Mixer

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CPC
H01L2924/1422

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/1422Mixer

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Patents Grantslast 30 patents

Information Patent Grant
Die to die high-speed communication without discrete amplifiers bet...
- Patent number 12,205,908
- Issue date Jan 21, 2025
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmitter component, receiver component, transceiver circuit, and...
- Patent number 11,791,536
- Issue date Oct 17, 2023
- Infineon Technologies Austria AG
- Wolfgang Scherr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless communication device with joined semiconductors
- Patent number 10,090,586
- Issue date Oct 2, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless communication device with joined semiconductors
- Patent number 9,780,442
- Issue date Oct 3, 2017
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency packaging with reduced RF loss
- Patent number 8,773,866
- Issue date Jul 8, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-De Jin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRELESS CHIP-TO-CHIP HIGH-SPEED DATA TRANSPORT
- Publication number 20240021522
- Publication date Jan 18, 2024
- Intel Corporation
- Tolga ACIKALIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE TO DIE HIGH-SPEED COMMUNICATION WITHOUT DISCRETE AMPLIFIERS BET...
- Publication number 20220406737
- Publication date Dec 22, 2022
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMITTER COMPONENT, RECEIVER COMPONENT, TRANSCEIVER CIRCUIT, AND...
- Publication number 20220102836
- Publication date Mar 31, 2022
- Wolfgang Scherr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA-ON-PACKAGE INCLUDING MULTIPLE TYPES OF ANTENNA
- Publication number 20210328367
- Publication date Oct 21, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS COMMUNICATION DEVICE WITH JOINED SEMICONDUCTORS
- Publication number 20170309998
- Publication date Oct 26, 2017
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS COMMUNICATION DEVICE WITH JOINED SEMICONDUCTORS
- Publication number 20150380813
- Publication date Dec 31, 2015
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Radio-Frequency Packaging with Reduced RF Loss
- Publication number 20120147578
- Publication date Jun 14, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-De Jin
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Die to die high-speed communication without discrete amplifiers bet...

Transmitter component, receiver component, transceiver circuit, and...

Wireless communication device with joined semiconductors

Wireless communication device with joined semiconductors

Radio-frequency packaging with reduced RF loss

Patents Applicationslast 30 patents

WIRELESS CHIP-TO-CHIP HIGH-SPEED DATA TRANSPORT

DIE TO DIE HIGH-SPEED COMMUNICATION WITHOUT DISCRETE AMPLIFIERS BET...

TRANSMITTER COMPONENT, RECEIVER COMPONENT, TRANSCEIVER CIRCUIT, AND...

ANTENNA-ON-PACKAGE INCLUDING MULTIPLE TYPES OF ANTENNA

WIRELESS COMMUNICATION DEVICE WITH JOINED SEMICONDUCTORS

WIRELESS COMMUNICATION DEVICE WITH JOINED SEMICONDUCTORS

Radio-Frequency Packaging with Reduced RF Loss