Modifying permanently or temporarily the pattern or the conductivity of conductive members

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H01L21/76886

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76886Modifying permanently or temporarily the pattern or the conductivity of conductive members

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integrated chip with graphene based interconnect
- Patent number 12,218,060
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 12,154,826
- Issue date Nov 26, 2024
- Kokusai Electric Corporation
- Masanori Nakayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Communication generation using sparse indicators and sensor data
- Patent number 12,099,579
- Issue date Sep 24, 2024
- COLOR HEALTH, INC.
- Ryan Barrett
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Metal loss prevention using implantation
- Patent number 12,068,195
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Chieh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trimming circuit and trimming method
- Patent number 12,033,941
- Issue date Jul 9, 2024
- Fuji Electric Co., Ltd.
- Morio Iwamizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-driven transition from insulator to conductor
- Patent number 11,923,245
- Issue date Mar 5, 2024
- Bowling Green State University
- Farida Selim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vias for cobalt-based interconnects and methods of fabrication thereof
- Patent number 11,908,735
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion layers in metal interconnects
- Patent number 11,901,225
- Issue date Feb 13, 2024
- Applied Materials, Inc.
- Eric J. Bergman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu3Sn via metallization in electrical devices for low-temperature 3...
- Patent number 11,854,879
- Issue date Dec 26, 2023
- Raytheon Company
- Andrew Clarke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a metal silicide contact to a silicon substrate
- Patent number 11,854,881
- Issue date Dec 26, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Biao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 11,837,645
- Issue date Dec 5, 2023
- Samsung Electronics Co., Ltd.
- Yoontae Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Communication generation using sparse indicators and sensor data
- Patent number 11,790,282
- Issue date Oct 17, 2023
- COLOR HEALTH, INC.
- Ryan Barrett
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with connecting structure having a doped layer...
- Patent number 11,791,204
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus and method of manufacturing the same
- Patent number 11,782,479
- Issue date Oct 10, 2023
- Samsung Display Co., Ltd.
- Sang Keun Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Contact structure for semiconductor device
- Patent number 11,776,847
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun-Yu Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including low-resistance interconnect and i...
- Patent number 11,769,695
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure, fabricating method thereof, and semicond...
- Patent number 11,749,603
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal loss prevention using implantation
- Patent number 11,710,659
- Issue date Jul 25, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Chieh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuitry, DRAM circuitry
- Patent number 11,683,927
- Issue date Jun 20, 2023
- Micron Technology, Inc.
- Hitoshi Ishigami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 11,664,275
- Issue date May 30, 2023
- Kokusai Electric Corporation
- Masanori Nakayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method of manufacturing the same
- Patent number 11,600,569
- Issue date Mar 7, 2023
- Samsung Electronics Co., Ltd.
- Su-Hyun Bark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for sub-lithography resolution patterning
- Patent number 11,557,515
- Issue date Jan 17, 2023
- Applied Materials, Inc.
- Sony Varghese
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 11,532,506
- Issue date Dec 20, 2022
- NANYA TECHNOLOGY CORPORATION
- Hung-Chi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etching of metals
- Patent number 11,424,134
- Issue date Aug 23, 2022
- Applied Materials, Inc.
- Nitin Deepak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial layers in source/drain contacts and methods of forming th...
- Patent number 11,410,890
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ding-Kang Shih
- C30 - CRYSTAL GROWTH
Information Patent Grant
Interconnection structure, fabricating method thereof, and semicond...
- Patent number 11,404,376
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vias for cobalt-based interconnects and methods of fabrication thereof
- Patent number 11,404,309
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Communication generation using sparse indicators and sensor data
- Patent number 11,361,842
- Issue date Jun 14, 2022
- COLOR HEALTH, INC.
- Ryan Barrett
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Roughening of a metallization layer on a semiconductor wafer
- Patent number 11,322,400
- Issue date May 3, 2022
- Infineon Technologies AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor device including a graphene barrie...
- Patent number 11,302,576
- Issue date Apr 12, 2022
- Tokyo Electron Limited
- Makoto Wada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT STRUCTURES WITH OVERLAPPING METAL VIAS
- Publication number 20250038107
- Publication date Jan 30, 2025
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A SEMICONDUCTOR STRUCTURE AND ITS FABRICATION METHOD
- Publication number 20250040128
- Publication date Jan 30, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Hong WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
- Publication number 20250022753
- Publication date Jan 16, 2025
- Kokusai Electric Corporation
- Masanori NAKAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMUNICATION GENERATION USING SPARSE INDICATORS AND SENSOR DATA
- Publication number 20250005110
- Publication date Jan 2, 2025
- Color Health, Inc.
- Ryan Barrett
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER...
- Publication number 20240395606
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH TOP VIA HAVING EXTENDED BOTTOM CONTACT
- Publication number 20240371750
- Publication date Nov 7, 2024
- International Business Machines Corporation
- Manasa MEDIKONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGHER PRESSURE PURGE FOR IMPURITY REDUCTION IN RADICAL TREATMENT C...
- Publication number 20240290585
- Publication date Aug 29, 2024
- Applied Materials, Inc.
- Pradeep SAMPATH KUMAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA FUSE WITH METAL-INSULATOR-METAL ARCHITECTURE AND IMPROVED ELECT...
- Publication number 20240222270
- Publication date Jul 4, 2024
- Intel Corporation
- Yao-Feng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240222266
- Publication date Jul 4, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Luguang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu3Sn VIA METALLIZATION IN ELECTRICAL DEVICES FOR LOW-TEMPERATURE 3...
- Publication number 20240203790
- Publication date Jun 20, 2024
- Raytheon Company
- Andrew Clarke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vias for Cobalt-Based Interconnects and Methods of Fabrication Thereof
- Publication number 20240194525
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED SUPER VIA TO MIDDLE METAL LINE LEVEL
- Publication number 20240178127
- Publication date May 30, 2024
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA-DOPED TRENCHES FOR MEMORY
- Publication number 20240105510
- Publication date Mar 28, 2024
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Openings Through Carrier Substrate of IC Package Assembly f...
- Publication number 20240038587
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kao-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE
- Publication number 20240021474
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Lid.
- Yun-Yu HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240004427
- Publication date Jan 4, 2024
- SAMSUNG DISPLAY CO., LTD.
- SANG KEUN LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
GRAPHENE-METAL HYBRID INTERCONNECT
- Publication number 20230402384
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Hong LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP WITH GRAPHENE BASED INTERCONNECT
- Publication number 20230387019
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER...
- Publication number 20230369103
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-Resistance Interconnect
- Publication number 20230369114
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
- Publication number 20230307295
- Publication date Sep 28, 2023
- Kokusai Electric Corporation
- Masanori NAKAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...
- Publication number 20230307294
- Publication date Sep 28, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ke MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADAPTIVE FILL TECHNIQUES FOR AVOIDING ELECTROMIGRATION
- Publication number 20230238280
- Publication date Jul 27, 2023
- International Business Machines Corporation
- Akil Khamisi Sutton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT LINE STRUCTURES WITH METAL CHALCOGENIDE CAP MATERIALS
- Publication number 20230197512
- Publication date Jun 22, 2023
- Intel Corporation
- Carl H. Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRE-DEPOSITION TREATMENT OF A WORK-FUNCTION METAL LAYER
- Publication number 20230106314
- Publication date Apr 6, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Yen TSAI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LIGHT-DRIVEN TRANSITION FROM INSULATOR TO CONDUCTOR
- Publication number 20230101586
- Publication date Mar 30, 2023
- Bowling Green State University
- Farida Selim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION LAYERS IN METAL INTERCONNECTS
- Publication number 20230077737
- Publication date Mar 16, 2023
- Applied Materials, Inc.
- Eric J. Bergman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE AND METHODS FOR FORMING THE SAME
- Publication number 20230061992
- Publication date Mar 2, 2023
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Mingkang ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20230064568
- Publication date Mar 2, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Biao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230040132
- Publication date Feb 9, 2023
- Samsung Electronics Co., Ltd.
- Jun Mo PARK
- H01 - BASIC ELECTRIC ELEMENTS

Modifying permanently or temporarily the pattern or the conductivity of conductive members

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated chip with graphene based interconnect

Method of manufacturing semiconductor device, substrate processing...

Communication generation using sparse indicators and sensor data

Metal loss prevention using implantation

Trimming circuit and trimming method

Light-driven transition from insulator to conductor

Vias for cobalt-based interconnects and methods of fabrication thereof

Diffusion layers in metal interconnects

Cu3Sn via metallization in electrical devices for low-temperature 3...

Method of making a metal silicide contact to a silicon substrate

Method of manufacturing a semiconductor device

Communication generation using sparse indicators and sensor data

Semiconductor device with connecting structure having a doped layer...

Electronic apparatus and method of manufacturing the same

Contact structure for semiconductor device

Semiconductor structure including low-resistance interconnect and i...

Interconnection structure, fabricating method thereof, and semicond...

Metal loss prevention using implantation

Integrated circuitry, DRAM circuitry

Method of manufacturing semiconductor device, substrate processing...

Integrated circuit device and method of manufacturing the same

Methods for sub-lithography resolution patterning

Integrated circuit structure

Atomic layer etching of metals

Epitaxial layers in source/drain contacts and methods of forming th...

Interconnection structure, fabricating method thereof, and semicond...

Vias for cobalt-based interconnects and methods of fabrication thereof

Communication generation using sparse indicators and sensor data

Roughening of a metallization layer on a semiconductor wafer

Method of making a semiconductor device including a graphene barrie...

Patents Applicationslast 30 patents

INTERCONNECT STRUCTURES WITH OVERLAPPING METAL VIAS

A SEMICONDUCTOR STRUCTURE AND ITS FABRICATION METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...

COMMUNICATION GENERATION USING SPARSE INDICATORS AND SENSOR DATA

SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER...

SEMICONDUCTOR STRUCTURE WITH TOP VIA HAVING EXTENDED BOTTOM CONTACT

HIGHER PRESSURE PURGE FOR IMPURITY REDUCTION IN RADICAL TREATMENT C...

VIA FUSE WITH METAL-INSULATOR-METAL ARCHITECTURE AND IMPROVED ELECT...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Cu3Sn VIA METALLIZATION IN ELECTRICAL DEVICES FOR LOW-TEMPERATURE 3...

Vias for Cobalt-Based Interconnects and Methods of Fabrication Thereof

ISOLATED SUPER VIA TO MIDDLE METAL LINE LEVEL

PLASMA-DOPED TRENCHES FOR MEMORY

Forming Openings Through Carrier Substrate of IC Package Assembly f...

CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE

ELECTRONIC APPARATUS AND METHOD OF MANUFACTURING THE SAME

GRAPHENE-METAL HYBRID INTERCONNECT

INTEGRATED CHIP WITH GRAPHENE BASED INTERCONNECT

SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER...

Low-Resistance Interconnect

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...

ADAPTIVE FILL TECHNIQUES FOR AVOIDING ELECTROMIGRATION

INTERCONNECT LINE STRUCTURES WITH METAL CHALCOGENIDE CAP MATERIALS

METHODS FOR PRE-DEPOSITION TREATMENT OF A WORK-FUNCTION METAL LAYER

LIGHT-DRIVEN TRANSITION FROM INSULATOR TO CONDUCTOR

DIFFUSION LAYERS IN METAL INTERCONNECTS

THREE-DIMENSIONAL MEMORY DEVICE AND METHODS FOR FORMING THE SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE