Microlenses

Industry

CPC
H01L27/14627

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/14627Microlenses

Industries

Patents Grantslast 30 patents

Information Patent Grant
Image sensor with spectral-filter-based crosstalk suppression
- Patent number 12,148,777
- Issue date Nov 19, 2024
- OmniVision Technologies, Inc.
- Qin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced cross-talk in color and infrared image sensor
- Patent number 12,148,783
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Keng-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and electronic device
- Patent number 12,149,842
- Issue date Nov 19, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yutaka Inaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for an image sensor, image sensor for an optical camera and...
- Patent number 12,148,779
- Issue date Nov 19, 2024
- Infineon Technologies Dresden GmbH & Co. KG
- Dirk Offenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and electronic apparatus
- Patent number 12,148,787
- Issue date Nov 19, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yoshihiko Nagahama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel circuit, control method, and image sensor
- Patent number 12,148,773
- Issue date Nov 19, 2024
- SMARTSENS TECHNOLOGY (HK) CO., LIMITED
- Jinjian Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hyperspectral element, hyperspectral sensor including the same, and...
- Patent number 12,148,775
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Youngzoon Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro lens arrays and methods of formation thereof
- Patent number 12,148,778
- Issue date Nov 19, 2024
- STMicroelectronics Ltd.
- Yu-Tsung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 12,148,784
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Dae Shik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device
- Patent number 12,142,628
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Ming Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image capturing module and manufacturing method thereof
- Patent number 12,143,701
- Issue date Nov 12, 2024
- GUANGZHOU LUXVISIONS INNOVATION TECHNOLOGY LIMITED
- Shih-Chieh Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion apparatus, photoelectric conversion system...
- Patent number 12,142,627
- Issue date Nov 12, 2024
- Canon Kabushiki Kaisha
- Yasuharu Ota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eye gesture tracking
- Patent number 12,141,351
- Issue date Nov 12, 2024
- Artilux, Inc.
- Yun-Chung Na
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Resonator structure, imaging element, and electronic apparatus
- Patent number 12,140,787
- Issue date Nov 12, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Atsushi Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor, camera assembly and mobile terminal
- Patent number 12,136,636
- Issue date Nov 5, 2024
- Guangdong Oppo Mobile Telecommunications Corp., Ltd.
- Cheng Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging element and electronic equipment
- Patent number 12,136,639
- Issue date Nov 5, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Masashi Ohura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 12,136,643
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Kangmook Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical systems fabricated by printing-based assembly
- Patent number 12,136,620
- Issue date Nov 5, 2024
- The Board of Trustees of the University of Illinois
- John A. Rogers
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 12,136,602
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flare-blocking image sensor
- Patent number 12,136,637
- Issue date Nov 5, 2024
- OmniVision Technologies, Inc.
- Alireza Bonakdar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image pickup device and electronic apparatus
- Patent number 12,133,007
- Issue date Oct 29, 2024
- Sony Group Corporation
- Sozo Yokogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera package, method for manufacturing camera package, and electr...
- Patent number 12,132,064
- Issue date Oct 29, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hiroyasu Matsugai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensors with dummy pixel structures
- Patent number 12,125,868
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spectral sensors
- Patent number 12,125,861
- Issue date Oct 22, 2024
- Imec VZW
- Nick Spooren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor device with integrated vias implementing inte...
- Patent number 12,119,365
- Issue date Oct 15, 2024
- NANYA TECHNOLOGY CORPORATION
- Pei Cheng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Color CMOS image sensor with diffractive microlenses over subpixel...
- Patent number 12,120,426
- Issue date Oct 15, 2024
- OmniVision Technologies, Inc.
- Victor Lenchenkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly with photosensitive element mounted to back...
- Patent number 12,119,361
- Issue date Oct 15, 2024
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light sensor including long-pass filter and light detection system
- Patent number 12,119,362
- Issue date Oct 15, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Sanshiro Shishido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state imaging device, solid state imaging device manufacturin...
- Patent number 12,119,366
- Issue date Oct 15, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Naoki Komai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 12,113,084
- Issue date Oct 8, 2024
- Samsung Electronics Co., Ltd.
- Taesub Jung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PHOTOELECTRIC CONVERSION APPARATUS AND PHOTOELECTRIC CONVERSION SYSTEM
- Publication number 20240387573
- Publication date Nov 21, 2024
- Canon Kabushiki Kaisha
- YASUSHI KOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT, STACKED-TYPE IMAGING ELEMENT, SOLID-STATE IMAGING...
- Publication number 20240387602
- Publication date Nov 21, 2024
- SONY GROUP CORPORATION
- Hideaki TOGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING ELEMENT AND ELECTRONIC EQUIPMENT
- Publication number 20240388817
- Publication date Nov 21, 2024
- Sony Semiconductor Solutions Corporation
- SHINJI NAKAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL FINGERPRINT SENSOR WITH ENHANCED ANTI-COUNTERFEITING FEATURES
- Publication number 20240386743
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien Hsieh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PHOTODETECTOR AND ELECTRONIC APPARATUS
- Publication number 20240387583
- Publication date Nov 21, 2024
- Sony Semiconductor Solutions Corporation
- Kazuya FURUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION DEVICE AND EQUIPMENT
- Publication number 20240387571
- Publication date Nov 21, 2024
- Canon Kabushiki Kaisha
- YUKI KITAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240387578
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-YU LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND METHOD FOR FABRICATING THE SAME
- Publication number 20240387589
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Ji Eun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE PICKUP DEVICE AND ELECTRONIC APPARATUS
- Publication number 20240387579
- Publication date Nov 21, 2024
- SONY GROUP CORPORATION
- Atsushi MASAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Semiconductor Device
- Publication number 20240379727
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chi-Ming LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH INTEGRATED OPTICAL DIE AND METHOD FORMING SAME
- Publication number 20240377595
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20240379696
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Sanghyuck Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH SCATTERING STRUCTURE
- Publication number 20240379703
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFRARED-RESPONSIVE SENSOR ELEMENT
- Publication number 20240379725
- Publication date Nov 14, 2024
- Microsoft Technology Licensing, LLC
- Minseok OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE AND ELECTRONIC EQUIPMENT
- Publication number 20240379691
- Publication date Nov 14, 2024
- Sony Semiconductor Solutions Corporation
- Yosuke SATAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE REFRACTION LAYER FOR BACKSIDE ILLUMINATED IMAGE SENSOR AND...
- Publication number 20240379704
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Han CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH ISOLATION FOR CROSS-TALK REDUCTION
- Publication number 20240379714
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNEQUAL CMOS IMAGE SENSOR PIXEL SIZE TO BOOST QUANTUM EFFICIENCY
- Publication number 20240379695
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE PICKUP ELEMENT AND ELECTRONIC DEVICE
- Publication number 20240379706
- Publication date Nov 14, 2024
- Sony Semiconductor Solutions Corporation
- MASANORI TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACKING WITH BOND PAD ABOVE A BONDLINE
- Publication number 20240371905
- Publication date Nov 7, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Swarnal BORTHAKUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL IMAGE SENSOR PACKAGE
- Publication number 20240371895
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hau Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE
- Publication number 20240371896
- Publication date Nov 7, 2024
- SONY GROUP CORPORATION
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT DETECTION DEVICE AND ELECTRONIC DEVICE
- Publication number 20240371899
- Publication date Nov 7, 2024
- Sony Semiconductor Solutions Corporation
- Tomohiro YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensors With Dummy Pixel Structures
- Publication number 20240371910
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20240371903
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Takekazu SHINOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND EQUIPMENT
- Publication number 20240371908
- Publication date Nov 7, 2024
- Canon Kabushiki Kaisha
- Hiroaki Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT PACKAGE AND ELECTRONIC DEVICE
- Publication number 20240363656
- Publication date Oct 31, 2024
- Sony Semiconductor Solutions Corporation
- Yoshiaki MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE AND FINGERPRINT-RECOGNITION DEVICE
- Publication number 20240363659
- Publication date Oct 31, 2024
- Rayprus Technology (Foshan) Co., Ltd.
- YUAN-HSU CHOU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND ELEC...
- Publication number 20240363666
- Publication date Oct 31, 2024
- SONY GROUP CORPORATION
- Taku Umebayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE AND ELECTRONIC APPARATUS
- Publication number 20240363657
- Publication date Oct 31, 2024
- Sony Semiconductor Solutions Corporation
- Hiroshi SAITO
- H01 - BASIC ELECTRIC ELEMENTS

Microlenses

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Image sensor with spectral-filter-based crosstalk suppression

Reduced cross-talk in color and infrared image sensor

Image sensor and electronic device

Device for an image sensor, image sensor for an optical camera and...

Image sensor and electronic apparatus

Pixel circuit, control method, and image sensor

Hyperspectral element, hyperspectral sensor including the same, and...

Micro lens arrays and methods of formation thereof

Image sensor

Method of forming semiconductor device

Image capturing module and manufacturing method thereof

Photoelectric conversion apparatus, photoelectric conversion system...

Eye gesture tracking

Resonator structure, imaging element, and electronic apparatus

Image sensor, camera assembly and mobile terminal

Imaging element and electronic equipment

Image sensor

Optical systems fabricated by printing-based assembly

Method of fabricating a semiconductor device

Flare-blocking image sensor

Solid-state image pickup device and electronic apparatus

Camera package, method for manufacturing camera package, and electr...

Image sensors with dummy pixel structures

Spectral sensors

Optical semiconductor device with integrated vias implementing inte...

Color CMOS image sensor with diffractive microlenses over subpixel...

Circuit board assembly with photosensitive element mounted to back...

Light sensor including long-pass filter and light detection system

Solid state imaging device, solid state imaging device manufacturin...

Image sensor

Patents Applicationslast 30 patents

PHOTOELECTRIC CONVERSION APPARATUS AND PHOTOELECTRIC CONVERSION SYSTEM

IMAGING ELEMENT, STACKED-TYPE IMAGING ELEMENT, SOLID-STATE IMAGING...

SOLID-STATE IMAGING ELEMENT AND ELECTRONIC EQUIPMENT

OPTICAL FINGERPRINT SENSOR WITH ENHANCED ANTI-COUNTERFEITING FEATURES

PHOTODETECTOR AND ELECTRONIC APPARATUS

PHOTOELECTRIC CONVERSION DEVICE AND EQUIPMENT

IMAGE SENSOR DEVICE AND METHOD OF FABRICATING THE SAME

IMAGE SENSOR AND METHOD FOR FABRICATING THE SAME

SOLID-STATE IMAGE PICKUP DEVICE AND ELECTRONIC APPARATUS

Method of Forming Semiconductor Device

PACKAGE WITH INTEGRATED OPTICAL DIE AND METHOD FORMING SAME

IMAGE SENSOR AND ELECTRONIC SYSTEM INCLUDING THE SAME

IMAGE SENSOR WITH SCATTERING STRUCTURE

INFRARED-RESPONSIVE SENSOR ELEMENT

IMAGING DEVICE AND ELECTRONIC EQUIPMENT

BACKSIDE REFRACTION LAYER FOR BACKSIDE ILLUMINATED IMAGE SENSOR AND...

DEEP TRENCH ISOLATION FOR CROSS-TALK REDUCTION

UNEQUAL CMOS IMAGE SENSOR PIXEL SIZE TO BOOST QUANTUM EFFICIENCY

IMAGE PICKUP ELEMENT AND ELECTRONIC DEVICE

CHIP STACKING WITH BOND PAD ABOVE A BONDLINE

WAFER LEVEL IMAGE SENSOR PACKAGE

SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE

LIGHT DETECTION DEVICE AND ELECTRONIC DEVICE

Image Sensors With Dummy Pixel Structures

IMAGE SENSOR

SEMICONDUCTOR APPARATUS AND EQUIPMENT

IMAGING ELEMENT PACKAGE AND ELECTRONIC DEVICE

IMAGING DEVICE AND FINGERPRINT-RECOGNITION DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND ELEC...

IMAGING DEVICE AND ELECTRONIC APPARATUS