Microballoons or hollow filler particles

Industry

CPC
H05K2201/0254

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0254Microballoons or hollow filler particles

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Composite with hollow nano-structures and application thereof
- Patent number 11,252,816
- Issue date Feb 15, 2022
- National Chung-Hsing University
- Tzong-Ming Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct printing and writing using undercooled metallic core-shell p...
- Patent number 11,059,098
- Issue date Jul 13, 2021
- SAFI-Tech, Inc.
- Martin M. Thuo
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Forming conductive vias using healing layer
- Patent number 10,750,623
- Issue date Aug 18, 2020
- International Business Machines Corporation
- Matthew S. Doyle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transparent conductor, method for preparing the same, and optical d...
- Patent number 9,674,947
- Issue date Jun 6, 2017
- Samsung SDI Co., Ltd.
- Dae Seob Shim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for assembling electronic devices with adhesive
- Patent number 9,565,773
- Issue date Feb 7, 2017
- Apple Inc.
- John J. Baker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing dielectric loss in solder masks
- Patent number 9,526,180
- Issue date Dec 20, 2016
- Intel Corporation
- Dennis J. Miller
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Thermoplastic resin composition, resin article, and method of manuf...
- Patent number 9,365,693
- Issue date Jun 14, 2016
- Mitsubishi Engineering-Plastics Corporation
- Takahiro Takano
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Circuit materials, circuits laminates, and method of manufacture th...
- Patent number 9,258,892
- Issue date Feb 9, 2016
- Rogers Corporation
- Jessica Crosley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermosetting resin composition and board using the same
- Patent number 8,932,705
- Issue date Jan 13, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Chung-Kun Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-dielectric material
- Patent number 8,440,121
- Issue date May 14, 2013
- MBDA UK Limited
- Michael Dunleavy
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Multilayer circuit board and electronic device
- Patent number 8,217,270
- Issue date Jul 10, 2012
- Tohoku University
- Tadahiro Ohmi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polymerizable composition
- Patent number 7,964,685
- Issue date Jun 21, 2011
- Zeon Corporation
- Akihiko Yoshiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inorganic hollow particle, process for producing the same, and comp...
- Patent number 7,816,428
- Issue date Oct 19, 2010
- Denki Kagaku Kogyo Kabushiki Kaisha
- Shuji Sasaki
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Liquid crystalline polymeric compositions
- Patent number 7,128,847
- Issue date Oct 31, 2006
- E. I. Du Pont de Nemours and Company
- Michael Robert Samuels
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package having controlled height stand-off solder joint
- Patent number 6,986,454
- Issue date Jan 17, 2006
- Delphi Technologies, Inc.
- Morris D Stillabower
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive composition
- Patent number 6,835,331
- Issue date Dec 28, 2004
- Shin-Etsu Chemical Co., Ltd.
- Hironao Fujiki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Impregnated glass fiber strands and products including the same
- Patent number 6,593,255
- Issue date Jul 15, 2003
- PPG Industries Ohio, Inc.
- Ernest L. Lawton
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Impregnated glass fiber strands and products including the same
- Patent number 6,419,981
- Issue date Jul 16, 2002
- PPG Industries Ohio, Inc.
- Bruce E. Novich
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Alkali or acid corrodible organic or composite particles in resin m...
- Patent number 6,232,398
- Issue date May 15, 2001
- NEC Corporation
- Yoshitsugu Funada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Microsphere containing circuit board paper
- Patent number 6,042,936
- Issue date Mar 28, 2000
- FiberMark, Inc.
- Ulrich W. Kempf
- D21 - PAPER-MAKING PRODUCTION OF CELLULOSE
Information Patent Grant
Low dielectric constant microsphere filled layers for multilayer el...
- Patent number 5,785,789
- Issue date Jul 28, 1998
- Digital Equipment Corporation
- Gerald Gagnon
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit board assembly with foam substrate and method of making same
- Patent number 5,733,639
- Issue date Mar 31, 1998
- Poly Circuits/M-Wave
- Daniel T. Gosselin
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of producing a multi-layered ceramic circuit board
- Patent number 5,676,781
- Issue date Oct 14, 1997
- Fujitsu Limited
- Shigenori Aoki
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Dielectric composite
- Patent number 5,354,611
- Issue date Oct 11, 1994
- Rogers Corporation
- David J. Arthur
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyimide composition and prepreg and laminate thereof
- Patent number 5,279,895
- Issue date Jan 18, 1994
- Matsushita Electric Works, Ltd.
- Kenji Ogasawara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Fluoropolymer insulating material containing hollow microspheres
- Patent number 5,194,459
- Issue date Mar 16, 1993
- Junkosha Co., Ltd.
- Yoshiaki Sato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Copper/epoxy structures
- Patent number 5,183,972
- Issue date Feb 2, 1993
- Microelectronics and Computer Technology Corporation
- Diana C. Duane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating material and production thereof
- Patent number 5,141,972
- Issue date Aug 25, 1992
- W. L. Gore & Associates, Inc.
- Yoshiaki Sato
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Flame retardant, low dielectric constant microsphere filled laminate
- Patent number 5,126,192
- Issue date Jun 30, 1992
- International Business Machines Corporation
- Leroy N. Chellis
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermoplastic film, reinforced hollow glass microsphere reinforced...
- Patent number 5,098,781
- Issue date Mar 24, 1992
- General Electric Company
- Michael G. Minnick
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
SHEET FOR COMPONENT CARRIER COMPRISING SEPARATE STRUCTURES WITH FIL...
- Publication number 20240314927
- Publication date Sep 19, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Nina WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240206061
- Publication date Jun 20, 2024
- IBIDEN CO., LTD.
- Ryo ANDO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COATING AGENT AND METHOD FOR MANUFACTURING MODULE USING THE COATING...
- Publication number 20220124911
- Publication date Apr 21, 2022
- SEKISUI CHEMICAL CO., LTD.
- Satoru KUROZUMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Composite with Hollow Nano-Structures and Application Thereof
- Publication number 20200154565
- Publication date May 14, 2020
- National Chung Hsing University
- Tzong-Ming Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUCING DIELECTRIC LOSS IN SOLDER MASKS
- Publication number 20140345923
- Publication date Nov 27, 2014
- Dennis J. Miller
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
THERMOPLASTIC RESIN COMPOSITION, RESIN ARTICLE, AND METHOD OF MANUF...
- Publication number 20140147682
- Publication date May 29, 2014
- Takahiro Takano
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH-DIELECTRIC MATERIAL
- Publication number 20130341818
- Publication date Dec 26, 2013
- MBDA UK LIMITED
- Michael Dunleavy
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Nucleic Acids and Libraries
- Publication number 20120058917
- Publication date Mar 8, 2012
- King's College London
- Johannes Adrianus Gaken
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
INORGANIC HOLLOW POWDER, PROCESS FOR PRODUCING THE INORGANIC HOLLOW...
- Publication number 20100222487
- Publication date Sep 2, 2010
- Denki Kagaku Kogyo Kabushiki Kaisha
- Yasuhisa Nishi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING RESIN COMPOSITION AND BOARD USING THE SAME
- Publication number 20100159231
- Publication date Jun 24, 2010
- Samsung Electronics Co., Ltd.
- Chung-Kun CHO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POLYMERIZABLE COMPOSITION
- Publication number 20100144924
- Publication date Jun 10, 2010
- Zeon Corporation
- Akihiko Yoshiwara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HIGH-DIELECTRIC MATERIAL
- Publication number 20100104839
- Publication date Apr 29, 2010
- MBDA UK LIMITED
- Michael Dunleavy
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PRINTED CIRCUIT BOARD MATERIAL FOR EMBEDDED PASSIVE DEVICES AND PRE...
- Publication number 20090314419
- Publication date Dec 24, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Seung Hyun SOHN
- B32 - LAYERED PRODUCTS
Information Patent Application
Multilayer circuit board and electronic device
- Publication number 20090120673
- Publication date May 14, 2009
- Tohoku Unversity
- Tadahiro Ohmi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Inorganic Hollow Particle, Process For Producing The Same, And Comp...
- Publication number 20090030134
- Publication date Jan 29, 2009
- Denki Kagaku Kogyo Kabushiki Kaisha
- Shuji Sasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD MATERIAL FOR EMBEDDED PASSIVE DEVICES AND PRE...
- Publication number 20070148421
- Publication date Jun 28, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Seung Hyun SOHN
- B32 - LAYERED PRODUCTS
Information Patent Application
Foamable underfill encapsulant
- Publication number 20060142424
- Publication date Jun 29, 2006
- Jayesh Shah
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Printed circuit board material for embedded passive devices
- Publication number 20060062976
- Publication date Mar 23, 2006
- Samsung Electro-Mechanics Co., Ltd.
- Seung Hyun Sohn
- B32 - LAYERED PRODUCTS
Information Patent Application
Electronic package having controlled height stand-off solder joint
- Publication number 20050006442
- Publication date Jan 13, 2005
- Morris D. Stillabower
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Foamable underfill encapsulant
- Publication number 20040235996
- Publication date Nov 25, 2004
- Jayesh Shah
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Liquid crystalline polymeric compositions
- Publication number 20040056233
- Publication date Mar 25, 2004
- Michael Robert Samuels
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive composition
- Publication number 20030107026
- Publication date Jun 12, 2003
- Hironao Fujiki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Forming size compositions, glass fibers coated with the same and fa...
- Publication number 20020051882
- Publication date May 2, 2002
- Ernest L. Lawton
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
Molded resin composition exhibiting good adhesion to conductive mat...
- Publication number 20010011111
- Publication date Aug 2, 2001
- NEC Corporation
- Yoshitsugu Funada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Microballoons or hollow filler particles

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Composite with hollow nano-structures and application thereof

Direct printing and writing using undercooled metallic core-shell p...

Forming conductive vias using healing layer

Transparent conductor, method for preparing the same, and optical d...

Methods for assembling electronic devices with adhesive

Reducing dielectric loss in solder masks

Thermoplastic resin composition, resin article, and method of manuf...

Circuit materials, circuits laminates, and method of manufacture th...

Thermosetting resin composition and board using the same

High-dielectric material

Multilayer circuit board and electronic device

Polymerizable composition

Inorganic hollow particle, process for producing the same, and comp...

Liquid crystalline polymeric compositions

Electronic package having controlled height stand-off solder joint

Conductive composition

Impregnated glass fiber strands and products including the same

Impregnated glass fiber strands and products including the same

Alkali or acid corrodible organic or composite particles in resin m...

Microsphere containing circuit board paper

Low dielectric constant microsphere filled layers for multilayer el...

Circuit board assembly with foam substrate and method of making same

Method of producing a multi-layered ceramic circuit board

Dielectric composite

Polyimide composition and prepreg and laminate thereof

Fluoropolymer insulating material containing hollow microspheres

Copper/epoxy structures

Insulating material and production thereof

Flame retardant, low dielectric constant microsphere filled laminate

Thermoplastic film, reinforced hollow glass microsphere reinforced...

Patents Applicationslast 30 patents

SHEET FOR COMPONENT CARRIER COMPRISING SEPARATE STRUCTURES WITH FIL...

WIRING SUBSTRATE

COATING AGENT AND METHOD FOR MANUFACTURING MODULE USING THE COATING...

Composite with Hollow Nano-Structures and Application Thereof

REDUCING DIELECTRIC LOSS IN SOLDER MASKS

THERMOPLASTIC RESIN COMPOSITION, RESIN ARTICLE, AND METHOD OF MANUF...

HIGH-DIELECTRIC MATERIAL

Nucleic Acids and Libraries

INORGANIC HOLLOW POWDER, PROCESS FOR PRODUCING THE INORGANIC HOLLOW...

THERMOSETTING RESIN COMPOSITION AND BOARD USING THE SAME

POLYMERIZABLE COMPOSITION

HIGH-DIELECTRIC MATERIAL

PRINTED CIRCUIT BOARD MATERIAL FOR EMBEDDED PASSIVE DEVICES AND PRE...

Multilayer circuit board and electronic device

Inorganic Hollow Particle, Process For Producing The Same, And Comp...

PRINTED CIRCUIT BOARD MATERIAL FOR EMBEDDED PASSIVE DEVICES AND PRE...

Foamable underfill encapsulant

Printed circuit board material for embedded passive devices

Electronic package having controlled height stand-off solder joint

Foamable underfill encapsulant

Liquid crystalline polymeric compositions

Conductive composition

Forming size compositions, glass fibers coated with the same and fa...

Molded resin composition exhibiting good adhesion to conductive mat...