Moisture curing, i.e. curing by exposing to humidity

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H01L2224/83877

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83877Moisture curing, i.e. curing by exposing to humidity

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having recessed adhesive layer between stacke...
- Patent number 10,930,613
- Issue date Feb 23, 2021
- Samsung Electronics Co., Ltd.
- Sang Sick Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for bonding substrates
- Patent number 10,131,126
- Issue date Nov 20, 2018
- Applied Materials, Inc.
- Kadthala Ramaya Narendrnath
- B32 - LAYERED PRODUCTS
Information Patent Grant
Reactive hot-melt adhesive for use on electronics
- Patent number 9,659,832
- Issue date May 23, 2017
- H. B. Fuller Company
- Albert M. Giorgini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for bonding substrates
- Patent number 9,627,231
- Issue date Apr 18, 2017
- Applied Materials, Inc.
- Kadthala Ramaya Narendrnath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition, and adhesive sheet, semiconductor apparatus-p...
- Patent number 8,808,865
- Issue date Aug 19, 2014
- Shin-Etsu Chemical Co., Ltd.
- Kazunori Kondo
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200098719
- Publication date Mar 26, 2020
- Samsung Electronics Co., Ltd.
- Sang Sick PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REACTIVE HOT-MELT ADHESIVE FOR USE ON ELECTRONICS
- Publication number 20140242323
- Publication date Aug 28, 2014
- Albert M. Giorgini
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHODS FOR BONDING SUBSTRATES
- Publication number 20140099485
- Publication date Apr 10, 2014
- Kadthala Ramaya NARENDRNATH
- B32 - LAYERED PRODUCTS
Information Patent Application
ADHESIVE COMPOSITION, AND ADHESIVE SHEET, SEMICONDUCTOR APPARATUS-P...
- Publication number 20130289225
- Publication date Oct 31, 2013
- Shin-Etsu Chemical Co., Ltd.
- Kazunori KONDO
- H01 - BASIC ELECTRIC ELEMENTS