Monitoring a manufacturing process

Industry

CPC
H05K2203/163

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/163Monitoring a manufacturing process

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for detecting and adjusting poor back drills in printed circ...
- Patent number 12,135,347
- Issue date Nov 5, 2024
- R&D Circuits
- Michael Caprio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 12,101,890
- Issue date Sep 24, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Myung Ju Gi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of assessing ink deposition accuracy in an electronic device...
- Patent number 12,096,567
- Issue date Sep 17, 2024
- SOCOVAR SOCIÉTÉ EN COMMANDITE
- François Blanchard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for soldering an electronic component to a circuit board by...
- Patent number 12,028,987
- Issue date Jul 2, 2024
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems for coating a substrate
- Patent number 12,004,303
- Issue date Jun 4, 2024
- Nordson Corporation
- Michel Van De Vijver
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Automatically controlling a liquid spray pattern
- Patent number 11,938,498
- Issue date Mar 26, 2024
- Precision Valve & Automation, Inc.
- Jason Schoen
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Traceability of subsequent layer structure manufacturing of main bo...
- Patent number 11,937,369
- Issue date Mar 19, 2024
- AT&S(China) Co. Ltd.
- Seok Kim Tay
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board and component fabrication apparatus
- Patent number 11,919,227
- Issue date Mar 5, 2024
- DST INNOVATIONS, LTD.
- Anthony Miles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of fabricating a beaded path on the surface of a substrate,...
- Patent number 11,856,709
- Issue date Dec 26, 2023
- AGNIESZKA MAGDZIARZ CADENAS
- Zbigniew Rozynek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for transferring a conductive pattern to a substrate and...
- Patent number 11,792,942
- Issue date Oct 17, 2023
- Fondazione Istituto Italiano di Tecnologia
- Alessandro Chiolerio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reliability enhancement of press fit connectors
- Patent number 11,784,424
- Issue date Oct 10, 2023
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for back-drilling a multi-layer circuit board
- Patent number 11,690,177
- Issue date Jun 27, 2023
- NextGin Technology BV
- J.A.A.M. Tourne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder member mounting system
- Patent number 11,583,948
- Issue date Feb 21, 2023
- Samsung Electronics Co., Ltd.
- Soo-Hwan Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for in-situ warpage monitoring during solder reflow for hea...
- Patent number 11,558,964
- Issue date Jan 17, 2023
- International Business Machines Corporation
- Jennifer I. Bennett
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Grid clustering-based system for locating an abnormal area of solde...
- Patent number 11,544,836
- Issue date Jan 3, 2023
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Li Yu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System and method for bonding a cable to a substrate using a die bo...
- Patent number 11,540,399
- Issue date Dec 27, 2022
- HRL Laboratories, LLC
- Peter Brewer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible film, flexible film package and method for manufacturing f...
- Patent number 11,540,386
- Issue date Dec 27, 2022
- Samsung Display Co., Ltd.
- Boyeon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Screen printer having mask pressing device for determining tension...
- Patent number 11,511,535
- Issue date Nov 29, 2022
- FUJI CORPORATION
- Atsushi Torii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting machine
- Patent number 11,503,752
- Issue date Nov 15, 2022
- FUJI CORPORATION
- Hiroaki Ina
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reliability enhancement of press fit connectors
- Patent number 11,456,548
- Issue date Sep 27, 2022
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate inspection device that inspects application quality of ad...
- Patent number 11,452,250
- Issue date Sep 20, 2022
- CKD Corporation
- Ikuo Futamura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Component determination system and component determination method
- Patent number 11,432,450
- Issue date Aug 30, 2022
- FUJI CORPORATION
- Teruyuki Ohashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for repairing conductor tracks
- Patent number 11,419,219
- Issue date Aug 16, 2022
- XTPL S.A.
- Piotr Kowalczewski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Implementing embedded wire repair for PCB constructs
- Patent number 11,412,612
- Issue date Aug 9, 2022
- International Business Machines Corporation
- Samuel Connor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire embedding system with a curved delivery path
- Patent number 11,317,515
- Issue date Apr 26, 2022
- Board of Regents, The University of Texas System
- David Espalin
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Semiconductor structures and methods
- Patent number 11,304,290
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting machine and production line
- Patent number 11,291,149
- Issue date Mar 29, 2022
- FUJI CORPORATION
- Mitsuhiko Shibata
- G01 - MEASURING TESTING
Information Patent Grant
Methods and mechanisms for maintaining an electro-active polymer in...
- Patent number 11,291,121
- Issue date Mar 29, 2022
- ElastiMed Ltd.
- Omer Zelka
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Solder member mounting method and system
- Patent number 11,278,979
- Issue date Mar 22, 2022
- Samsung Electronics Co., Ltd.
- Soo-Hwan Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting system with cross line communication
- Patent number 11,272,649
- Issue date Mar 8, 2022
- Panasonic Corporation of North America
- Lukasz Stefan Jarosz
- G05 - CONTROLLING REGULATING

Patents Applicationslast 30 patents

Information Patent Application
FIELD PROGRAMMABLE SOLDER BALL GRID ARRAY WITH EMBEDDED CONTROL SYS...
- Publication number 20250048561
- Publication date Feb 6, 2025
- Tesla, Inc.
- Vijaykumar KRITHIVASAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND MECHANISMS FOR MAINTAINING AN ELECTRO-ACTIVE POLYMER IN...
- Publication number 20250016932
- Publication date Jan 9, 2025
- ElastiMed Ltd.
- Omer Zelka
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
BOARD INSPECTION DEVICE AND BOARD INSPECTION METHOD
- Publication number 20240414905
- Publication date Dec 12, 2024
- CKD CORPORATION
- Kazuyoshi Kikuchi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20240414849
- Publication date Dec 12, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Myung Ju GI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD FOR A REFLOW PROFILING PROCESS
- Publication number 20240414851
- Publication date Dec 12, 2024
- Western Digital Technologies, Inc.
- Uthayarajan A/L Rasalingam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Soldering an Electronic Component to a Circuit Board by...
- Publication number 20240373563
- Publication date Nov 7, 2024
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier and Method Manufacturing the Same
- Publication number 20240334613
- Publication date Oct 3, 2024
- AT&S (Chongqing) Company Limited
- JyunMin WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR PRODUCING MULTI-LAYER CIRCUIT BOARDS AND USE THEREOF IN...
- Publication number 20240224433
- Publication date Jul 4, 2024
- Ulrich Rotte Anlagenbau und Foerdertechnik GmbH
- Ulrich ROTTE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING MULTI-LAYER CIRCUIT BOARDS
- Publication number 20240224434
- Publication date Jul 4, 2024
- Ulrich Rotte Anlagenbau und Foerdertechnik GmbH
- Ulrich ROTTE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS METHOD FOR LASER REMOVAL OF SUBSTRATE SOLDER MASK
- Publication number 20240196544
- Publication date Jun 13, 2024
- Trillion Harvest Limited
- Pei-Chung PANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR ADDITIVE MANUFACTURING ELECTRONICS AND A PRINTING SUPPOR...
- Publication number 20240107681
- Publication date Mar 28, 2024
- HENSOLDT Sensors GmbH
- Jörg Sander
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
APPARATUS AND METHOD FOR PRINTING CIRCUITS USING PRINT PARAMETERS A...
- Publication number 20230209720
- Publication date Jun 29, 2023
- BOTFACTORY, INC.
- Michael E. KNOX
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20230209719
- Publication date Jun 29, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Myung Ju GI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT FORMING METHOD AND CIRCUIT FORMING DEVICE
- Publication number 20230199970
- Publication date Jun 22, 2023
- FUJI CORPORATION
- Kyosuke YAMAZAKI
- G05 - CONTROLLING REGULATING
Information Patent Application
METHOD FOR DETECTING AND ADJUSTING POOR BACK DRILLS IN PRINTED CIRC...
- Publication number 20230026067
- Publication date Jan 26, 2023
- R&D Circuits
- Michael Caprio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RELIABILITY ENHANCEMENT OF PRESS FIT CONNECTORS
- Publication number 20230015176
- Publication date Jan 19, 2023
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ASSESSING INK DEPOSITION ACCURACY IN AN ELECTRONIC DEVICE...
- Publication number 20220400554
- Publication date Dec 15, 2022
- SOCOVAR SOCIETE EN COMMANDITE
- François BLANCHARD
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus, system and method for determining a match condition for...
- Publication number 20220375053
- Publication date Nov 24, 2022
- Inari Technology Sdn Bhd
- Chin Chooi Chng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for Soldering an Electronic Component to a Circuit Board by...
- Publication number 20220369473
- Publication date Nov 17, 2022
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Grid Clustering-Based System For Locating An Abnormal Area Of Solde...
- Publication number 20220301146
- Publication date Sep 22, 2022
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Li Yu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
USING X-RAY ANALYSIS DURING REFLOW THERMAL CYCLE FOR SOLDER JOINTS
- Publication number 20220111471
- Publication date Apr 14, 2022
- LOON LLC.
- Vineethkumar Nair
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR MANUFACTURING TRANSPARENT ELECTRODE
- Publication number 20220015242
- Publication date Jan 13, 2022
- ITED INC.
- Jee-Hoon SEO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND SYSTEMS FOR BACK-DRILLING A MULTI-LAYER CIRCUIT BOARD
- Publication number 20210315103
- Publication date Oct 7, 2021
- NextGin Technology BV
- J.A.A.M. Tourne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR REPAIRING CONDUCTOR TRACKS
- Publication number 20210227700
- Publication date Jul 22, 2021
- Piotr KOWALCZEWSKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IN-SITU WARPAGE MONITORING DURING SOLDER REFLOW FOR HEAD-IN-PILLOW...
- Publication number 20210212218
- Publication date Jul 8, 2021
- International Business Machines Corporation
- Jennifer I. Bennett
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR COATING A SUBSTRATE
- Publication number 20210195754
- Publication date Jun 24, 2021
- Nordson Corporation
- Michel VAN DE VIJVER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Traceability of Subsequent Layer Structure Manufacturing of Main Bo...
- Publication number 20210084752
- Publication date Mar 18, 2021
- AT&S (China) Co. Ltd.
- Seok Kim Tay
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS FOR TRANSFERRING A CONDUCTIVE PATTERN TO A SUBSTRATE AND...
- Publication number 20200383211
- Publication date Dec 3, 2020
- FONDAZIONE ISTITUTO ITALIANO DI TECNOLOGIA
- Alessandro CHIOLERIO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SCREEN PRINTER
- Publication number 20200369022
- Publication date Nov 26, 2020
- FUJI CORPORATION
- Atsushi TORII
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR FABRICATING STRETCHABLE ELECTRICAL CIRCUIT
- Publication number 20200344877
- Publication date Oct 29, 2020
- Seoul National University R&DB Foundation
- YONGTAEK HONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Monitoring a manufacturing process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for detecting and adjusting poor back drills in printed circ...

Method of manufacturing printed circuit board

Method of assessing ink deposition accuracy in an electronic device...

Method for soldering an electronic component to a circuit board by...

Systems for coating a substrate

Automatically controlling a liquid spray pattern

Traceability of subsequent layer structure manufacturing of main bo...

Circuit board and component fabrication apparatus

Process of fabricating a beaded path on the surface of a substrate,...

Apparatus for transferring a conductive pattern to a substrate and...

Reliability enhancement of press fit connectors

Methods and systems for back-drilling a multi-layer circuit board

Solder member mounting system

Process for in-situ warpage monitoring during solder reflow for hea...

Grid clustering-based system for locating an abnormal area of solde...

System and method for bonding a cable to a substrate using a die bo...

Flexible film, flexible film package and method for manufacturing f...

Screen printer having mask pressing device for determining tension...

Component mounting machine

Reliability enhancement of press fit connectors

Substrate inspection device that inspects application quality of ad...

Component determination system and component determination method

Method for repairing conductor tracks

Implementing embedded wire repair for PCB constructs

Wire embedding system with a curved delivery path

Semiconductor structures and methods

Electronic component mounting machine and production line

Methods and mechanisms for maintaining an electro-active polymer in...

Solder member mounting method and system

Electronic component mounting system with cross line communication

Patents Applicationslast 30 patents

FIELD PROGRAMMABLE SOLDER BALL GRID ARRAY WITH EMBEDDED CONTROL SYS...

METHODS AND MECHANISMS FOR MAINTAINING AN ELECTRO-ACTIVE POLYMER IN...

BOARD INSPECTION DEVICE AND BOARD INSPECTION METHOD

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD FOR A REFLOW PROFILING PROCESS

Method for Soldering an Electronic Component to a Circuit Board by...

Component Carrier and Method Manufacturing the Same

DEVICE FOR PRODUCING MULTI-LAYER CIRCUIT BOARDS AND USE THEREOF IN...

METHOD FOR PRODUCING MULTI-LAYER CIRCUIT BOARDS

PROCESS METHOD FOR LASER REMOVAL OF SUBSTRATE SOLDER MASK

METHOD FOR ADDITIVE MANUFACTURING ELECTRONICS AND A PRINTING SUPPOR...

APPARATUS AND METHOD FOR PRINTING CIRCUITS USING PRINT PARAMETERS A...

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

CIRCUIT FORMING METHOD AND CIRCUIT FORMING DEVICE

METHOD FOR DETECTING AND ADJUSTING POOR BACK DRILLS IN PRINTED CIRC...

RELIABILITY ENHANCEMENT OF PRESS FIT CONNECTORS

METHOD OF ASSESSING INK DEPOSITION ACCURACY IN AN ELECTRONIC DEVICE...

Apparatus, system and method for determining a match condition for...

Method for Soldering an Electronic Component to a Circuit Board by...

Grid Clustering-Based System For Locating An Abnormal Area Of Solde...

USING X-RAY ANALYSIS DURING REFLOW THERMAL CYCLE FOR SOLDER JOINTS

APPARATUS AND METHOD FOR MANUFACTURING TRANSPARENT ELECTRODE

METHODS AND SYSTEMS FOR BACK-DRILLING A MULTI-LAYER CIRCUIT BOARD

METHOD FOR REPAIRING CONDUCTOR TRACKS

IN-SITU WARPAGE MONITORING DURING SOLDER REFLOW FOR HEAD-IN-PILLOW...

SYSTEMS AND METHODS FOR COATING A SUBSTRATE

Traceability of Subsequent Layer Structure Manufacturing of Main Bo...

APPARATUS FOR TRANSFERRING A CONDUCTIVE PATTERN TO A SUBSTRATE AND...

SCREEN PRINTER

APPARATUS FOR FABRICATING STRETCHABLE ELECTRICAL CIRCUIT