Methods of manufacturing bonding areas involving a specific sequence of method steps

Industry

CPC
H01L2224/039

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/039Methods of manufacturing bonding areas involving a specific sequence of method steps

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Display panel, display device, and manufacturing method of display...
- Patent number 12,336,413
- Issue date Jun 17, 2025
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Ping Wen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Curved light-emitting substrate
- Patent number 12,328,941
- Issue date Jun 10, 2025
- Shanghai Tianma Micro-Electronics Co., Ltd.
- Zhenhai Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing a semiconductor d...
- Patent number 12,322,717
- Issue date Jun 3, 2025
- ams AG
- Jens Hofrichter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device including re-distribution pads disposed at dif...
- Patent number 12,288,761
- Issue date Apr 29, 2025
- SK Hynix Inc.
- Jun Yong Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 12,283,557
- Issue date Apr 22, 2025
- United Microelectronics Corp.
- Aaron Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 12,261,074
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,255,173
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ling-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,243,837
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation structure with planar top surfaces
- Patent number 12,218,022
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit test method and structure thereof
- Patent number 12,205,853
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor package and method of manufactu...
- Patent number 12,199,056
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Jumyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure having elastic memb...
- Patent number 12,198,977
- Issue date Jan 14, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-molded leadframes in semiconductor devices
- Patent number 12,191,273
- Issue date Jan 7, 2025
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframes in semiconductor devices
- Patent number 12,183,703
- Issue date Dec 31, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive with brain-like elasticity and integrality based on sta...
- Patent number 12,176,902
- Issue date Dec 24, 2024
- iCometrue Company Ltd.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,170,259
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Ju Bin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-shot encapsulation
- Patent number 12,166,001
- Issue date Dec 10, 2024
- Semtech Corporation
- Kok Khoon Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,165,997
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Hung Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump coplanarity for semiconductor device assembly and methods of m...
- Patent number 12,154,879
- Issue date Nov 26, 2024
- Micron Technology, Inc.
- Ko Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabrcating the same
- Patent number 12,148,732
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Iterative formation of damascene interconnects
- Patent number 12,148,721
- Issue date Nov 19, 2024
- Raytheon Company
- Eric R. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 12,136,602
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned and planarized under-bump metallization
- Patent number 12,119,316
- Issue date Oct 15, 2024
- NXP USA, INC.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,119,314
- Issue date Oct 15, 2024
- Mitsubishi Electric Corporation
- Nobuyoshi Kimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of manufacturing same
- Patent number 12,074,126
- Issue date Aug 27, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer chip scale package
- Patent number 12,057,417
- Issue date Aug 6, 2024
- Texas Instruments Incorporated
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with metal film on surface between passivation...
- Patent number 12,057,416
- Issue date Aug 6, 2024
- Sumitomo Electric Industries, Ltd.
- Mitsuhiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device with removable probe pads
- Patent number 12,051,631
- Issue date Jul 30, 2024
- Micron Technology, Inc.
- Naoki Yokoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming conductive layer, and conductive structure and f...
- Patent number 12,040,292
- Issue date Jul 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ming-Teng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer metallic structure and method
- Patent number 12,040,293
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VERTICAL WIRING OF A SEMICONDUCTOR COMPONENT
- Publication number 20250239489
- Publication date Jul 24, 2025
- Siemens Healthineers AG
- Michael HOSEMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST PAD STRUCTURE AND METHOD OF MANUFACTURING AND OPERATING THE SAME
- Publication number 20250226269
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-CHUNG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE
- Publication number 20250201617
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20250201743
- Publication date Jun 19, 2025
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Bogeng Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250201747
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Shiun Sheu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20250183204
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250174585
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Hyeonjae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESS FOR PROBING BUMP PLACEMENT ON MULTIPLE SMALL POWER PA...
- Publication number 20250149390
- Publication date May 8, 2025
- Xilinx, Inc.
- Andy WIDJAJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PASSIVE DEVICES FOR INTEGRATED CIRCUITS AND METHODS OF FOR...
- Publication number 20250149427
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Yueh Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION STRUCTURE WITH PLANAR TOP SURFACES
- Publication number 20250140627
- Publication date May 1, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC STRUCTURE FOR HIGH SPEED INTERCONNECT AND RELIABILITY EN...
- Publication number 20250118690
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-WAFER FACE-TO-BACK HYBRID BONDING WITHOUT SUPPORT CARRIER
- Publication number 20250112047
- Publication date Apr 3, 2025
- ADVANCED MICRO DEVICES, INC.
- Chandra Sekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device And Method Of Manufacturing The Same
- Publication number 20250105180
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Hung Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...
- Publication number 20250105181
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Jumyong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING A PILLAR SHELL INTERCONNECT AND AN INN...
- Publication number 20250087611
- Publication date Mar 13, 2025
- QUALCOMM Incorporated
- Yujen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE STRUCTURE, SEMICONDUCTOR CHIP INCLUDING THE SAME AND MAN...
- Publication number 20250087612
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- JUNHYUN AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP COPLANARITY FOR SEMICONDUCTOR DEVICE ASSEMBLY AND METHODS OF M...
- Publication number 20250087614
- Publication date Mar 13, 2025
- Micron Technology, Inc.
- Ko Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250079360
- Publication date Mar 6, 2025
- MEDIATEK INC.
- Cheng Lin HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20250054885
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Hsiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250054892
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250054891
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Ju Bin SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE ATTACHMENT OF PLASMA-ETCH-DICED RFID INTEGRATED CIRCUITS W...
- Publication number 20250038139
- Publication date Jan 30, 2025
- Impinj, Inc.
- James GUZZO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20250033138
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLAT METAL FEATURES FOR MICROELECTRONICS APPLICATIONS
- Publication number 20250022752
- Publication date Jan 16, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250022823
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Ju-Il CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250022758
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Yongho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING OPENING IN PASSIVATION LAYER AND STRUCTURES THEREOF
- Publication number 20240395741
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Hao SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240387450
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND TEST METHOD THEREOF
- Publication number 20240387297
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CHIP SCALE PACKAGE
- Publication number 20240379597
- Publication date Nov 14, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS

Methods of manufacturing bonding areas involving a specific sequence of method steps

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display panel, display device, and manufacturing method of display...

Curved light-emitting substrate

Semiconductor device and method for manufacturing a semiconductor d...

Semiconductor device including re-distribution pads disposed at dif...

Integrated circuit structure

Info structure with copper pillar having reversed profile

Chip package structure

Semiconductor device and method

Passivation structure with planar top surfaces

Integrated circuit test method and structure thereof

Semiconductor device, semiconductor package and method of manufactu...

Manufacturing method of semiconductor structure having elastic memb...

Pre-molded leadframes in semiconductor devices

Leadframes in semiconductor devices

Logic drive with brain-like elasticity and integrality based on sta...

Semiconductor package and method of fabricating the same

Single-shot encapsulation

Semiconductor device and method of manufacturing the same

Bump coplanarity for semiconductor device assembly and methods of m...

Package structure and method of fabrcating the same

Iterative formation of damascene interconnects

Method of fabricating a semiconductor device

Patterned and planarized under-bump metallization

Semiconductor device and method for manufacturing semiconductor device

Semiconductor structure and method of manufacturing same

Wafer chip scale package

Semiconductor device with metal film on surface between passivation...

Stacked semiconductor device with removable probe pads

Method for forming conductive layer, and conductive structure and f...

Redistribution layer metallic structure and method

Patents Applicationslast 30 patents

VERTICAL WIRING OF A SEMICONDUCTOR COMPONENT

TEST PAD STRUCTURE AND METHOD OF MANUFACTURING AND OPERATING THE SAME

INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method

SEMICONDUCTOR DIE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

WAFER PROCESS FOR PROBING BUMP PLACEMENT ON MULTIPLE SMALL POWER PA...

EMBEDDED PASSIVE DEVICES FOR INTEGRATED CIRCUITS AND METHODS OF FOR...

PASSIVATION STRUCTURE WITH PLANAR TOP SURFACES

DIELECTRIC STRUCTURE FOR HIGH SPEED INTERCONNECT AND RELIABILITY EN...

CHIP-ON-WAFER FACE-TO-BACK HYBRID BONDING WITHOUT SUPPORT CARRIER

Semiconductor Device And Method Of Manufacturing The Same

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...

INTEGRATED DEVICE COMPRISING A PILLAR SHELL INTERCONNECT AND AN INN...

CONDUCTIVE STRUCTURE, SEMICONDUCTOR CHIP INCLUDING THE SAME AND MAN...

BUMP COPLANARITY FOR SEMICONDUCTOR DEVICE ASSEMBLY AND METHODS OF M...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

ADHESIVE ATTACHMENT OF PLASMA-ETCH-DICED RFID INTEGRATED CIRCUITS W...

Advanced Device Assembly Structures And Methods

FLAT METAL FEATURES FOR MICROELECTRONICS APPLICATIONS

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE

METHOD OF FORMING OPENING IN PASSIVATION LAYER AND STRUCTURES THEREOF

REDISTRIBUTION STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND TEST METHOD THEREOF

WAFER CHIP SCALE PACKAGE