Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

H01L25/03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 H01L25/04the devices not having separate containers H01L25/041the devices being of a type provided for in group H01L31/00 H01L25/042the devices being arranged next to each other H01L25/043Stacked arrangements of devices H01L25/046the devices being of a type provided for in group H01L51/00 H01L25/047the devices being of a type provided for in group H01L51/42 H01L25/048the devices being of a type provided for in group H01L51/50 H01L25/065the devices being of a type provided for in group H01L27/00 H01L25/0652the devices being arranged next and on each other H01L25/0655the devices being arranged next to each other H01L25/0657Stacked arrangements of devices H01L25/07the devices being of a type provided for in group H01L29/00 H01L25/071the devices being arranged next and on each other H01L25/072the devices being arranged next to each other H01L25/073Apertured devices mounted on one or more rods passed through the apertures H01L25/074Stacked arrangements of non-apertured devices H01L25/075the devices being of a type provided for in group H01L33/00 H01L25/0753the devices being arranged next to each other H01L25/0756Stacked arrangements of devices H01L25/10the devices having separate containers H01L25/105the devices being of a type provided for in group H01L27/00 H01L25/11the devices being of a type provided for in group H01L29/00 H01L25/112Mixed assemblies H01L25/115the devices being arranged next to each other H01L25/117Stacked arrangements of devices H01L25/13the devices being of a type provided for in group H01L33/00 H01L25/16the devices being of types provided for in two or more different main groups of H01L27/00 - H01L49/00 and H01L51/00 H01L25/162the devices being mounted on two or more different substrates H01L25/165Containers H01L25/167comprising optoelectronic devices H01L25/18the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L51/00 H01L25/50Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00