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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with lead between a plurality of encapsulated...
- Patent number 12,159,816
- Issue date Dec 3, 2024
- Rohm Co., Ltd.
- Kentaro Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with multiple types of underfill and method forming the same
- Patent number 12,087,733
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of chip package with protective lid
- Patent number 11,978,715
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Tsung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,935,872
- Issue date Mar 19, 2024
- Kioxia Corporation
- Takahiro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead between a plurality of encapsulated MOSFETs
- Patent number 11,830,792
- Issue date Nov 28, 2023
- Rohm Co., Ltd.
- Kentaro Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device
- Patent number 11,114,596
- Issue date Sep 7, 2021
- Nichia Corporation
- Yoshikazu Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip parts and method for manufacturing the same, circuit assembly...
- Patent number 10,867,945
- Issue date Dec 15, 2020
- Rohm Co., Ltd.
- Hiroki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging module can easily and stably connect an imaging-sensing dev...
- Patent number 10,804,620
- Issue date Oct 13, 2020
- Fujikura Ltd.
- Takao Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip parts and method for manufacturing the same, circuit assembly...
- Patent number 10,468,362
- Issue date Nov 5, 2019
- Rohm Co., Ltd.
- Hiroki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip parts and method for manufacturing the same, circuit assembly...
- Patent number 9,859,240
- Issue date Jan 2, 2018
- Rohm Co., Ltd.
- Hiroki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy resin composition for encapsulating semiconductor device and...
- Patent number 9,735,076
- Issue date Aug 15, 2017
- Samsung SDI Co., Ltd.
- Yoon Man Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device using gang bonding and s...
- Patent number 9,711,693
- Issue date Jul 18, 2017
- Chung Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill pattern with gap
- Patent number 9,627,346
- Issue date Apr 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joining method and semiconductor device manufacturing method
- Patent number 9,087,778
- Issue date Jul 21, 2015
- Mitsubishi Electric Corporation
- Aya Muto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating semiconductor device using gang bonding and s...
- Patent number 9,054,231
- Issue date Jun 9, 2015
- Chung Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joining method and semiconductor device manufacturing method
- Patent number 8,746,538
- Issue date Jun 10, 2014
- Mitsubishi Electric Corporation
- Aya Muto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level packaged integrated circuit
- Patent number 8,421,175
- Issue date Apr 16, 2013
- STMicroelectronics ( Research & Development) Limited
- Robert Nicol
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE WITH PROTECTIVE LID
- Publication number 20240250055
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsung KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240055329
- Publication date Feb 15, 2024
- ROHM CO., LTD.
- Kentaro NASU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIDDED SEMICONDUCTOR PACKAGE
- Publication number 20230060065
- Publication date Feb 23, 2023
- MEDIATEK INC.
- Yi-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages With Multiple Types of Underfill and Method Forming The Same
- Publication number 20220367413
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH PROTECTIVE LID
- Publication number 20220278069
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsung KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220238489
- Publication date Jul 28, 2022
- KIOXIA Corporation
- Takahiro MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210398884
- Publication date Dec 23, 2021
- Kentaro NASU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE CAPTURING MODULE AND PORTABLE ELECTRONIC DEVICE
- Publication number 20200185350
- Publication date Jun 11, 2020
- AZUREWAVE TECHNOLOGIES, INC.
- Chuan Jin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CHIP PARTS AND METHOD FOR MANUFACTURING THE SAME, CIRCUIT ASSEMBLY...
- Publication number 20200013737
- Publication date Jan 9, 2020
- Rohm Co., Ltd.
- Hiroki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING CONDUCTIVE ADHESIV...
- Publication number 20180342653
- Publication date Nov 29, 2018
- Chung Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PARTS AND METHOD FOR MANUFACTURING THE SAME, CIRCUIT ASSEMBLY...
- Publication number 20180108628
- Publication date Apr 19, 2018
- Rohm Co., Ltd.
- Hiroki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING GANG BONDING AND S...
- Publication number 20170317247
- Publication date Nov 2, 2017
- Chung Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND...
- Publication number 20160351461
- Publication date Dec 1, 2016
- Samsung SDI Co., Ltd.
- Yoon Man LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC STRUCTURE AND ELECTRONIC PACKAGE COMPONENT FOR INCREASIN...
- Publication number 20140247575
- Publication date Sep 4, 2014
- INPAQ TECHNOLOGY CO., LTD.
- MING-FUNG HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...
- Publication number 20140231492
- Publication date Aug 21, 2014
- PANASONIC CORPORATION
- Tsubasa Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20140217156
- Publication date Aug 7, 2014
- MITSUBISHI ELECTRIC CORPORATION
- Aya MUTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING GANG BONDING AND S...
- Publication number 20130264600
- Publication date Oct 10, 2013
- Chung Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20130134210
- Publication date May 30, 2013
- Aya Muto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER LEVEL PACKAGED INTEGRATED CIRCUIT
- Publication number 20110057281
- Publication date Mar 10, 2011
- STMicroelectronics (Research & Development) Limited
- ROBERT NICOL
- H01 - BASIC ELECTRIC ELEMENTS

Mirror array

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with lead between a plurality of encapsulated...

Packages with multiple types of underfill and method forming the same

Structure and formation method of chip package with protective lid

Semiconductor device and method of manufacturing semiconductor device

Lead between a plurality of encapsulated MOSFETs

Light-emitting device

Chip parts and method for manufacturing the same, circuit assembly...

Imaging module can easily and stably connect an imaging-sensing dev...

Chip parts and method for manufacturing the same, circuit assembly...

Chip parts and method for manufacturing the same, circuit assembly...

Epoxy resin composition for encapsulating semiconductor device and...

Method of fabricating semiconductor device using gang bonding and s...

Underfill pattern with gap

Joining method and semiconductor device manufacturing method

Method of fabricating semiconductor device using gang bonding and s...

Joining method and semiconductor device manufacturing method

Wafer level packaged integrated circuit

Patents Applicationslast 30 patents

PACKAGE STRUCTURE WITH PROTECTIVE LID

SEMICONDUCTOR DEVICE

LIDDED SEMICONDUCTOR PACKAGE

Packages With Multiple Types of Underfill and Method Forming The Same

STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH PROTECTIVE LID

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

IMAGE CAPTURING MODULE AND PORTABLE ELECTRONIC DEVICE

CHIP PARTS AND METHOD FOR MANUFACTURING THE SAME, CIRCUIT ASSEMBLY...

METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING CONDUCTIVE ADHESIV...

CHIP PARTS AND METHOD FOR MANUFACTURING THE SAME, CIRCUIT ASSEMBLY...

METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING GANG BONDING AND S...

EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND...

ELECTRONIC STRUCTURE AND ELECTRONIC PACKAGE COMPONENT FOR INCREASIN...

ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...

JOINING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING GANG BONDING AND S...

JOINING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

WAFER LEVEL PACKAGED INTEGRATED CIRCUIT