Modification of a pre-existing material

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CPC
H01L2224/435

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/435Modification of a pre-existing material

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Patents Grantslast 30 patents

Information Patent Grant
Method for processing an ultra-high density space interconnect lead...
- Patent number 11,211,357
- Issue date Dec 28, 2021
- GUANGDONG UNIVERSITY OF TECHNOLOGY
- Yun Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,840,208
- Issue date Nov 17, 2020
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device by laser-induced forming and transfer of shaped m...
- Patent number 10,297,565
- Issue date May 21, 2019
- The United States of America, as represented by the Secretary of the Navy
- Scott A. Mathews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-induced forming and transfer of shaped metallic interconnects
- Patent number 9,966,356
- Issue date May 8, 2018
- The United States of America, as represented by the Secretary of the Navy
- Scott A. Mathews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for wireless connection in integrated...
- Patent number 9,837,340
- Issue date Dec 5, 2017
- Intel Corporation
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-induced forming and transfer of shaped metallic interconnects
- Patent number 9,685,349
- Issue date Jun 20, 2017
- The United States of America, as represented by the Secretary of the Navy
- Scott A. Mathews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper alloy bonding wire for semiconductor
- Patent number 9,427,830
- Issue date Aug 30, 2016
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting wire and method for manufacturing same
- Patent number 8,450,611
- Issue date May 28, 2013
- Heraeus Materials Technology GmbH & Co. KG
- Rainer Dohle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball bonding of aluminum bonding wire
- Patent number 4,860,941
- Issue date Aug 29, 1989
- Alcan International Limited
- Alexander J. Otto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Bonding Wire and Method for Manufacturing the Same
- Publication number 20230125151
- Publication date Apr 27, 2023
- Nippon Telegraph and Telephone Corporation
- Toshiki Kishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING AN ULTRA-HIGH DENSITY SPACE INTERCONNECT LEAD...
- Publication number 20210210461
- Publication date Jul 8, 2021
- Guangdong University of Technology
- Yun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device By Laser-Induced Forming and Transfer of Shaped M...
- Publication number 20180240772
- Publication date Aug 23, 2018
- The Government of the United States of America, as represented by the Secreta...
- Scott A. Mathews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170365576
- Publication date Dec 21, 2017
- NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
- Tetsuya OYAMADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser-Induced Forming and Transfer of Shaped Metallic Interconnects
- Publication number 20170221851
- Publication date Aug 3, 2017
- The Government of the United States of America, as represented by the Secreta...
- Scott A. Mathews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser-Induced Forming and Transfer of Shaped Metallic Interconnects
- Publication number 20170103902
- Publication date Apr 13, 2017
- The Government of the United States of America, as represented by the Secreta...
- Scott A. Mathews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Embedded Die
- Publication number 20160284619
- Publication date Sep 29, 2016
- STATS ChipPAC Pte Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED WIRE FOR BONDING APPLICATIONS
- Publication number 20150360316
- Publication date Dec 17, 2015
- Heraeus Deutschland GmbH & Co. KG
- Eugen MILKE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR
- Publication number 20120094121
- Publication date Apr 19, 2012
- NIPPON MICROMETAL CORPORATION
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTING WIRE AND METHOD FOR MANUFACTURING SAME
- Publication number 20100108359
- Publication date May 6, 2010
- Rainer Dohle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD FOR A COMPOSITE METAL BONDING WIRE AND PRODUCT...
- Publication number 20090191088
- Publication date Jul 30, 2009
- Jun-Der LEE
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...

Modification of a pre-existing material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for processing an ultra-high density space interconnect lead...

Bonding wire for semiconductor device

Electronic device by laser-induced forming and transfer of shaped m...

Laser-induced forming and transfer of shaped metallic interconnects

Apparatus, system, and method for wireless connection in integrated...

Laser-induced forming and transfer of shaped metallic interconnects

Copper alloy bonding wire for semiconductor

Connecting wire and method for manufacturing same

Ball bonding of aluminum bonding wire

Patents Applicationslast 30 patents

Bonding Wire and Method for Manufacturing the Same

METHOD FOR PROCESSING AN ULTRA-HIGH DENSITY SPACE INTERCONNECT LEAD...

Electronic Device By Laser-Induced Forming and Transfer of Shaped M...

BONDING WIRE FOR SEMICONDUCTOR DEVICE

Laser-Induced Forming and Transfer of Shaped Metallic Interconnects

Laser-Induced Forming and Transfer of Shaped Metallic Interconnects

Semiconductor Package with Embedded Die

COATED WIRE FOR BONDING APPLICATIONS

COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR

CONNECTING WIRE AND METHOD FOR MANUFACTURING SAME

MANUFACTURING METHOD FOR A COMPOSITE METAL BONDING WIRE AND PRODUCT...