Mixer

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CPC
H01L2924/1422

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/1422Mixer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Transmitter component, receiver component, transceiver circuit, and...
- Patent number 11,791,536
- Issue date Oct 17, 2023
- Infineon Technologies Austria AG
- Wolfgang Scherr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless communication device with joined semiconductors
- Patent number 10,090,586
- Issue date Oct 2, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless communication device with joined semiconductors
- Patent number 9,780,442
- Issue date Oct 3, 2017
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency packaging with reduced RF loss
- Patent number 8,773,866
- Issue date Jul 8, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-De Jin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRELESS CHIP-TO-CHIP HIGH-SPEED DATA TRANSPORT
- Publication number 20240021522
- Publication date Jan 18, 2024
- Intel Corporation
- Tolga ACIKALIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE TO DIE HIGH-SPEED COMMUNICATION WITHOUT DISCRETE AMPLIFIERS BET...
- Publication number 20220406737
- Publication date Dec 22, 2022
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMITTER COMPONENT, RECEIVER COMPONENT, TRANSCEIVER CIRCUIT, AND...
- Publication number 20220102836
- Publication date Mar 31, 2022
- Wolfgang Scherr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA-ON-PACKAGE INCLUDING MULTIPLE TYPES OF ANTENNA
- Publication number 20210328367
- Publication date Oct 21, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS COMMUNICATION DEVICE WITH JOINED SEMICONDUCTORS
- Publication number 20170309998
- Publication date Oct 26, 2017
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS COMMUNICATION DEVICE WITH JOINED SEMICONDUCTORS
- Publication number 20150380813
- Publication date Dec 31, 2015
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Radio-Frequency Packaging with Reduced RF Loss
- Publication number 20120147578
- Publication date Jun 14, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-De Jin
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Transmitter component, receiver component, transceiver circuit, and...

Wireless communication device with joined semiconductors

Wireless communication device with joined semiconductors

Radio-frequency packaging with reduced RF loss

Patents Applicationslast 30 patents

WIRELESS CHIP-TO-CHIP HIGH-SPEED DATA TRANSPORT

DIE TO DIE HIGH-SPEED COMMUNICATION WITHOUT DISCRETE AMPLIFIERS BET...

TRANSMITTER COMPONENT, RECEIVER COMPONENT, TRANSCEIVER CIRCUIT, AND...

ANTENNA-ON-PACKAGE INCLUDING MULTIPLE TYPES OF ANTENNA

WIRELESS COMMUNICATION DEVICE WITH JOINED SEMICONDUCTORS

WIRELESS COMMUNICATION DEVICE WITH JOINED SEMICONDUCTORS

Radio-Frequency Packaging with Reduced RF Loss