Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected

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H01L2224/80

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wafer bonding device and wafer bonding method
- Patent number 12,315,839
- Issue date May 27, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphite thin film/silicon substrate laminated assembly, process fo...
- Patent number 12,315,778
- Issue date May 27, 2025
- National Institute of Advanced Industrial Science and Technology
- Masataka Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device structure
- Patent number 12,317,579
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive buffer layers for semiconductor die assemblies and assoc...
- Patent number 12,315,833
- Issue date May 27, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and semiconductor apparatus manufacturing m...
- Patent number 12,317,627
- Issue date May 27, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Tadashi Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device having a contact plug electrically conn...
- Patent number 12,317,500
- Issue date May 27, 2025
- Kioxia Corporation
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and methods of formation
- Patent number 12,317,517
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 12,308,343
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, related electronic systems, and methods of...
- Patent number 12,308,333
- Issue date May 20, 2025
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package device
- Patent number 12,308,323
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seamless bonding layers in semiconductor packages and methods of fo...
- Patent number 12,300,639
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DBI to SI bonding for simplified handle wafer
- Patent number 12,300,662
- Issue date May 13, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact for thermal displacement in a multi-wafer stacked...
- Patent number 12,300,669
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ping-Tzu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bond pad structure
- Patent number 12,300,670
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sin-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector and method for forming the same
- Patent number 12,300,645
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion apparatus and system
- Patent number 12,302,662
- Issue date May 13, 2025
- Canon Kabushiki Kaisha
- Nobuyuki Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device and methods for forming the same
- Patent number 12,300,317
- Issue date May 13, 2025
- Yangtze Memory Technologies Co., Ltd.
- Mingkang Zhang
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional memory devices and methods for forming the same
- Patent number 12,300,648
- Issue date May 13, 2025
- Yangtze Memory Technologies Co., Ltd.
- Yuancheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable hybrid bonded apparatus
- Patent number 12,300,661
- Issue date May 13, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge-trimming methods for wafer bonding and dicing
- Patent number 12,300,664
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a bonded semiconductor structure
- Patent number 12,300,660
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding pads and methods of forming the same
- Patent number 12,300,644
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 12,300,575
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor package including memory array
- Patent number 12,293,999
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Feng Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,293,991
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip sharing data bus
- Patent number 12,293,993
- Issue date May 6, 2025
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having hybrid bonding pad
- Patent number 12,293,982
- Issue date May 6, 2025
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming the same
- Patent number 12,293,985
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing process including forming a bond...
- Patent number 12,288,719
- Issue date Apr 29, 2025
- SanDisk Technologies, Inc.
- Takuya Maehara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures for three-dimensional memory devices and methods...
- Patent number 12,283,547
- Issue date Apr 22, 2025
- Yangtze Memory Technologies Co., Ltd.
- Di Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD
- Publication number 20250174599
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Jihoon JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Aligning Bonding Pads with Bonding Locations...
- Publication number 20250174594
- Publication date May 29, 2025
- Canon Kabushiki Kaisha
- Dwayne L. LaBrake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR IMPROVING FUSION BONDING
- Publication number 20250174595
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hong-Ta Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250174609
- Publication date May 29, 2025
- Industrial Technology Research Institute
- Chao-Kai HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED IC STRUCTURE WITH ORTHOGONAL INTERCONNECT LAYERS
- Publication number 20250174561
- Publication date May 29, 2025
- Adeia Semiconductor Inc.
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBING BUMP PLACEMENT OVER MULTIPLE VIA OPENINGS
- Publication number 20250174501
- Publication date May 29, 2025
- Xilinx, Inc.
- Andy WIDJAJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20250174517
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20250176171
- Publication date May 29, 2025
- Yangtze Memory Technologies Co., Ltd.
- Yaqin LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20250176194
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- INHO CHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING CRACK-RESISTANT BACKSIDE...
- Publication number 20250169070
- Publication date May 22, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Kota FUNAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR A BACKSIDE PACKAGE ARCHITECTURE
- Publication number 20250167193
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PACKAGE STRUCTURE, PACKAGE STRUCTURE, AND METHOD FOR FORMIN...
- Publication number 20250164709
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Stacking with Integrated Thermal Treatment
- Publication number 20250167167
- Publication date May 22, 2025
- Applied Materials, Inc.
- Ying WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...
- Publication number 20250167171
- Publication date May 22, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20250167075
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jen Lien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM INCLUDING A PLURALITY OF DIE HEADS WITH RELEASABLY COUPLED D...
- Publication number 20250167165
- Publication date May 22, 2025
- Canon Kabushiki Kaisha
- Byung-Jin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...
- Publication number 20250167172
- Publication date May 22, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRIMMING METHOD OF STACKED STRUCTURE AND STACKED STRUCTURE FORMED T...
- Publication number 20250167150
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-An Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250169071
- Publication date May 22, 2025
- SK HYNIX INC.
- Do Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Integration of Passive Devices
- Publication number 20250167176
- Publication date May 22, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20250160096
- Publication date May 15, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES FOR HIGH-DENSITY METAL-TO-METAL BONDING AND METH...
- Publication number 20250157963
- Publication date May 15, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Adarsh RAJASHEKHAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250157980
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jinkyeong SEOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC CHIP, MEMORY CHIP, CHIP STACK STRUCTURE, AND MEMORY
- Publication number 20250158003
- Publication date May 15, 2025
- CXMT CORPORATION
- Jiarui ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20250160095
- Publication date May 15, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20250157957
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- YONGBUM KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250157983
- Publication date May 15, 2025
- SAMSUNG ELECTRONICS CO., LTD.
- HYUNGJUN JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Manufacturing Display Device and Display Device Manufact...
- Publication number 20250158000
- Publication date May 15, 2025
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Yosuke TSUKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Multiple TSVs with Different Formation Schemes
- Publication number 20250157889
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME
- Publication number 20250159897
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Youngji NOH
- H01 - BASIC ELECTRIC ELEMENTS

Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wafer bonding device and wafer bonding method

Graphite thin film/silicon substrate laminated assembly, process fo...

Method for manufacturing semiconductor device structure

Conductive buffer layers for semiconductor die assemblies and assoc...

Semiconductor apparatus and semiconductor apparatus manufacturing m...

Semiconductor memory device having a contact plug electrically conn...

Semiconductor die package and methods of formation

Semiconductor device and method of forming the same

Microelectronic devices, related electronic systems, and methods of...

Package-on-package device

Seamless bonding layers in semiconductor packages and methods of fo...

DBI to SI bonding for simplified handle wafer

Backside contact for thermal displacement in a multi-wafer stacked...

Hybrid bond pad structure

Connector and method for forming the same

Photoelectric conversion apparatus and system

Three-dimensional memory device and methods for forming the same

Three-dimensional memory devices and methods for forming the same

Reliable hybrid bonded apparatus

Edge-trimming methods for wafer bonding and dicing

Method of forming a bonded semiconductor structure

Die bonding pads and methods of forming the same

Semiconductor package and method

3D semiconductor package including memory array

Semiconductor packages and methods of forming same

3D chip sharing data bus

Semiconductor structure having hybrid bonding pad

Integrated circuit packages and methods of forming the same

Semiconductor device manufacturing process including forming a bond...

Contact structures for three-dimensional memory devices and methods...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD

System and Method for Aligning Bonding Pads with Bonding Locations...

METHODS AND SYSTEMS FOR IMPROVING FUSION BONDING

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

STACKED IC STRUCTURE WITH ORTHOGONAL INTERCONNECT LAYERS

PROBING BUMP PLACEMENT OVER MULTIPLE VIA OPENINGS

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

MEMORY DEVICE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING CRACK-RESISTANT BACKSIDE...

SYSTEM AND METHODS FOR A BACKSIDE PACKAGE ARCHITECTURE

OPTICAL PACKAGE STRUCTURE, PACKAGE STRUCTURE, AND METHOD FOR FORMIN...

Die Stacking with Integrated Thermal Treatment

MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE

SYSTEM INCLUDING A PLURALITY OF DIE HEADS WITH RELEASABLY COUPLED D...

MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...

TRIMMING METHOD OF STACKED STRUCTURE AND STACKED STRUCTURE FORMED T...

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME

Wafer Level Integration of Passive Devices

MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE

BONDING STRUCTURES FOR HIGH-DENSITY METAL-TO-METAL BONDING AND METH...

SEMICONDUCTOR PACKAGE

LOGIC CHIP, MEMORY CHIP, CHIP STACK STRUCTURE, AND MEMORY

MICRODEVICE INTEGRATION INTO SYSTEM SUBSTRATE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR PACKAGE

Method For Manufacturing Display Device and Display Device Manufact...

Forming Multiple TSVs with Different Formation Schemes

SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME