AND EL...
Publication number
20250240957
Publication date
Jul 24, 2025
Samsung Electronics Co., Ltd.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE STRUCTURE HAVING HYBRID BOND STRUCTURE WITH AI...
Publication number
20250239546
Publication date
Jul 24, 2025
NANYA TECHNOLOGY CORPORATION
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDED DEVICE STRUCTURES WITH IMPROVED STRESS DISTRIBUTION AND REDU...
Publication number
20250239548
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing Company Limited
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTICAL CONNECTOR UNIT FOR A PHOTONIC ASSEMBLY AND METHODS FOR FORM...
Publication number
20250239578
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing Company Limited
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP STRUCTURE INCLUDING OPTICAL INTEGRATED CIRCUIT CHIP, AND SEMIC...
Publication number
20250239577
Publication date
Jul 24, 2025
Samsung Electronics Co., Ltd.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE WITH INTERPOSER DIES
Publication number
20250239579
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE STRUCTURE HAVING HYBRID BOND STRUCTURE WITH AI...
Publication number
20250239547
Publication date
Jul 24, 2025
NANYA TECHNOLOGY CORPORATION
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME
Publication number
20250240978
Publication date
Jul 24, 2025
Samsung Electronics Co., Ltd.
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-DIE LAYER MEMORY DEVICE
Publication number
20250234564
Publication date
Jul 17, 2025
Rambus Inc.
Thomas VOGELSANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, HYBRID BONDING INSULA...
Publication number
20250233103
Publication date
Jul 17, 2025
HD MICROSYSTEMS, LTD.
Satoshi YONEDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Packages and Methods of Forming Same
Publication number
20250233115
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES
Publication number
20250234554
Publication date
Jul 17, 2025
Yunjo Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE USING HIGH STRESS CLEAVE PLANE
Publication number
20250233117
Publication date
Jul 17, 2025
Silicon Genesis Corporation
Theodore E. FONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED SEMICONDUCTOR PACKAGING SYSTEM WITH ENHANCED DIELECTRIC-...
Publication number
20250233106
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Jen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20250233113
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Ting CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A SCHOTTKY SOURCE CONTACT...
Publication number
20250234543
Publication date
Jul 17, 2025
SANDISK TECHNOLOGIES LLC
Tatsuya HINOUE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A P-I-N JUNCTION SOURCE C...
Publication number
20250234545
Publication date
Jul 17, 2025
SANDISK TECHNOLOGIES LLC
Masanori TSUTSUMI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM AND METHOD FOR CLEANING SILICON AND HYDROCARBON CONTACT RESI...
Publication number
20250233105
Publication date
Jul 17, 2025
Ontos Equipment Systems, Inc.
DANIEL PASCUAL
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
INTEGRATED BONDING PADS WITH CONVEX SIDEWALLS AND METHODS FOR FORMI...
Publication number
20250233091
Publication date
Jul 17, 2025
SANDISK TECHNOLOGIES LLC
Adarsh Rajashekhar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR C...
Publication number
20250233095
Publication date
Jul 17, 2025
Samsung Electronics Co., Ltd.
Jaesic Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR LOW TEMPERATURE BONDING OF SUBSTRATES
Publication number
20250233104
Publication date
Jul 17, 2025
SUSS MicroTec Solutions GmbH & Co. KG
Thomas SCHMIDT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20250226278
Publication date
Jul 10, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Ming-Hsien Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250226361
Publication date
Jul 10, 2025
Samsung Electronics Co., Ltd.
Dawoon JUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20250226355
Publication date
Jul 10, 2025
Powerchip Semiconductor Manufacturing Corporation
Chun-Lin Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RELIABLE HYBRID BONDED APPARATUS
Publication number
20250226356
Publication date
Jul 10, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS