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Molybdenum [Mo] as principal constituent
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CPC
H01L2224/8448
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/8448
Molybdenum [Mo] as principal constituent
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Patent Application
POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING A POWER SEMI...
Publication number
20120211799
Publication date
Aug 23, 2012
ABB Research Ltd.
Chunlei LIU
H01 - BASIC ELECTRIC ELEMENTS