Molybdenum [Mo] as principal constituent

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CPC
H01L2224/1338

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/1338Molybdenum [Mo] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Low pressure sintering powder
- Patent number 10,998,284
- Issue date May 4, 2021
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Engineered polymer-based electronic materials
- Patent number 10,682,732
- Issue date Jun 16, 2020
- Alpha Assembly Solutions Inc.
- Ramakrishna Hosur Venkatagiriyappa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin fluxed solder paste, and mount structure
- Patent number 10,440,834
- Issue date Oct 8, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hirohisa Hino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photosensitive resin composition, film adhesive, adhesive sheet, ad...
- Patent number 10,428,253
- Issue date Oct 1, 2019
- Hitachi Chemical Company, Ltd.
- Tomonori Minegishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for producing metal ball, joining material, and metal ball
- Patent number 10,150,185
- Issue date Dec 11, 2018
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing metal powder
- Patent number 10,130,995
- Issue date Nov 20, 2018
- Alpha Assembly Solutions Inc.
- Nirmalya Kumar Chaki
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Solid-state device including a conductive bump connected to a metal...
- Patent number 9,966,332
- Issue date May 8, 2018
- Toyoda Gosei Co., Ltd.
- Yoshinobu Suehiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic intermetallic compound interconnect
- Patent number 9,847,308
- Issue date Dec 19, 2017
- Intel Corporation
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,563,397
- Issue date Oct 22, 2013
- Semiconductor Energy Laboratory Co., Ltd.
- Akihiro Chida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Elastic conductive resin, and electronic device including elastic c...
- Patent number 7,875,807
- Issue date Jan 25, 2011
- Ricoh Company, Ltd.
- Takeshi Sano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Underfill and encapsulation of semiconductor assemblies with materi...
- Patent number 7,547,978
- Issue date Jun 16, 2009
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die containing particle-filled through-silicon m...
- Patent number 7,528,006
- Issue date May 5, 2009
- Intel Corporation
- Leonel Arana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices at least partially covered by a composite coa...
- Patent number 7,282,806
- Issue date Oct 16, 2007
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, mounting circuit board, method of producing t...
- Patent number 6,909,180
- Issue date Jun 21, 2005
- Matsushita Electric Industrial Co., Ltd.
- Masahiro Ono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LOW PRESSURE SINTERING POWDER
- Publication number 20240413117
- Publication date Dec 12, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240047446
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF CONDUCTIVE CIRCUIT
- Publication number 20140374005
- Publication date Dec 25, 2014
- Shin-Etsu Chemical Co., Ltd.
- Yoshitaka Hamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Metal Bump Die Assembly
- Publication number 20140193952
- Publication date Jul 10, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130248916
- Publication date Sep 26, 2013
- Toyoda Gosei Co., Ltd.
- Yoshinobu Suehiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit die containing particale-filled through-silicon...
- Publication number 20100193952
- Publication date Aug 5, 2010
- Leonel Arana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20100171221
- Publication date Jul 8, 2010
- Akihiro CHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELASTIC CONDUCTIVE RESIN, AND ELECTRONIC DEVICE INCLUDING ELASTIC C...
- Publication number 20070132098
- Publication date Jun 14, 2007
- Takeshi Sano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of underfilling and encapsulating semiconductor assemblies...
- Publication number 20070020814
- Publication date Jan 25, 2007
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit die containing particle-filled through-silicon m...
- Publication number 20070001266
- Publication date Jan 4, 2007
- Leonel Arana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices at least partially covered by a composite coa...
- Publication number 20070001321
- Publication date Jan 4, 2007
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill and encapsulation of semicondcutor assemblies with materi...
- Publication number 20050277231
- Publication date Dec 15, 2005
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit substrate for packaging semiconductor device, method for pr...
- Publication number 20050163982
- Publication date Jul 28, 2005
- Masahiro Ono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Elastic conductive resin, and electronic device including elastic c...
- Publication number 20040108133
- Publication date Jun 10, 2004
- Takeshi Sano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device, mounting circuit board, method of producing t...
- Publication number 20030049425
- Publication date Mar 13, 2003
- Masahiro Ono
- H01 - BASIC ELECTRIC ELEMENTS

Molybdenum [Mo] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low pressure sintering powder

Sintering materials and attachment methods using same

Low pressure sintering powder

Engineered polymer-based electronic materials

Resin fluxed solder paste, and mount structure

Photosensitive resin composition, film adhesive, adhesive sheet, ad...

Method for producing metal ball, joining material, and metal ball

Method for manufacturing metal powder

Solid-state device including a conductive bump connected to a metal...

Magnetic intermetallic compound interconnect

Semiconductor device and manufacturing method thereof

Elastic conductive resin, and electronic device including elastic c...

Underfill and encapsulation of semiconductor assemblies with materi...

Integrated circuit die containing particle-filled through-silicon m...

Semiconductor devices at least partially covered by a composite coa...

Semiconductor device, mounting circuit board, method of producing t...

Patents Applicationslast 30 patents

LOW PRESSURE SINTERING POWDER

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

FORMATION OF CONDUCTIVE CIRCUIT

Methods for Metal Bump Die Assembly

SOLID-STATE DEVICE AND METHOD OF MANUFACTURING THE SAME

Integrated circuit die containing particale-filled through-silicon...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

ELASTIC CONDUCTIVE RESIN, AND ELECTRONIC DEVICE INCLUDING ELASTIC C...

Methods of underfilling and encapsulating semiconductor assemblies...

Integrated circuit die containing particle-filled through-silicon m...

Semiconductor devices at least partially covered by a composite coa...

Underfill and encapsulation of semicondcutor assemblies with materi...

Circuit substrate for packaging semiconductor device, method for pr...

Elastic conductive resin, and electronic device including elastic c...

Semiconductor device, mounting circuit board, method of producing t...