Molybdenum [Mo] as principal constituent

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H01L2224/8158

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/8158Molybdenum [Mo] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor memory device and method of manufacturing the same
- Patent number 11,177,249
- Issue date Nov 16, 2021
- SK hynix Inc.
- Kun Young Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200243499
- Publication date Jul 30, 2020
- SK HYNIX INC.
- Kun Young LEE
- H01 - BASIC ELECTRIC ELEMENTS