Molybdenum [Mo] as principal constituent

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H01L2224/2948

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/2948Molybdenum [Mo] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Alternative compositions for high temperature soldering applications
- Patent number 11,440,142
- Issue date Sep 13, 2022
- Ormet Circuits, Inc.
- Catherine A Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser bonding method
- Patent number 11,107,790
- Issue date Aug 31, 2021
- Electronics and Telecommunications Research Institute
- Kwang-Seong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Engineered polymer-based electronic materials
- Patent number 10,682,732
- Issue date Jun 16, 2020
- Alpha Assembly Solutions Inc.
- Ramakrishna Hosur Venkatagiriyappa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic conductive film and method for manufacturing the same
- Patent number 10,494,549
- Issue date Dec 3, 2019
- Samsung Display Co., Ltd.
- Minseok Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic conductive film, method for producing anisotropic condu...
- Patent number 10,373,926
- Issue date Aug 6, 2019
- Dexerials Corporation
- Kouichi Sato
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Connection body, method for manufacturing a connection body, connec...
- Patent number 10,175,544
- Issue date Jan 8, 2019
- Dexerials Corporation
- Seiichiro Shinohara
- G02 - OPTICS
Information Patent Grant
Anisotropic conductive film, method for producing anisotropic condu...
- Patent number 9,960,139
- Issue date May 1, 2018
- Dexerials Corporation
- Kouichi Sato
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electronic component module and method for manufacturing electronic...
- Patent number 9,860,989
- Issue date Jan 2, 2018
- Murata Manufacturing Co., Ltd.
- Shinya Kiyono
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip packages and methods of manufacture thereof
- Patent number 9,735,130
- Issue date Aug 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation structure, fabricating method, and electronic appa...
- Patent number 9,659,836
- Issue date May 23, 2017
- Fujitsu Limited
- Yukie Sakita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroconductive microparticles, anisotropic electroconductive mat...
- Patent number 9,478,326
- Issue date Oct 25, 2016
- Sekisui Chemical Co., Ltd.
- Hiroya Ishida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic conductive adhesive with reduced migration
- Patent number 9,365,749
- Issue date Jun 14, 2016
- Sunray Scientific, LLC
- S. Kumar Khanna
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Connection device, method for manufacturing connection structure, m...
- Patent number 9,196,599
- Issue date Nov 24, 2015
- Dexerials Corporation
- Takayuki Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device including thermal comp...
- Patent number 9,171,820
- Issue date Oct 27, 2015
- Cheil Industries, Inc.
- Kil Yong Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of fabricating package stack structure and method of mounti...
- Patent number 9,136,255
- Issue date Sep 15, 2015
- SAMSUNG ELECTRONICS CO., LTD.
- Sun-Kyoung Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit component and method of making the same
- Patent number 9,019,714
- Issue date Apr 28, 2015
- Hitachi Chemical Company, Ltd.
- Kazuya Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of fabricating package stack structure and method of mounti...
- Patent number 8,698,317
- Issue date Apr 15, 2014
- Samsung Electronics Co., Ltd.
- Sun-Kyoung Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curing layers of a semiconductor product using electromagnetic fields
- Patent number 7,781,876
- Issue date Aug 24, 2010
- Infineon Technologies AG
- Horst Theuss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package thermal interface materials with dielectric obstructio...
- Patent number 7,776,657
- Issue date Aug 17, 2010
- Intel Corporation
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package thermal interface materials with dielectric obstructio...
- Patent number 7,332,807
- Issue date Feb 19, 2008
- Intel Corporation
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluxing underfill compositions
- Patent number 7,009,009
- Issue date Mar 7, 2006
- Henkel Corporation
- Lawrence N. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally reworkable epoxy resins and compositions based thereon
- Patent number 6,916,890
- Issue date Jul 12, 2005
- Henkel Corporation
- John G. Woods
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Reworkable and thermally conductive adhesive and use thereof
- Patent number 6,777,817
- Issue date Aug 17, 2004
- International Business Machines Corporation
- Stephen Buchwalter
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of bonding die chip with underfill fluxing composition
- Patent number 6,667,194
- Issue date Dec 23, 2003
- Henkel Loctite Corporation
- Lawrence N. Crane
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Reworkable and thermally conductive adhesive and use thereof
- Patent number 6,617,698
- Issue date Sep 9, 2003
- International Business Machines Corporation
- Stephen Buchwalter
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition with cycloaliphatic epoxy-functional siloxane
- Patent number 5,863,970
- Issue date Jan 26, 1999
- Polyset Company, Inc.
- Ramkrishna Ghoshal
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Core-Shell Particle Die-Attach Material
- Publication number 20240182757
- Publication date Jun 6, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LASER BONDING METHOD AND A SEMICONDUCTOR PACKAGE INCLUDING A BONDIN...
- Publication number 20210358885
- Publication date Nov 18, 2021
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Kwang-Seong CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER BONDING METHOD
- Publication number 20200075535
- Publication date Mar 5, 2020
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Kwang-Seong CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING ANISOTROPIC CONDU...
- Publication number 20180218994
- Publication date Aug 2, 2018
- DEXERIALS CORPORATION
- Kouichi SATO
- B32 - LAYERED PRODUCTS
Information Patent Application
ELECTRIC DEVICE, METHOD FOR MANUFACTURING THE SAME, AND RADIATION...
- Publication number 20140361183
- Publication date Dec 11, 2014
- Shinichi Takeda
- G01 - MEASURING TESTING
Information Patent Application
Anisotropic Conductive Adhesive with Reduced Migration
- Publication number 20140353540
- Publication date Dec 4, 2014
- SUNRAY SCIENTIFIC, LLC
- S. Kumar Khanna
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONNECTION DEVICE, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, M...
- Publication number 20140302643
- Publication date Oct 9, 2014
- Takayuki Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING PACKAGE STACK STRUCTURE AND METHOD OF MOUNTI...
- Publication number 20140197529
- Publication date Jul 17, 2014
- Sun-Kyoung Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140179065
- Publication date Jun 26, 2014
- Kil Yong LEE
- G02 - OPTICS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140106160
- Publication date Apr 17, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- CHANG-CHIN WU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...
- Publication number 20130292168
- Publication date Nov 7, 2013
- ROBERT BOSCH GmbH
- Daniel Wolde-Giorgis
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
STARTING MATERIAL AND PROCESS FOR PRODUCING A SINTERED JOIN
- Publication number 20130251447
- Publication date Sep 26, 2013
- ROBERT BOSCH GmbH
- Thomas Kalich
- B32 - LAYERED PRODUCTS
Information Patent Application
STARTING MATERIAL AND PROCESS FOR PRODUCING A SINTERED JOIN
- Publication number 20130216848
- Publication date Aug 22, 2013
- ROBERT BOSCH GmbH
- Thomas Kalich
- B32 - LAYERED PRODUCTS
Information Patent Application
CIRCUIT COMPONENT AND METHOD OF MAKING THE SAME
- Publication number 20130120948
- Publication date May 16, 2013
- HITACHI CHEMICAL CO., Ltd.
- Kazuya Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Metal Layer on a Substrate and Device
- Publication number 20120292773
- Publication date Nov 22, 2012
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF FABRICATING PACKAGE STACK STRUCTURE AND METHOD OF MOUNTI...
- Publication number 20120074586
- Publication date Mar 29, 2012
- Samsung Electronics Co., Ltd.
- Sun-Kyoung SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE
- Publication number 20110115078
- Publication date May 19, 2011
- Samsung Electronics Co., Ltd.
- Se-Young JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENTS MOUNTING ADHESIVE, MANUFACTURING METHOD OF AN...
- Publication number 20090161328
- Publication date Jun 25, 2009
- Matsushita Electric Industrial Co., Ltd.
- Tadahiko Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CURING LAYERS OF A SEMICONDUCTOR PRODUCT USING ELECTROMAGNETIC FIELDS
- Publication number 20080251904
- Publication date Oct 16, 2008
- Infineon Technologies AG
- Horst Theuss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE THERMAL INTERFACE MATERIALS WITH DIELECTRIC OBSTRUCTIO...
- Publication number 20080064144
- Publication date Mar 13, 2008
- Intel Corporation
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITIONS FOR USE IN ELECTRONICS DEVICES
- Publication number 20080054227
- Publication date Mar 6, 2008
- National Starch and Chemical Investment Holding Corporation
- Demetrius McCormick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chip package thermal interface materials with dielectric obstructio...
- Publication number 20070158823
- Publication date Jul 12, 2007
- Intel Corporation
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages, anisotropic conductive films, and conductive particles ut...
- Publication number 20070063347
- Publication date Mar 22, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Yuan Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Compositions for use in electronics devices
- Publication number 20050247916
- Publication date Nov 10, 2005
- Demetrius McCormick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermally conductive compositions and methods of making thereof
- Publication number 20050228097
- Publication date Oct 13, 2005
- General Electric Company
- Hong Zhong
- B82 - NANO-TECHNOLOGY
Information Patent Application
Reworkable and thermally conductive adhesive and use thereof
- Publication number 20040041280
- Publication date Mar 4, 2004
- International Business Machines Corporation
- Stephen L. Buchwalter
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Reworkable and thermally conductive adhesive and use thereof
- Publication number 20020171132
- Publication date Nov 21, 2002
- International Business Machines Corporation
- Stephen Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS

Molybdenum [Mo] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Alternative compositions for high temperature soldering applications

Laser bonding method

Engineered polymer-based electronic materials

Anisotropic conductive film and method for manufacturing the same

Anisotropic conductive film, method for producing anisotropic condu...

Connection body, method for manufacturing a connection body, connec...

Anisotropic conductive film, method for producing anisotropic condu...

Electronic component module and method for manufacturing electronic...

Chip packages and methods of manufacture thereof

Heat dissipation structure, fabricating method, and electronic appa...

Electroconductive microparticles, anisotropic electroconductive mat...

Anisotropic conductive adhesive with reduced migration

Connection device, method for manufacturing connection structure, m...

Method of manufacturing semiconductor device including thermal comp...

Methods of fabricating package stack structure and method of mounti...

Circuit component and method of making the same

Methods of fabricating package stack structure and method of mounti...

Curing layers of a semiconductor product using electromagnetic fields

Chip package thermal interface materials with dielectric obstructio...

Chip package thermal interface materials with dielectric obstructio...

Fluxing underfill compositions

Thermally reworkable epoxy resins and compositions based thereon

Reworkable and thermally conductive adhesive and use thereof

Method of bonding die chip with underfill fluxing composition

Reworkable and thermally conductive adhesive and use thereof

Epoxy resin composition with cycloaliphatic epoxy-functional siloxane

Patents Applicationslast 30 patents

Core-Shell Particle Die-Attach Material

LASER BONDING METHOD AND A SEMICONDUCTOR PACKAGE INCLUDING A BONDIN...

LASER BONDING METHOD

ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING ANISOTROPIC CONDU...

ELECTRIC DEVICE, METHOD FOR MANUFACTURING THE SAME, AND RADIATION...

Anisotropic Conductive Adhesive with Reduced Migration

CONNECTION DEVICE, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, M...

METHODS OF FABRICATING PACKAGE STACK STRUCTURE AND METHOD OF MOUNTI...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

ANISOTROPIC CONDUCTIVE FILM AND METHOD FOR MANUFACTURING THE SAME

STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...

STARTING MATERIAL AND PROCESS FOR PRODUCING A SINTERED JOIN

STARTING MATERIAL AND PROCESS FOR PRODUCING A SINTERED JOIN

CIRCUIT COMPONENT AND METHOD OF MAKING THE SAME

Method for Producing a Metal Layer on a Substrate and Device

METHODS OF FABRICATING PACKAGE STACK STRUCTURE AND METHOD OF MOUNTI...

FLIP CHIP PACKAGE

ELECTRONIC COMPONENTS MOUNTING ADHESIVE, MANUFACTURING METHOD OF AN...

CURING LAYERS OF A SEMICONDUCTOR PRODUCT USING ELECTROMAGNETIC FIELDS

CHIP PACKAGE THERMAL INTERFACE MATERIALS WITH DIELECTRIC OBSTRUCTIO...

COMPOSITIONS FOR USE IN ELECTRONICS DEVICES

Chip package thermal interface materials with dielectric obstructio...

Packages, anisotropic conductive films, and conductive particles ut...

Compositions for use in electronics devices

Thermally conductive compositions and methods of making thereof

Reworkable and thermally conductive adhesive and use thereof

Reworkable and thermally conductive adhesive and use thereof