Molybdenum (Mo) as principal constituent

Industry

CPC
H01L2224/4568

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4568Molybdenum (Mo) as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chip package, method of forming a chip package and method of formin...
- Patent number 12,033,972
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack package and methods of manufacturing the same
- Patent number 11,929,262
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Jae-in Won
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack package and methods of manufacturing the same
- Patent number 11,651,975
- Issue date May 16, 2023
- Samsung Electronics Co., Ltd.
- Jae-in Won
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electrical contact and method of forming a chi...
- Patent number 10,978,418
- Issue date Apr 13, 2021
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack package and methods of manufacturing the same
- Patent number 10,770,311
- Issue date Sep 8, 2020
- Samsung Electronics Co., Ltd.
- Jae-in Won
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate, method of manufacturing the same, display panel,...
- Patent number 10,636,865
- Issue date Apr 28, 2020
- Chengdu Boe Optoelectronics Technology Co., Ltd.
- Ming Mao
- G02 - OPTICS
Information Patent Grant
Chip package and method of forming a chip package with a metal cont...
- Patent number 10,461,056
- Issue date Oct 29, 2019
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting apparatus
- Patent number 10,374,136
- Issue date Aug 6, 2019
- Nichia Corporation
- Ryohei Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device mount, leadframe, and light emitting apparatus
- Patent number 10,115,876
- Issue date Oct 30, 2018
- Nichia Corporation
- Ryohei Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,115,656
- Issue date Oct 30, 2018
- Renesas Electronics Corporation
- Yoshihisa Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,972,598
- Issue date May 15, 2018
- Renesas Electronics Corporation
- Yuki Yagyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED package with covered bonding wire
- Patent number 9,882,107
- Issue date Jan 30, 2018
- Citizen Electronics Co., Ltd.
- Takashi Iino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing printed circuit boards
- Patent number 9,648,720
- Issue date May 9, 2017
- Semblant Global Limited
- Frank Ferdinandi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device mount, leadframe, and light emitting apparatus
- Patent number 9,583,688
- Issue date Feb 28, 2017
- Nichia Corporation
- Ryohei Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coating layer for a conductive structure
- Patent number 9,337,164
- Issue date May 10, 2016
- Freescale Semiconductors, Inc.
- Rama I. Hegde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for reducing corrosion in wire bonds
- Patent number 9,324,675
- Issue date Apr 26, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable wire method
- Patent number 9,245,670
- Issue date Jan 26, 2016
- Tessera, Inc.
- Cyprian Uzoh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Core-jacket bonding wire
- Patent number 9,236,166
- Issue date Jan 12, 2016
- Heraeus Deutschland GmbH & Co. KG
- Eugen Milke
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 9,112,059
- Issue date Aug 18, 2015
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device, method of manufacturing the device and...
- Patent number 9,059,003
- Issue date Jun 16, 2015
- NIPPON MICROMETAL CORPORATION
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module system having encapsulated through wire interc...
- Patent number 9,018,751
- Issue date Apr 28, 2015
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device with a layer including niobium, and/or tantalu...
- Patent number 8,836,120
- Issue date Sep 16, 2014
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor
- Patent number 8,815,019
- Issue date Aug 26, 2014
- Nippon Steel & Sumikin Materials., Ltd.
- Tomohiro Uno
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method for fabricating a through wire interconnect (TWI) on a semic...
- Patent number 8,741,667
- Issue date Jun 3, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Reliable wire structure and method
- Patent number 8,692,118
- Issue date Apr 8, 2014
- Tessera, Inc.
- Cyprian Uzoh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Copper alloy bonding wire for semiconductor device
- Patent number 8,610,291
- Issue date Dec 17, 2013
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through wire interconnect (TWI) having bonded connection and encaps...
- Patent number 8,581,387
- Issue date Nov 12, 2013
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Printed circuit boards
- Patent number 8,492,898
- Issue date Jul 23, 2013
- Semblant Global Limited
- Frank Ferdinandi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting wire and method for manufacturing same
- Patent number 8,450,611
- Issue date May 28, 2013
- Heraeus Materials Technology GmbH & Co. KG
- Rainer Dohle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating stacked semiconductor system with encapsulat...
- Patent number 8,404,523
- Issue date Mar 26, 2013
- Micron Technoloy, Inc.
- David R. Hembree
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
WIRE COATING APPARATUS
- Publication number 20240194632
- Publication date Jun 13, 2024
- Woong Chul SHIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
AI WIRING MATERIAL
- Publication number 20240105668
- Publication date Mar 28, 2024
- NIPPON MICROMETAL CORPORATION
- Yuto KURIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGE AND METHODS OF MANUFACTURING THE SAME
- Publication number 20230245902
- Publication date Aug 3, 2023
- Samsung Electronics Co., Ltd.
- Jae-in Won
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
- Publication number 20210082861
- Publication date Mar 18, 2021
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGE AND METHODS OF MANUFACTURING THE SAME
- Publication number 20200381267
- Publication date Dec 3, 2020
- Samsung Electronics Co., Ltd.
- Jae-in Won
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING APPARATUS
- Publication number 20190027667
- Publication date Jan 24, 2019
- Nichia Corporation.
- Ryohei YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING SYSTEMS AND RELATED METHODS
- Publication number 20190013290
- Publication date Jan 10, 2019
- Semiconductor Components Industries, LLC
- Wentao QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180082977
- Publication date Mar 22, 2018
- RENESAS ELECTRONICS CORPORATION
- Yuki YAGYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED PACKAGE
- Publication number 20170200876
- Publication date Jul 13, 2017
- Citizen Electronics Co., Ltd.
- Takashi Iino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER BONDING WIRE WITH ANGSTROM (Å) THICK SURFACE OXIDE LAYER
- Publication number 20170154863
- Publication date Jun 1, 2017
- Heraeus Deutschland GmbH & Co. KG
- Murali SARANGAPANI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
STRUCTURES AND METHODS FOR REDUCING CORROSION IN WIRE BONDS
- Publication number 20150311173
- Publication date Oct 29, 2015
- BURTON J. CARPENTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATING LAYER FOR A CONDUCTIVE STRUCTURE
- Publication number 20150214177
- Publication date Jul 30, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Rama I. Hegde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...
- Publication number 20140327018
- Publication date Nov 6, 2014
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR ELECTRONIC ASSEMBLY WITH IMPROVED INTERCONNECT AND AS...
- Publication number 20140264783
- Publication date Sep 18, 2014
- Altera Corporation
- Hui Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE MOUNT, LIGHT EMITTING APPARATUS INCLUDING THE...
- Publication number 20140264426
- Publication date Sep 18, 2014
- Nichia Corporation.
- Ryohei YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...
- Publication number 20140225259
- Publication date Aug 14, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
RELIABLE WIRE STRUCTURE AND METHOD
- Publication number 20140157592
- Publication date Jun 12, 2014
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A THROUGH WIRE INTERCONNECT (TWI) ON A SEMIC...
- Publication number 20140038406
- Publication date Feb 6, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
Printed Circuit Boards
- Publication number 20130334292
- Publication date Dec 19, 2013
- Frank Ferdinandi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORE-JACKET BONDING WIRE
- Publication number 20130213689
- Publication date Aug 22, 2013
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Eugen Milke
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
RELIABLE WIRE STRUCTURE AND METHOD
- Publication number 20120325517
- Publication date Dec 27, 2012
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING STACKED SEMICONDUCTOR SYSTEM WITH ENCAPSULAT...
- Publication number 20120288997
- Publication date Nov 15, 2012
- Micron Technology, Inc.
- DAVID R. HEMBREE
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Device and Bonding Wire
- Publication number 20120267784
- Publication date Oct 25, 2012
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20120104613
- Publication date May 3, 2012
- NIPPON MICROMETAL CORPORATION
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Module System Having Stacked Components With Encapsul...
- Publication number 20120043670
- Publication date Feb 23, 2012
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR
- Publication number 20110120594
- Publication date May 26, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
System With Semiconductor Components Having Encapsulated Through Wi...
- Publication number 20110024745
- Publication date Feb 3, 2011
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20110011618
- Publication date Jan 20, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20110011619
- Publication date Jan 20, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE BONDING WIRE AND WIRE BONDING METHOD
- Publication number 20100327450
- Publication date Dec 30, 2010
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS

Molybdenum (Mo) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip package, method of forming a chip package and method of formin...

Stack package and methods of manufacturing the same

Stack package and methods of manufacturing the same

Method of forming an electrical contact and method of forming a chi...

Stack package and methods of manufacturing the same

Display substrate, method of manufacturing the same, display panel,...

Chip package and method of forming a chip package with a metal cont...

Light emitting apparatus

Light emitting device mount, leadframe, and light emitting apparatus

Semiconductor device

Method of manufacturing semiconductor device

LED package with covered bonding wire

Method for manufacturing printed circuit boards

Light emitting device mount, leadframe, and light emitting apparatus

Coating layer for a conductive structure

Structures for reducing corrosion in wire bonds

Reliable wire method

Core-jacket bonding wire

Bonding wire for semiconductor device

Power semiconductor device, method of manufacturing the device and...

Semiconductor module system having encapsulated through wire interc...

Semiconductor device with a layer including niobium, and/or tantalu...

Bonding wire for semiconductor

Method for fabricating a through wire interconnect (TWI) on a semic...

Reliable wire structure and method

Copper alloy bonding wire for semiconductor device

Through wire interconnect (TWI) having bonded connection and encaps...

Printed circuit boards

Connecting wire and method for manufacturing same

Method for fabricating stacked semiconductor system with encapsulat...

Patents Applicationslast 30 patents

WIRE COATING APPARATUS

AI WIRING MATERIAL

STACK PACKAGE AND METHODS OF MANUFACTURING THE SAME

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...

STACK PACKAGE AND METHODS OF MANUFACTURING THE SAME

LIGHT EMITTING APPARATUS

WIRE BONDING SYSTEMS AND RELATED METHODS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

LED PACKAGE

COPPER BONDING WIRE WITH ANGSTROM (Å) THICK SURFACE OXIDE LAYER

STRUCTURES AND METHODS FOR REDUCING CORROSION IN WIRE BONDS

COATING LAYER FOR A CONDUCTIVE STRUCTURE

POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...

APPARATUS FOR ELECTRONIC ASSEMBLY WITH IMPROVED INTERCONNECT AND AS...

LIGHT EMITTING DEVICE MOUNT, LIGHT EMITTING APPARATUS INCLUDING THE...

SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...

RELIABLE WIRE STRUCTURE AND METHOD

METHOD FOR FABRICATING A THROUGH WIRE INTERCONNECT (TWI) ON A SEMIC...

Printed Circuit Boards

CORE-JACKET BONDING WIRE

RELIABLE WIRE STRUCTURE AND METHOD

METHOD FOR FABRICATING STACKED SEMICONDUCTOR SYSTEM WITH ENCAPSULAT...

Semiconductor Device and Bonding Wire

BONDING WIRE FOR SEMICONDUCTOR DEVICE

Semiconductor Module System Having Stacked Components With Encapsul...

BONDING WIRE FOR SEMICONDUCTOR

System With Semiconductor Components Having Encapsulated Through Wi...

COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE BONDING WIRE AND WIRE BONDING METHOD