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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Patents Grants
last 30 patents
Information
Patent Grant
MEMS resonator integrated cicruit fabrication
Patent number
12,365,582
Issue date
Jul 22, 2025
SiTime Corporation
Pavan Gupta
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Thermocompression bonding with passivated silver-based contacting m...
Patent number
12,363,878
Issue date
Jul 15, 2025
SET North America, LLC
Eric Frank Schulte
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermocompression bonding with passivated gold contacting metal
Patent number
12,363,877
Issue date
Jul 15, 2025
SET North America, LLC
Eric Frank Schulte
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor memory device and structure
Patent number
12,362,219
Issue date
Jul 15, 2025
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermocompression bonding with passivated tin-based contacting metal
Patent number
12,356,553
Issue date
Jul 8, 2025
SET North America, LLC
Eric Frank Schulte
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and measurement device
Patent number
12,347,757
Issue date
Jul 1, 2025
Lapis Semiconductor Co., Ltd.
Toshihisa Sone
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density substrate routing in package
Patent number
12,327,807
Issue date
Jun 10, 2025
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device and method for UBM/RDL routing
Patent number
12,322,727
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Meng-Tsan Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing a semiconductor d...
Patent number
12,322,717
Issue date
Jun 3, 2025
ams AG
Jens Hofrichter
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
High registration particles-transferring system
Patent number
12,297,538
Issue date
May 13, 2025
Xerox Corporation
Yunda Wang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Integrated ultrasonic transducers
Patent number
12,295,790
Issue date
May 13, 2025
EXO IMAGING, INC.
Janusz Bryzek
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Integrated circuit package and method of forming same
Patent number
12,294,002
Issue date
May 6, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Shang-Yun Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor memory device and structure with memory and metal...
Patent number
12,272,586
Issue date
Apr 8, 2025
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Grant
Semiconductor package device and method for manufacturing the same
Patent number
12,266,610
Issue date
Apr 1, 2025
Advanced Semiconductor Engineering, Inc.
Yencheng Kuo
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Stacked dies and methods for forming bonded structures
Patent number
12,266,650
Issue date
Apr 1, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device with multi-layer contact and system
Patent number
12,255,168
Issue date
Mar 18, 2025
Infineon Technologies AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method manufacturing the same
Patent number
12,249,550
Issue date
Mar 11, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Feng-Cheng Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermocompression bonding using metastable gas atoms
Patent number
12,245,379
Issue date
Mar 4, 2025
SET North America, LLC
Eric Frank Schulte
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Thermocompression bonding with passivated copper-based contacting m...
Patent number
12,245,380
Issue date
Mar 4, 2025
SET North America, LLC
Eric Frank Schulte
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Thermocompression bonding with passivated nickel-based contacting m...
Patent number
12,245,381
Issue date
Mar 4, 2025
SET North America, LLC
Eric Frank Schulte
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
3D semiconductor device and structure with metal layers and memory...
Patent number
12,243,765
Issue date
Mar 4, 2025
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Grant
Integrated circuit structure
Patent number
12,238,865
Issue date
Feb 25, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure for heat dissipation
Patent number
12,218,026
Issue date
Feb 4, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stiffener package and method of fabricating stiffener package
Patent number
12,211,705
Issue date
Jan 28, 2025
Amkor Technology Singapore Holding Pte Ltd.
Jin Young Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method manufacturing the same
Patent number
12,176,258
Issue date
Dec 24, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Feng-Cheng Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Single-shot encapsulation
Patent number
12,166,001
Issue date
Dec 10, 2024
Semtech Corporation
Kok Khoon Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for producing a 3D semiconductor memory device and structure
Patent number
12,154,817
Issue date
Nov 26, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with single-crystal layers
Patent number
12,136,562
Issue date
Nov 5, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with metal layers and memory...
Patent number
12,125,737
Issue date
Oct 22, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Grant
Methods of manufacture of semiconductor devices having redistributi...
Patent number
12,119,235
Issue date
Oct 15, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Wei-Chih Chen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
PACKAGING STRUCTURE AND PREPARING METHOD THEREOF
Publication number
20250233033
Publication date
Jul 17, 2025
TRIPLE WIN TECHNOLOGY (SHENZHEN) CO.LTD.
HUNG-TA LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
Publication number
20250233119
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Shang-Yun Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
Publication number
20250226342
Publication date
Jul 10, 2025
Taiwan Semiconductor Manufacturing Company Limited
Hsi-Cheng HSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ASIC INTEGRATED MEMS DEVICE WITH EXPOSED BOND PADS FROM BOTTOM ATTA...
Publication number
20250210590
Publication date
Jun 26, 2025
SD Optics, Inc.
KYUNG PYO HONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT STRUCTURE
Publication number
20250159812
Publication date
May 15, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
PACKAGE STRUCTURE FOR HEAT DISSIPATION
Publication number
20250157876
Publication date
May 15, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROMECHANICAL COMPONENT AND CORRESPONDING PRODUCTION METHOD
Publication number
20250157998
Publication date
May 15, 2025
ROBERT BOSCH GmbH
Dorothea Papathanassiou
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250149467
Publication date
May 8, 2025
Samsung Electronics Co., Ltd.
Juil Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
Publication number
20250132187
Publication date
Apr 24, 2025
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Application
CHIP PACKAGE
Publication number
20250132260
Publication date
Apr 24, 2025
Ping-Jung Yang
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
ELECTRICAL, MECHANICAL, COMPUTING, AND/OR OTHER DEVICES FORMED OF E...
Publication number
20250098551
Publication date
Mar 20, 2025
Ambature Inc.
Douglas J. GILBERT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED-DIE MEMS RESONATOR
Publication number
20250019229
Publication date
Jan 16, 2025
SiTime Corporation
Pavan Gupta
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Ovenized MEMS
Publication number
20250007455
Publication date
Jan 2, 2025
SiTime Corporation
Carl Arft
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
Publication number
20250006544
Publication date
Jan 2, 2025
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
Publication number
20240429173
Publication date
Dec 26, 2024
Intel Corporation
Henning BRAUNISCH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS
Publication number
20240429086
Publication date
Dec 26, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW PRESSURE SINTERING POWDER
Publication number
20240413117
Publication date
Dec 12, 2024
Alpha Assembly Solutions Inc.
Shamik Ghoshal
B22 - CASTING POWDER METALLURGY
Information
Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
Publication number
20240404934
Publication date
Dec 5, 2024
DAI NIPPON PRINTING CO., LTD.
Satoru KURAMOCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY CELLS AND MULTIPL...
Publication number
20240404866
Publication date
Dec 5, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE
Publication number
20240395592
Publication date
Nov 28, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SENSOR DEVICE AND METHOD FOR MANUFACTURING SENSOR DEVICE
Publication number
20240387437
Publication date
Nov 21, 2024
MITSUMI ELECTRIC CO., LTD.
Soichiro SUZU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
Publication number
20240387194
Publication date
Nov 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Wei-Chih Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE
Publication number
20240379566
Publication date
Nov 14, 2024
Ping-Jung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH THREE LEVELS AND ISOLATI...
Publication number
20240379502
Publication date
Nov 14, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
Publication number
20240363385
Publication date
Oct 31, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Application
COAXIAL THROUGH VIA WITH NOVEL HIGH ISOLATION CROSS COUPLING METHOD...
Publication number
20240363560
Publication date
Oct 31, 2024
Taiwan Semiconductor Manufacturing Co., LTD
Feng Wei KUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE
Publication number
20240339428
Publication date
Oct 10, 2024
Intel Corporation
Weng Hong TEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
Publication number
20240297166
Publication date
Sep 5, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Shang-Yun Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
Publication number
20240228264
Publication date
Jul 11, 2024
STMicroelectronics International N.V.
Roseanne DUCA
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH BONDING AND DRAM MEMORY...
Publication number
20240213073
Publication date
Jun 27, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE