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Methods of manufacturing bonding areas involving a specific sequence of method steps
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/039
Methods of manufacturing bonding areas involving a specific sequence of method steps
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last 30 patents
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Display panel, display device, and manufacturing method of display...
Patent number
12,336,413
Issue date
Jun 17, 2025
Chengdu BOE Optoelectronics Technology Co., Ltd.
Ping Wen
G06 - COMPUTING CALCULATING COUNTING
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Patent Grant
Curved light-emitting substrate
Patent number
12,328,941
Issue date
Jun 10, 2025
Shanghai Tianma Micro-Electronics Co., Ltd.
Zhenhai Yin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method for manufacturing a semiconductor d...
Patent number
12,322,717
Issue date
Jun 3, 2025
ams AG
Jens Hofrichter
B81 - MICRO-STRUCTURAL TECHNOLOGY
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Patent Grant
Semiconductor device including re-distribution pads disposed at dif...
Patent number
12,288,761
Issue date
Apr 29, 2025
SK Hynix Inc.
Jun Yong Song
H01 - BASIC ELECTRIC ELEMENTS
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Integrated circuit structure
Patent number
12,283,557
Issue date
Apr 22, 2025
United Microelectronics Corp.
Aaron Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Info structure with copper pillar having reversed profile
Patent number
12,261,074
Issue date
Mar 25, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsi-Kuei Cheng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Chip package structure
Patent number
12,255,173
Issue date
Mar 18, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Ling-Wei Li
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method
Patent number
12,243,837
Issue date
Mar 4, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Ting-Li Yang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Passivation structure with planar top surfaces
Patent number
12,218,022
Issue date
Feb 4, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Yi-Hsiu Chen
H01 - BASIC ELECTRIC ELEMENTS
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Integrated circuit test method and structure thereof
Patent number
12,205,853
Issue date
Jan 21, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Hsien-Wen Liu
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device, semiconductor package and method of manufactu...
Patent number
12,199,056
Issue date
Jan 14, 2025
Samsung Electronics Co., Ltd.
Jumyong Park
H01 - BASIC ELECTRIC ELEMENTS
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Manufacturing method of semiconductor structure having elastic memb...
Patent number
12,198,977
Issue date
Jan 14, 2025
NANYA TECHNOLOGY CORPORATION
Shing-Yih Shih
H01 - BASIC ELECTRIC ELEMENTS
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Pre-molded leadframes in semiconductor devices
Patent number
12,191,273
Issue date
Jan 7, 2025
Texas Instruments Incorporated
Sreenivasan K. Koduri
H01 - BASIC ELECTRIC ELEMENTS
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Leadframes in semiconductor devices
Patent number
12,183,703
Issue date
Dec 31, 2024
Texas Instruments Incorporated
Sreenivasan K. Koduri
H01 - BASIC ELECTRIC ELEMENTS
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Logic drive with brain-like elasticity and integrality based on sta...
Patent number
12,176,902
Issue date
Dec 24, 2024
iCometrue Company Ltd.
Jin-Yuan Lee
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package and method of fabricating the same
Patent number
12,170,259
Issue date
Dec 17, 2024
Samsung Electronics Co., Ltd.
Ju Bin Seo
H01 - BASIC ELECTRIC ELEMENTS
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Single-shot encapsulation
Patent number
12,166,001
Issue date
Dec 10, 2024
Semtech Corporation
Kok Khoon Ho
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device and method of manufacturing the same
Patent number
12,165,997
Issue date
Dec 10, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Ching-Hung Kao
H01 - BASIC ELECTRIC ELEMENTS
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Bump coplanarity for semiconductor device assembly and methods of m...
Patent number
12,154,879
Issue date
Nov 26, 2024
Micron Technology, Inc.
Ko Han Lin
H01 - BASIC ELECTRIC ELEMENTS
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Package structure and method of fabrcating the same
Patent number
12,148,732
Issue date
Nov 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hung-Jui Kuo
H01 - BASIC ELECTRIC ELEMENTS
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Iterative formation of damascene interconnects
Patent number
12,148,721
Issue date
Nov 19, 2024
Raytheon Company
Eric R. Miller
H01 - BASIC ELECTRIC ELEMENTS
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Method of fabricating a semiconductor device
Patent number
12,136,602
Issue date
Nov 5, 2024
Samsung Electronics Co., Ltd.
Ju-Il Choi
H01 - BASIC ELECTRIC ELEMENTS
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Patterned and planarized under-bump metallization
Patent number
12,119,316
Issue date
Oct 15, 2024
NXP USA, INC.
Namrata Kanth
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device and method for manufacturing semiconductor device
Patent number
12,119,314
Issue date
Oct 15, 2024
Mitsubishi Electric Corporation
Nobuyoshi Kimoto
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor structure and method of manufacturing same
Patent number
12,074,126
Issue date
Aug 27, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Liang Wang
H01 - BASIC ELECTRIC ELEMENTS
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Wafer chip scale package
Patent number
12,057,417
Issue date
Aug 6, 2024
Texas Instruments Incorporated
Masamitsu Matsuura
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device with metal film on surface between passivation...
Patent number
12,057,416
Issue date
Aug 6, 2024
Sumitomo Electric Industries, Ltd.
Mitsuhiko Sakai
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Stacked semiconductor device with removable probe pads
Patent number
12,051,631
Issue date
Jul 30, 2024
Micron Technology, Inc.
Naoki Yokoi
H01 - BASIC ELECTRIC ELEMENTS
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Method for forming conductive layer, and conductive structure and f...
Patent number
12,040,292
Issue date
Jul 16, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Ming-Teng Hsieh
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Redistribution layer metallic structure and method
Patent number
12,040,293
Issue date
Jul 16, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Shih Wei Bih
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
VERTICAL WIRING OF A SEMICONDUCTOR COMPONENT
Publication number
20250239489
Publication date
Jul 24, 2025
Siemens Healthineers AG
Michael HOSEMANN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
TEST PAD STRUCTURE AND METHOD OF MANUFACTURING AND OPERATING THE SAME
Publication number
20250226269
Publication date
Jul 10, 2025
Taiwan Semiconductor Manufacturing company Ltd.
MING-CHUNG WU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE
Publication number
20250201617
Publication date
Jun 19, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsi-Kuei Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
Publication number
20250201743
Publication date
Jun 19, 2025
Fujian Jinhua Integrated Circuit Co., Ltd.
Bogeng Guo
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20250201747
Publication date
Jun 19, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Tzu-Shiun Sheu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Semiconductor Device and Method
Publication number
20250183204
Publication date
Jun 5, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Ting-Li Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20250174585
Publication date
May 29, 2025
Samsung Electronics Co., Ltd.
Hyeonjae KIM
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
WAFER PROCESS FOR PROBING BUMP PLACEMENT ON MULTIPLE SMALL POWER PA...
Publication number
20250149390
Publication date
May 8, 2025
Xilinx, Inc.
Andy WIDJAJA
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
EMBEDDED PASSIVE DEVICES FOR INTEGRATED CIRCUITS AND METHODS OF FOR...
Publication number
20250149427
Publication date
May 8, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Chia-Yueh Chou
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
PASSIVATION STRUCTURE WITH PLANAR TOP SURFACES
Publication number
20250140627
Publication date
May 1, 2025
TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
Yi-Hsiu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIELECTRIC STRUCTURE FOR HIGH SPEED INTERCONNECT AND RELIABILITY EN...
Publication number
20250118690
Publication date
Apr 10, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Wen-Yi Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP-ON-WAFER FACE-TO-BACK HYBRID BONDING WITHOUT SUPPORT CARRIER
Publication number
20250112047
Publication date
Apr 3, 2025
ADVANCED MICRO DEVICES, INC.
Chandra Sekhar Mandalapu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device And Method Of Manufacturing The Same
Publication number
20250105180
Publication date
Mar 27, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Ching-Hung Kao
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...
Publication number
20250105181
Publication date
Mar 27, 2025
Samsung Electronics Co., Ltd.
Jumyong PARK
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
INTEGRATED DEVICE COMPRISING A PILLAR SHELL INTERCONNECT AND AN INN...
Publication number
20250087611
Publication date
Mar 13, 2025
QUALCOMM Incorporated
Yujen Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
CONDUCTIVE STRUCTURE, SEMICONDUCTOR CHIP INCLUDING THE SAME AND MAN...
Publication number
20250087612
Publication date
Mar 13, 2025
Samsung Electronics Co., Ltd.
JUNHYUN AN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
BUMP COPLANARITY FOR SEMICONDUCTOR DEVICE ASSEMBLY AND METHODS OF M...
Publication number
20250087614
Publication date
Mar 13, 2025
Micron Technology, Inc.
Ko Han Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20250079360
Publication date
Mar 6, 2025
MEDIATEK INC.
Cheng Lin HUANG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME
Publication number
20250054885
Publication date
Feb 13, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsing-Hsiang Wang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
Publication number
20250054892
Publication date
Feb 13, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chao-Wei Chiu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20250054891
Publication date
Feb 13, 2025
Samsung Electronics Co., Ltd.
Ju Bin SEO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ADHESIVE ATTACHMENT OF PLASMA-ETCH-DICED RFID INTEGRATED CIRCUITS W...
Publication number
20250038139
Publication date
Jan 30, 2025
Impinj, Inc.
James GUZZO
G06 - COMPUTING CALCULATING COUNTING
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Patent Application
Advanced Device Assembly Structures And Methods
Publication number
20250033138
Publication date
Jan 30, 2025
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Patent Application
FLAT METAL FEATURES FOR MICROELECTRONICS APPLICATIONS
Publication number
20250022752
Publication date
Jan 16, 2025
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20250022823
Publication date
Jan 16, 2025
Samsung Electronics Co., Ltd.
Ju-Il CHOI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE
Publication number
20250022758
Publication date
Jan 16, 2025
Samsung Electronics Co., Ltd.
Yongho KIM
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD OF FORMING OPENING IN PASSIVATION LAYER AND STRUCTURES THEREOF
Publication number
20240395741
Publication date
Nov 28, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chung-Hao SU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
REDISTRIBUTION STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20240387450
Publication date
Nov 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Hung-Jui Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND TEST METHOD THEREOF
Publication number
20240387297
Publication date
Nov 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsien-Wen Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER CHIP SCALE PACKAGE
Publication number
20240379597
Publication date
Nov 14, 2024
TEXAS INSTRUMENTS INCORPORATED
Masamitsu Matsuura
H01 - BASIC ELECTRIC ELEMENTS