Molybdenum [Mo] as principal constituent

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H01L2224/1328

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/1328Molybdenum [Mo] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Systems, methods and devices for inter-substrate coupling
- Patent number 9,728,489
- Issue date Aug 8, 2017
- Elwha LLC
- William David Duncan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package structure and method of manufacturing the same
- Patent number 9,230,935
- Issue date Jan 5, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit die containing particle-filled through-silicon m...
- Patent number 7,528,006
- Issue date May 5, 2009
- Intel Corporation
- Leonel Arana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding solder pads of flip-chip package
- Patent number 7,387,910
- Issue date Jun 17, 2008
- Korea Advanced Institute of Science and Technology
- Woong-Sun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE ON PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140159233
- Publication date Jun 12, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit die containing particale-filled through-silicon...
- Publication number 20100193952
- Publication date Aug 5, 2010
- Leonel Arana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit die containing particle-filled through-silicon m...
- Publication number 20070001266
- Publication date Jan 4, 2007
- Leonel Arana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of bonding solder pads of flip-chip package
- Publication number 20060258049
- Publication date Nov 16, 2006
- Korea Advanced Institute of Science and Technology
- Woong-Sun Lee
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...