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Molybdenum [Mo] as principal constituent
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CPC
H01L2224/2998
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/2998
Molybdenum [Mo] as principal constituent
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Patent Application
Metal Nitride Core-Shell Particle Die-Attach Material
Publication number
20240282741
Publication date
Aug 22, 2024
Wolfspeed, Inc.
Afshin Dadvand
H01 - BASIC ELECTRIC ELEMENTS