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SEMICONDUCTOR PACKAGE
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Publication number 20240304561
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Publication date Sep 12, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Sen-Kuei Hsu
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H01 - BASIC ELECTRIC ELEMENTS
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RADIO FREQUENCY MODULE
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Publication number 20240304973
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Publication date Sep 12, 2024
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United Kingdom Research and Innovation
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Kai Parow-Souchon
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H01 - BASIC ELECTRIC ELEMENTS
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Apparatus
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Publication number 20240275016
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Publication date Aug 15, 2024
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Nokia Technologies Oy
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Mikko KOMULAINEN
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H01 - BASIC ELECTRIC ELEMENTS
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HIGH-FREQUENCY CIRCUIT
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Publication number 20240222835
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Publication date Jul 4, 2024
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Kabushiki Kaisha Toshiba
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Tamio KAWAGUCHI
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H01 - BASIC ELECTRIC ELEMENTS
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TRANSMISSION DEVICE
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Publication number 20240128626
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Publication date Apr 18, 2024
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Unimicron Technology Corp.
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Yu-Kuang WANG
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H01 - BASIC ELECTRIC ELEMENTS
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WIRING BOARD
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Publication number 20240121886
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Publication date Apr 11, 2024
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Nippon Telegraph and Telephone Corporation
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Miwa Muto
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H01 - BASIC ELECTRIC ELEMENTS
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MICROSTRIP CROSSTALK REDUCTION
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Publication number 20240098882
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Publication date Mar 21, 2024
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International Business Machines Corporation
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Matthew Doyle
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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MULTILAYER SUBSTRATE
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Publication number 20240074038
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Publication date Feb 29, 2024
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Murata Manufacturing Co., Ltd.
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Kentarou KAWABE
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H01 - BASIC ELECTRIC ELEMENTS
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CIRCUIT BOARD
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Publication number 20240008168
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Publication date Jan 4, 2024
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Murata Manufacturing Co., Ltd.
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Kosuke NISHIO
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR MODULE
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Publication number 20230387047
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Publication date Nov 30, 2023
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Mitsubishi Electric Corporation
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Takuma NISHIMURA
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H01 - BASIC ELECTRIC ELEMENTS