Monitoring of warpage, curvature, damage, defects or the like

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CPC
H01L21/67288

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67288Monitoring of warpage, curvature, damage, defects or the like

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Reflective waveplates for pupil polarization filtering
- Patent number 12,322,620
- Issue date Jun 3, 2025
- KLA Corporation
- Chong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Displacement measurements in semiconductor wafer processing
- Patent number 12,322,662
- Issue date Jun 3, 2025
- Applied Materials, Inc.
- Justin Wong
- B24 - GRINDING POLISHING
Information Patent Grant
Inspection system, lithographic apparatus, and inspection method
- Patent number 12,313,980
- Issue date May 27, 2025
- ASML Netherlands B.V.
- Alexey Olegovich Polyakov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for defects detection and classification using...
- Patent number 12,307,668
- Issue date May 20, 2025
- Bruker Nano, Inc.
- David Lewis Adler
- G01 - MEASURING TESTING
Information Patent Grant
Substrate processing system
- Patent number 12,300,524
- Issue date May 13, 2025
- Tokyo Electron Limited
- Yoshifumi Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for analyzing defects in CVD films
- Patent number 12,300,554
- Issue date May 13, 2025
- Applied Materials, Inc.
- Mandar B. Pandit
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Single wafer-type wafer cleaning device and method for controlling...
- Patent number 12,288,699
- Issue date Apr 29, 2025
- SK SILTRON CO., LTD.
- Gun Ho Lee
- B08 - CLEANING
Information Patent Grant
Stage system, lithographic apparatus, method for positioning and de...
- Patent number 12,287,586
- Issue date Apr 29, 2025
- ASML Netherlands B.V.
- Stef Marten Johan Janssens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FIB-SEM 3D tomography for measuring shape deviations of HAR structures
- Patent number 12,288,705
- Issue date Apr 29, 2025
- Carl Zeiss SMT GmbH
- Amir Avishai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Parameterizing x-ray scattering measurement using slice-and-image t...
- Patent number 12,288,706
- Issue date Apr 29, 2025
- Carl Zeiss SMT GmbH
- Hans Michael Stiepan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Contact area size determination between 3D structures in an integra...
- Patent number 12,283,504
- Issue date Apr 22, 2025
- Carl Zeiss SMT GmbH
- Alex Buxbaum
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Backside deposition tuning of stress to control wafer bow in semico...
- Patent number 12,276,922
- Issue date Apr 15, 2025
- Tokyo Electron Limited
- Daniel Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a cleaved semiconductor wafer
- Patent number 12,270,768
- Issue date Apr 8, 2025
- GlobalWafers Co., Ltd.
- Benjamin Michael Meyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrate handling device for a wafer
- Patent number 12,261,075
- Issue date Mar 25, 2025
- SEMSYSCO GMBH
- Andreas Gleissner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Splash resistant laser wafer singulation by crack length control
- Patent number 12,255,097
- Issue date Mar 18, 2025
- Texas Instruments Incorporated
- Yang Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Detecting damaged semiconductor wafers utilizing a semiconductor wa...
- Patent number 12,249,526
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid transfer system in a charged particle system
- Patent number 12,249,480
- Issue date Mar 11, 2025
- ASML Netherlands B.V.
- Marcus Adrianus Van De Kerkhof
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
System for dynamically provisioning cyber training environments
- Patent number 12,237,199
- Issue date Feb 25, 2025
- Circadence Corporation
- Laura Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer storage devices configured to measure physical properties of...
- Patent number 12,237,189
- Issue date Feb 25, 2025
- Micron Technology, Inc.
- Nagasubramaniyan Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device and method of forming and monitoring quality of the same
- Patent number 12,237,417
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Yin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, method, and user interface for edge ring wear compensation
- Patent number 12,237,203
- Issue date Feb 25, 2025
- Lam Research Corporation
- Tom A. Kamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inline wafer defect detection system and method
- Patent number 12,230,522
- Issue date Feb 18, 2025
- Texas Instruments Incorporated
- Patrick David Noll
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bowed substrate clamping method, apparatus, and system
- Patent number 12,224,192
- Issue date Feb 11, 2025
- Applied Materials, Inc.
- Arvinder S. Chadha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for thermally conditioning a wafer in a charged...
- Patent number 12,217,930
- Issue date Feb 4, 2025
- ASML Netherlands B.V.
- Martijn Petrus Christianus Van Heumen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems of optical inspection of electronic device manu...
- Patent number 12,215,966
- Issue date Feb 4, 2025
- Applied Materials, Inc.
- Mohsin Waqar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adaptive baking method
- Patent number 12,196,491
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzung-Chen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for determining post bonding overlay
- Patent number 12,197,137
- Issue date Jan 14, 2025
- KLA Corporation
- Franz Zach
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor manufacturing apparatus, failure prediction method fo...
- Patent number 12,191,178
- Issue date Jan 7, 2025
- Ebara Corporation
- Jumpei Fujikata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nozzle having real time inspection functions
- Patent number 12,191,175
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kai-Lin Chuang
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Integrated substrate measurement system to improve manufacturing pr...
- Patent number 12,191,176
- Issue date Jan 7, 2025
- Applied Materials, Inc.
- Upendra V. Ummethala
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SENSOR SUBSTRATE AND INTEGRATED SENSING SURFACES
- Publication number 20250183074
- Publication date Jun 5, 2025
- Applied Materials, Inc.
- Chuang-Chia Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE MONITORING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250183075
- Publication date Jun 5, 2025
- TES CO., LTD.
- Hong-Jun SHON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTING DAMAGED SEMICONDUCTOR WAFERS UTILIZING A SEMICONDUCTOR WA...
- Publication number 20250183073
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen Min LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
In-Situ In-Band and Out-of-Band Spectral Measurement for EUV Tools
- Publication number 20250164895
- Publication date May 22, 2025
- KLA Corporation
- Rajeev Rajendran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR DETERMINING WAFER BOW
- Publication number 20250167023
- Publication date May 22, 2025
- TOKYO ELECTRON LIMITED
- Daniel FULFORD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SUPPORT FOR MEASURING WAFER GEOMETRY
- Publication number 20250167024
- Publication date May 22, 2025
- TOKYO ELECTRON LIMITED
- Daniel FULFORD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR REDUCING WAFER BACKSIDE DAMAGE
- Publication number 20250167025
- Publication date May 22, 2025
- LAM RESEARCH CORPORATION
- Sairam Sundaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FinFET Device and Method of Forming and Monitoring Quality of the Same
- Publication number 20250169101
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Yin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND SU...
- Publication number 20250157836
- Publication date May 15, 2025
- SCREEN Holdings Co., Ltd.
- Shinji SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS OF OPTICAL INSPECTION OF ELECTRONIC DEVICE MANU...
- Publication number 20250155234
- Publication date May 15, 2025
- Applied Materials, Inc.
- Mohsin Waqar
- G01 - MEASURING TESTING
Information Patent Application
ELECTROPLATING CHAMBER LEAKAGE PLATING WARNING METHOD AND SYSTEM
- Publication number 20250157019
- Publication date May 15, 2025
- ACM RESEARCH (SHANGHAI), INC.
- Meng Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20250149355
- Publication date May 8, 2025
- TOKYO ELECTRON LIMITED
- Susumu HAYAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bowed Substrate Clamping Method, Apparatus, and System
- Publication number 20250149361
- Publication date May 8, 2025
- Applied Materials, Inc.
- Arvinder S. CHADHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR PURIFYING SUBSTRATE CONTAINERS
- Publication number 20250149363
- Publication date May 8, 2025
- Entegris, Inc.
- Matthew A. Fuller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATING APPARATUS
- Publication number 20250149358
- Publication date May 8, 2025
- SCREEN Holdings Co., Ltd.
- Hiroaki ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Machine Learning-based Tool to Characterize Individual Oxide Defects
- Publication number 20250147094
- Publication date May 8, 2025
- IMEC vzw
- Anirudh Varanasi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Torsional Optical Manipulation to Remove Part...
- Publication number 20250149326
- Publication date May 8, 2025
- Chun-Jung Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER PROCESSING SYSTEMS, WAFER TRANSPORT DEVICES, AND RELATED METHODS
- Publication number 20250149362
- Publication date May 8, 2025
- Micron Technology, Inc.
- Nagasubramaniyan Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SYSTEM AND METHOD FOR MANUFACTURING AND OPERATING THE...
- Publication number 20250140617
- Publication date May 1, 2025
- INNOSCIENCE (SUZHOU) SEMICONDUCTOR CO., LTD.
- Shan YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BOW METROLOGY SYSTEM
- Publication number 20250132180
- Publication date Apr 24, 2025
- TOKYO ELECTRON LIMITED
- Hoyoung KANG
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND DEVICE FOR COMPENSATING FOR DISTORTIONS
- Publication number 20250125152
- Publication date Apr 17, 2025
- EV GROUP E. THALLNER GMBH
- Thomas Uhrmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFORMATION PROCESSING APPARATUS, INFERENCE APPARATUS, MACHINE-LEAR...
- Publication number 20250125172
- Publication date Apr 17, 2025
- EBARA CORPORATION
- Mitsuru MIYAZAKI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DISPLAY DEVICE, RECORDING MEDIUM, AND DISPLAY METHOD
- Publication number 20250124621
- Publication date Apr 17, 2025
- TOKYO ELECTRON LIMITED
- Masahide Tadokoro
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS AND METHODS FOR MAINTAINING VACUUM CHECKING FORCE ON SEMI...
- Publication number 20250118590
- Publication date Apr 10, 2025
- Axcelis Technologies, Inc.
- Michael F. Leahy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVAL OF DEFECTIVE DIES ON DONOR WAFERS FOR SELECTIVE LAYER TRANSFER
- Publication number 20250112067
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas L. Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY INDUCED MICRO LED INSPECTION
- Publication number 20250105065
- Publication date Mar 27, 2025
- ORBOTECH LTD.
- Arie Glazer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM AND METHOD FOR MITIGATING OVERLAY DISTORTION PATTERNS CAUSED...
- Publication number 20250103019
- Publication date Mar 27, 2025
- KLA Corporation
- Franz Zach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRANSPORTING DEVICE AND SUBSTRATE PROCESSING DEVICE EQUIP...
- Publication number 20250105041
- Publication date Mar 27, 2025
- SCREEN Holdings Co., Ltd.
- Hiroyuki KAWAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOZZLE HAVING REAL TIME INSPECTION FUNCTIONS
- Publication number 20250096022
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- KAI-LIN CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHUCK FOR ACQUIRING A WARPED WORKPIECE
- Publication number 20250096021
- Publication date Mar 20, 2025
- Core Flow Ltd.
- Boaz NISHRI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Monitoring of warpage, curvature, damage, defects or the like

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Reflective waveplates for pupil polarization filtering

Displacement measurements in semiconductor wafer processing

Inspection system, lithographic apparatus, and inspection method

Methods and systems for defects detection and classification using...

Substrate processing system

Systems and methods for analyzing defects in CVD films

Single wafer-type wafer cleaning device and method for controlling...

Stage system, lithographic apparatus, method for positioning and de...

FIB-SEM 3D tomography for measuring shape deviations of HAR structures

Parameterizing x-ray scattering measurement using slice-and-image t...

Contact area size determination between 3D structures in an integra...

Backside deposition tuning of stress to control wafer bow in semico...

Method of processing a cleaved semiconductor wafer

Substrate handling device for a wafer

Splash resistant laser wafer singulation by crack length control

Detecting damaged semiconductor wafers utilizing a semiconductor wa...

Fluid transfer system in a charged particle system

System for dynamically provisioning cyber training environments

Wafer storage devices configured to measure physical properties of...

FinFET device and method of forming and monitoring quality of the same

System, method, and user interface for edge ring wear compensation

Inline wafer defect detection system and method

Bowed substrate clamping method, apparatus, and system

Systems and methods for thermally conditioning a wafer in a charged...

Methods and systems of optical inspection of electronic device manu...

Adaptive baking method

System and method for determining post bonding overlay

Semiconductor manufacturing apparatus, failure prediction method fo...

Nozzle having real time inspection functions

Integrated substrate measurement system to improve manufacturing pr...

Patents Applicationslast 30 patents

SENSOR SUBSTRATE AND INTEGRATED SENSING SURFACES

SUBSTRATE MONITORING METHOD AND SUBSTRATE PROCESSING APPARATUS

DETECTING DAMAGED SEMICONDUCTOR WAFERS UTILIZING A SEMICONDUCTOR WA...

In-Situ In-Band and Out-of-Band Spectral Measurement for EUV Tools

DEVICE AND METHOD FOR DETERMINING WAFER BOW

WAFER SUPPORT FOR MEASURING WAFER GEOMETRY

APPARATUS AND METHODS FOR REDUCING WAFER BACKSIDE DAMAGE

FinFET Device and Method of Forming and Monitoring Quality of the Same

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND SU...

METHODS AND SYSTEMS OF OPTICAL INSPECTION OF ELECTRONIC DEVICE MANU...

ELECTROPLATING CHAMBER LEAKAGE PLATING WARNING METHOD AND SYSTEM

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Bowed Substrate Clamping Method, Apparatus, and System

METHODS AND APPARATUS FOR PURIFYING SUBSTRATE CONTAINERS

SUBSTRATE TREATING APPARATUS

Machine Learning-based Tool to Characterize Individual Oxide Defects

Method and System for Torsional Optical Manipulation to Remove Part...

WAFER PROCESSING SYSTEMS, WAFER TRANSPORT DEVICES, AND RELATED METHODS

SEMICONDUCTOR SYSTEM AND METHOD FOR MANUFACTURING AND OPERATING THE...

WAFER BOW METROLOGY SYSTEM

METHOD AND DEVICE FOR COMPENSATING FOR DISTORTIONS

INFORMATION PROCESSING APPARATUS, INFERENCE APPARATUS, MACHINE-LEAR...

DISPLAY DEVICE, RECORDING MEDIUM, AND DISPLAY METHOD

APPARATUS AND METHODS FOR MAINTAINING VACUUM CHECKING FORCE ON SEMI...

REMOVAL OF DEFECTIVE DIES ON DONOR WAFERS FOR SELECTIVE LAYER TRANSFER

RADIO FREQUENCY INDUCED MICRO LED INSPECTION

SYSTEM AND METHOD FOR MITIGATING OVERLAY DISTORTION PATTERNS CAUSED...

SUBSTRATE TRANSPORTING DEVICE AND SUBSTRATE PROCESSING DEVICE EQUIP...

NOZZLE HAVING REAL TIME INSPECTION FUNCTIONS

CHUCK FOR ACQUIRING A WARPED WORKPIECE