Molybdenum [Mo] as principal constituent

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H01L2224/1348

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/1348Molybdenum [Mo] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Engineered polymer-based electronic materials
- Patent number 10,682,732
- Issue date Jun 16, 2020
- Alpha Assembly Solutions Inc.
- Ramakrishna Hosur Venkatagiriyappa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component module and method for manufacturing electronic...
- Patent number 9,860,989
- Issue date Jan 2, 2018
- Murata Manufacturing Co., Ltd.
- Shinya Kiyono
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Alpha particle blocking wire structure and method fabricating same
- Patent number 8,129,267
- Issue date Mar 6, 2012
- International Business Machines Corporation
- Cyril Cabral, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and fabricating method thereof, semiconductor device a...
- Patent number 6,812,549
- Issue date Nov 2, 2004
- Seiko Epson Corporation
- Kazushige Umetsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and fabricating method thereof, semiconductor device a...
- Patent number 6,596,634
- Issue date Jul 22, 2003
- Seiko Epson Corporation
- Kazushige Umetsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ALPHA PARTICLE BLOCKING WIRE STRUCTURE AND METHOD FABRICATING SAME
- Publication number 20120028458
- Publication date Feb 2, 2012
- Cyril Cabral, JR.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring board and fabricating method thereof, semiconductor device a...
- Publication number 20030060000
- Publication date Mar 27, 2003
- SEIKO EPSON CORPORATION
- Kazushige Umetsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring board and fabricating method thereof, semiconductor device a...
- Publication number 20020127839
- Publication date Sep 12, 2002
- SEIKO EPSON CORPORATION
- Kazushige Umetsu
- H01 - BASIC ELECTRIC ELEMENTS