Mixed assemblies

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CPC
H01L25/112

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/112Mixed assemblies

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of making the same
- Patent number 12,113,031
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module board and memory module including the same
- Patent number 12,063,736
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Wonseop Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microelectronic device with embedded die substrate on interposer
- Patent number 12,046,560
- Issue date Jul 23, 2024
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 12,040,312
- Issue date Jul 16, 2024
- Advanced Semiconductor Engineering, Inc.
- Chien-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra small molded module integrated with die by module-on-wafer as...
- Patent number 11,955,434
- Issue date Apr 9, 2024
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device with embedded die substrate on interposer
- Patent number 11,894,311
- Issue date Feb 6, 2024
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making the same
- Patent number 11,830,822
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module board and memory module including the same
- Patent number 11,785,710
- Issue date Oct 10, 2023
- Samsung Electronics Co., Ltd.
- Wonseop Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Rotating rectifiers
- Patent number 11,764,648
- Issue date Sep 19, 2023
- Hamilton Sundstrand Corporation
- Dhaval Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 11,756,943
- Issue date Sep 12, 2023
- Intel Corporation
- Shawna M. Liff
- G02 - OPTICS
Information Patent Grant
Stacked chips comprising interconnects
- Patent number 11,594,521
- Issue date Feb 28, 2023
- Kioxia Corporation
- Masaru Koyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making the same
- Patent number 11,587,883
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having redistribution layer
- Patent number 11,488,910
- Issue date Nov 1, 2022
- Samsung Electronics Co., Ltd.
- Young Kun Jee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module board and memory module including the same
- Patent number 11,477,880
- Issue date Oct 18, 2022
- Samsung Electronics Co., Ltd.
- Wonseop Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microelectronic device with embedded die substrate on interposer
- Patent number 11,430,740
- Issue date Aug 30, 2022
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,424,212
- Issue date Aug 23, 2022
- Advanced Semiconductor Engineering, Inc.
- Chien-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,410,970
- Issue date Aug 9, 2022
- ULTRAMEMORY INC.
- Ryuji Takishita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for controlling controllable power semiconductor switches of...
- Patent number 11,323,018
- Issue date May 3, 2022
- Siemens Energy Global GmbH & Co. KG
- David Doering
- G08 - SIGNALLING
Information Patent Grant
Power electronic circuit having a plurality of power modules
- Patent number 11,282,822
- Issue date Mar 22, 2022
- Siemens Aktiengesellschaft
- Wilhelm Meyrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked modules
- Patent number 11,239,170
- Issue date Feb 1, 2022
- Snaptrack, Inc.
- Andreas Franz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics module
- Patent number 11,183,489
- Issue date Nov 23, 2021
- Audi AG
- Andreas Apelsmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible shield for semiconductor devices
- Patent number 11,177,226
- Issue date Nov 16, 2021
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical device having a semiconductor circuit
- Patent number 11,063,524
- Issue date Jul 13, 2021
- Siemens Energy Global GmbH & Co. KG
- Martin Kapelke
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor separation device
- Patent number 11,056,354
- Issue date Jul 6, 2021
- Lumentum Technology UK Limited
- Ian David Juland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous miniaturization platform
- Patent number 11,055,459
- Issue date Jul 6, 2021
- International Business Machines Corporation
- Qianwen Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic system comprising an electronic module
- Patent number 11,032,951
- Issue date Jun 8, 2021
- INSTITUT VEDECOM
- Hadi Alawieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging method and package structure
- Patent number 10,978,421
- Issue date Apr 13, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked chips comprising interconnects
- Patent number 10,964,671
- Issue date Mar 30, 2021
- TOSHIBA MEMORY CORPORATION
- Masaru Koyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat exchanger for cooling multiple layers of electronic modules
- Patent number 10,928,141
- Issue date Feb 23, 2021
- Dana Canada Corporation
- Benjamin A. Kenney
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor device and method of making the same
- Patent number 10,910,321
- Issue date Feb 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME
- Publication number 20240371787
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER
- Publication number 20240332203
- Publication date Oct 3, 2024
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER TRANSISTOR CHIP PACKAGE
- Publication number 20240304528
- Publication date Sep 12, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...
- Publication number 20240213171
- Publication date Jun 27, 2024
- Intel Corporation
- Tomita YOSHIHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER BLOCK BASED ON TOP-SIDE COOL SURFACE-MOUNT DISCRETE DEVICES W...
- Publication number 20240030096
- Publication date Jan 25, 2024
- Qorvo US, Inc.
- Ke Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE BOARD AND MEMORY MODULE INCLUDING THE SAME
- Publication number 20230413424
- Publication date Dec 21, 2023
- Samsung Electronics Co., Ltd.
- Wonseop LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME
- Publication number 20230387038
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME
- Publication number 20230197631
- Publication date Jun 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE BOARD AND MEMORY MODULE INCLUDING THE SAME
- Publication number 20230013064
- Publication date Jan 19, 2023
- Samsung Electronics Co., Ltd.
- Wonseop LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220399301
- Publication date Dec 15, 2022
- Advanced Semiconductor Engineering, Inc.
- Chien-Wei CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROTATING RECTIFIERS
- Publication number 20220181949
- Publication date Jun 9, 2022
- HAMILTON SUNDSTRAND CORPORATION
- Dhaval Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE BOARD AND MEMORY MODULE INCLUDING THE SAME
- Publication number 20220159827
- Publication date May 19, 2022
- Samsung Electronics Co., Ltd.
- Wonseop LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Power Electronic Circuit Having A Plurality Of Power Modules
- Publication number 20210242187
- Publication date Aug 5, 2021
- SIEMENS AKTIENGESELLSCHAFT
- Wilhelm Meyrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME
- Publication number 20210159187
- Publication date May 27, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Chieh HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS MODULE
- Publication number 20210091054
- Publication date Mar 25, 2021
- Audi AG
- Andreas APELSMEIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Control System For Controlling a Plurality of Controllable Units, i...
- Publication number 20210028684
- Publication date Jan 28, 2021
- Siemens Aktiengesellschaft
- DAVID DOERING
- G08 - SIGNALLING
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING REDISTRIBUTION LAYER
- Publication number 20210020578
- Publication date Jan 21, 2021
- Samsung Electronics Co., Ltd.
- Young Kun JEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM COMPRISING AN ELECTRONIC MODULE
- Publication number 20200375061
- Publication date Nov 26, 2020
- INSTITUT VEDECOM
- Hadi ALAWIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOAD CONTROLLER AND ELECTRIC VEHICLE HAVING LOAD CONTROLLER
- Publication number 20190335627
- Publication date Oct 31, 2019
- BYD Company Limited
- Linxia FANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HETEROGENEOUS MINIATURIZATION PLATFORM
- Publication number 20190311082
- Publication date Oct 10, 2019
- International Business Machines Corporation
- Qianwen Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RF Module
- Publication number 20180108622
- Publication date Apr 19, 2018
- INFINEON TECHNOLOGIES AG
- Carsten Ahrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Devices with Upper RDL of WLPS and Methods Therefor
- Publication number 20180026016
- Publication date Jan 25, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Baseplate for an electronic module and method of manufacturing the...
- Publication number 20170287798
- Publication date Oct 5, 2017
- INFINEON TECHNOLOGIES AG
- Fabio BRUCCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVERTER POWER MODULE PACKAGING WITH COLD PLATE
- Publication number 20170229378
- Publication date Aug 10, 2017
- ATIEVA, INC.
- Yifan TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR ADDITIVE MANUFACTURING OF ELECTROMECHANICAL...
- Publication number 20170042034
- Publication date Feb 9, 2017
- Cornell University
- Robert MACCURDY
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
POWER STACK STRUCTURE AND METHOD
- Publication number 20140313642
- Publication date Oct 23, 2014
- Fan Zhang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
INVERTER POWER MODULE PACKAGING WITH COLD PLATE
- Publication number 20140262177
- Publication date Sep 18, 2014
- ATIEVA, INC.
- Yifan TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXING MANIFOLD AND METHOD
- Publication number 20140198453
- Publication date Jul 17, 2014
- Fan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE UNIT
- Publication number 20140001630
- Publication date Jan 2, 2014
- NHK Spring Co., Ltd.
- Noritoshi Takamura
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
COOLING APPARATUS
- Publication number 20130335920
- Publication date Dec 19, 2013
- Toyota Jidosha Kabushiki Kaisha
- Takahito Murata
- H01 - BASIC ELECTRIC ELEMENTS

Mixed assemblies

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method of making the same

Module board and memory module including the same

Microelectronic device with embedded die substrate on interposer

Semiconductor package structure and method for manufacturing the same

Ultra small molded module integrated with die by module-on-wafer as...

Microelectronic device with embedded die substrate on interposer

Semiconductor device and method of making the same

Module board and memory module including the same

Rotating rectifiers

Microelectronic assemblies

Stacked chips comprising interconnects

Semiconductor device and method of making the same

Semiconductor package having redistribution layer

Module board and memory module including the same

Microelectronic device with embedded die substrate on interposer

Semiconductor package structure and method for manufacturing the same

Semiconductor module

Method for controlling controllable power semiconductor switches of...

Power electronic circuit having a plurality of power modules

Stacked modules

Power electronics module

Flexible shield for semiconductor devices

Electrical device having a semiconductor circuit

Semiconductor separation device

Heterogeneous miniaturization platform

Electronic system comprising an electronic module

Wafer-level packaging method and package structure

Stacked chips comprising interconnects

Heat exchanger for cooling multiple layers of electronic modules

Semiconductor device and method of making the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME

MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER

POWER TRANSISTOR CHIP PACKAGE

ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...

POWER BLOCK BASED ON TOP-SIDE COOL SURFACE-MOUNT DISCRETE DEVICES W...

MODULE BOARD AND MEMORY MODULE INCLUDING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME

MODULE BOARD AND MEMORY MODULE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

ROTATING RECTIFIERS

MODULE BOARD AND MEMORY MODULE INCLUDING THE SAME

Power Electronic Circuit Having A Plurality Of Power Modules

SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME

POWER ELECTRONICS MODULE

Control System For Controlling a Plurality of Controllable Units, i...

SEMICONDUCTOR PACKAGE HAVING REDISTRIBUTION LAYER

ELECTRONIC SYSTEM COMPRISING AN ELECTRONIC MODULE

LOAD CONTROLLER AND ELECTRIC VEHICLE HAVING LOAD CONTROLLER

HETEROGENEOUS MINIATURIZATION PLATFORM

RF Module

Package-on-Package Devices with Upper RDL of WLPS and Methods Therefor

Baseplate for an electronic module and method of manufacturing the...

INVERTER POWER MODULE PACKAGING WITH COLD PLATE

SYSTEM AND METHODS FOR ADDITIVE MANUFACTURING OF ELECTROMECHANICAL...

POWER STACK STRUCTURE AND METHOD

INVERTER POWER MODULE PACKAGING WITH COLD PLATE

MIXING MANIFOLD AND METHOD

PRESSURE UNIT

COOLING APPARATUS