TREA

Moisture curing, i.e. curing by exposing to humidity

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Industry

  • CPC
  • H01L2224/82877
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/82877Moisture curing, i.e. curing by exposing to humidity
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Apparatus and Associated Methods
    • Publication number 20140345924
    • Publication date Nov 27, 2014
    • Nokia Corporation
    • Mark Lee ALLEN
    • H01 - BASIC ELECTRIC ELEMENTS