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Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90

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  • H01L2224/91
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/91Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Package process and package structure
    • Patent number 11,222,866
    • Issue date Jan 11, 2022
    • Advanced Semiconductor Engineering, Inc.
    • Chi-Chih Shen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Package process and package structure
    • Patent number 9,698,120
    • Issue date Jul 4, 2017
    • Advanced Semiconductor Engineering, Inc.
    • Chi-Chih Shen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Package process and package structure
    • Patent number 8,618,645
    • Issue date Dec 31, 2013
    • Advanced Semiconductor Engineering, Inc.
    • Chi-Chih Shen
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    PACKAGE PROCESS AND PACKAGE STRUCTURE
    • Publication number 20220157775
    • Publication date May 19, 2022
    • Advanced Semiconductor Engineering, Inc.
    • Chi-Chih SHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE PROCESS AND PACKAGE STRUCTURE
    • Publication number 20170278823
    • Publication date Sep 28, 2017
    • Advanced Semiconductor Engineering, Inc.
    • Chi-Chih SHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE PROCESS AND PACKAGE STRUCTURE
    • Publication number 20140087519
    • Publication date Mar 27, 2014
    • Advanced Semiconductor Engineering, Inc.
    • Chi-Chih Shen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE PROCESS AND PACKAGE STRUCTURE
    • Publication number 20110074004
    • Publication date Mar 31, 2011
    • Advanced Semiconductor Engineering, Inc.
    • Chi-Chih Shen
    • H01 - BASIC ELECTRIC ELEMENTS