Molybdenum [Mo] as principal constituent

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H01L2224/1388

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/1388Molybdenum [Mo] as principal constituent

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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

Information Patent Application
ROOM TEMPERATURE DIRECT METAL-METAL BONDING
- Publication number 20110226841
- Publication date Sep 22, 2011
- Jun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nanoscopic Assurance Coating for Lead-Free Solders
- Publication number 20080075872
- Publication date Mar 27, 2008
- Joseph D. Lichtenhan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR