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Monitoring of warpage, curvature, damage, defects or the like
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ELECTRICITY
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Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/67288
Monitoring of warpage, curvature, damage, defects or the like
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Patents Grants
last 30 patents
Information
Patent Grant
Method and system for bonding
Patent number
12,165,888
Issue date
Dec 10, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Chieh Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System and method for mitigating overlay distortion patterns caused...
Patent number
12,164,277
Issue date
Dec 10, 2024
KLA Corporation
Franz Zach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer cleaning apparatus and method
Patent number
12,165,887
Issue date
Dec 10, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Jieh-Chau Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Identification of and compensation for a failure in a heater array
Patent number
12,165,891
Issue date
Dec 10, 2024
Lam Research Corporation
Changyou Jing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Control device, system and control method
Patent number
12,165,892
Issue date
Dec 10, 2024
Tokyo Electron Limited
Yuichi Takenaga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Aligner apparatus
Patent number
12,148,646
Issue date
Nov 19, 2024
Kawasaki Jukogyo Kabushiki Kaisha
Haruhiko Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Generating edge adjusted drop patterns
Patent number
12,136,558
Issue date
Nov 5, 2024
Canon Kabushiki Kaisha
Mehul N. Patel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated substrate measurement system to improve manufacturing pr...
Patent number
12,136,557
Issue date
Nov 5, 2024
Applied Materials, Inc.
Upendra V. Ummethala
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer inspection method
Patent number
12,131,929
Issue date
Oct 29, 2024
Semes Co., Ltd.
Myoung Hoon Woo
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Device and method for bonding of substrates
Patent number
12,131,907
Issue date
Oct 29, 2024
EV Group E. Thallner GmbH
Thomas Wagenleitner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Inspection system
Patent number
12,131,930
Issue date
Oct 29, 2024
Applied Materials, Inc.
Asaf Schlezinger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for processing semiconductor wafers
Patent number
12,131,924
Issue date
Oct 29, 2024
Yangtze Memory Technologies Co., Ltd.
Liquan Cai
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
SiC substrate and sic epitaxial wafer
Patent number
12,132,085
Issue date
Oct 29, 2024
Resonac Corporation
Hiromasa Suo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Adhesion device, micro device optical inspection and repairing equi...
Patent number
12,131,961
Issue date
Oct 29, 2024
PlayNitride Display Co., Ltd.
Cheng-Cian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated semiconductor die vessel processing workstations
Patent number
12,125,725
Issue date
Oct 22, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Tsung-Sheng Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Defect inspection apparatus and defect inspection program
Patent number
12,112,963
Issue date
Oct 8, 2024
HITACHI HIGH-TECH CORPORATION
Takashi Hiroi
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor inspection device and method of inspecting a semicond...
Patent number
12,106,986
Issue date
Oct 1, 2024
Fuji Electric Co., Ltd.
Noriaki Noji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of reducing residual contamination in singulated semiconduct...
Patent number
12,100,622
Issue date
Sep 24, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Gordon M. Grivna
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and system for recognizing and addressing plasma discharge d...
Patent number
12,100,604
Issue date
Sep 24, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Chih-Yu Wang
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Apparatus for stacking substrates and method for the same
Patent number
12,100,667
Issue date
Sep 24, 2024
Nikon Corporation
Isao Sugaya
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Inspection system
Patent number
12,087,603
Issue date
Sep 10, 2024
Brooks Automation (Germany) GmbH
Lutz Rebstock
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Defect inspection system and semiconductor fabrication apparatus in...
Patent number
12,073,556
Issue date
Aug 27, 2024
SK Hynix Inc.
Jeong Ok Park
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Manufacturing method for glass substrate and glass substrate
Patent number
12,068,181
Issue date
Aug 20, 2024
AGC Inc.
Yuha Kobayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System configurations for fabrication of micro-LED displays
Patent number
12,062,735
Issue date
Aug 13, 2024
Applied Materials, Inc.
Hou T. Ng
B08 - CLEANING
Information
Patent Grant
Estimating heights of defects in a wafer by scaling a 3D model usin...
Patent number
12,057,336
Issue date
Aug 6, 2024
Samsung Electronics Co., Ltd.
Shashank Shrikant Agashe
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Heat treatment method and heat treatment apparatus of light irradia...
Patent number
12,057,352
Issue date
Aug 6, 2024
SCREEN Holdings Co., Ltd.
Takahiro Kitazawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate processing apparatus and substrate processing method
Patent number
12,057,327
Issue date
Aug 6, 2024
Tokyo Electron Limited
Masataka Gosho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip transferring method and the apparatus thereof
Patent number
12,057,337
Issue date
Aug 6, 2024
Epistar Corporation
Min-Hsun Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate processing apparatus, estimation method of substrate proc...
Patent number
12,051,587
Issue date
Jul 30, 2024
Tokyo Electron Limited
Hiroshi Nakamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for adjusting wafer deformation and semiconductor structure
Patent number
12,051,608
Issue date
Jul 30, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Shuai Guo
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
INSPECTION SYSTEM
Publication number
20240429078
Publication date
Dec 26, 2024
Applied Materials, Inc.
Asaf SCHLEZINGER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SLIDING OUTER TOOL ENCLOSURE
Publication number
20240412993
Publication date
Dec 12, 2024
KLA Corporation
Gurupkar Singh Nerwal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME
Publication number
20240413093
Publication date
Dec 12, 2024
Nikon Corporation
Isao Sugaya
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
REDISTRIBUTION LAYER METALLIC LAYOUT STRUCTURE AND METHOD WITH WARP...
Publication number
20240404853
Publication date
Dec 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Dian-Hau CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADAPTIVE BAKING METHOD
Publication number
20240393051
Publication date
Nov 28, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tzung-Chen WU
F27 - FURNACES KILNS OVENS RETORTS
Information
Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Publication number
20240395570
Publication date
Nov 28, 2024
TOKYO ELECTRON LIMITED
Yoshitomo SATO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS AND METHOD FOR SUBSTRATE HANDLING
Publication number
20240379404
Publication date
Nov 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Jen-Chun Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED SEMICONDUCTOR DIE VESSEL PROCESSING WORKSTATIONS
Publication number
20240379393
Publication date
Nov 14, 2024
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Tsung-Sheng KUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Publication number
20240371661
Publication date
Nov 7, 2024
TOKYO ELECTRON LIMITED
Masataka GOSHO
B08 - CLEANING
Information
Patent Application
Integrated Inspection for Enhanced Hybrid Bonding Yield in Advanced...
Publication number
20240363446
Publication date
Oct 31, 2024
Venkatakaushik VOLETI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE PROCESSING APPARATUS, ESTIMATION METHOD OF SUBSTRATE PROC...
Publication number
20240355617
Publication date
Oct 24, 2024
TOKYO ELECTRON LIMITED
Hiroshi Nakamura
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Application
WAFER CARRIER HAVING INSPECTION WINDOW AND OPERATING METHOD THEREOF
Publication number
20240347359
Publication date
Oct 17, 2024
Taiwan Semiconductor Manufacturing company Ltd.
CHI JIA WANG
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SYSTEMS AND METHODS FOR INSPECTION STATIONS
Publication number
20240339344
Publication date
Oct 10, 2024
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Yan-Hong LIU
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
WAFER EDGE TRIMMING PROCESS AND METHODS THEREOF
Publication number
20240339326
Publication date
Oct 10, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Fang-I Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF AND APPARATUS FOR PROCESSING WORKPIECE
Publication number
20240339363
Publication date
Oct 10, 2024
Disco Corporation
Kazuma Sekiya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP TRANSFERRING METHOD AND THE APPARATUS THEREOF
Publication number
20240339345
Publication date
Oct 10, 2024
EPISTAR CORPORATION
Min-Hsun HSIEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPENSATION METHOD FOR WAFER BONDING
Publication number
20240332246
Publication date
Oct 3, 2024
Macronix International Co., Ltd.
Tien Chu YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR SYSTEMATIC PHYSICAL FAILURE ANALYSIS (PFA)...
Publication number
20240321613
Publication date
Sep 26, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Peng-Ren Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE SUPPORTER
Publication number
20240321619
Publication date
Sep 26, 2024
Samsung Electronics Co., Ltd.
Yunjae Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE CHECKING METHOD, METHOD O...
Publication number
20240321612
Publication date
Sep 26, 2024
Kokusai Electric Corporation
Takuya SAITO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEFECT DETECTION METHOD, APPARATUS AND DEVICE, AND COMPUTER-READABL...
Publication number
20240319099
Publication date
Sep 26, 2024
JI HUA LABORATORY
Zhaoming HE
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
WAFER INSPECTION APPARATUS AND METHOD
Publication number
20240319109
Publication date
Sep 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chung-Pin Chou
G01 - MEASURING TESTING
Information
Patent Application
DEFECT REDUCTION APPARATUS AND DEFECT REDUCTION METHOD
Publication number
20240320814
Publication date
Sep 26, 2024
Samsung Electronics Co., Ltd.
Bongju LEE
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SUBSTRATE PROCESSING APPARATUS AND INFORMATION PROCESSING SYSTEM
Publication number
20240308018
Publication date
Sep 19, 2024
EBARA CORPORATION
Yuta SUZUKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF OPERATING A PROCESSING APPARATUS
Publication number
20240312814
Publication date
Sep 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Min-Cheng WU
G01 - MEASURING TESTING
Information
Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
Publication number
20240312820
Publication date
Sep 19, 2024
KIOXIA Corporation
Yoshio MIZUTA
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Publication number
20240304439
Publication date
Sep 12, 2024
TOKYO ELECTRON LIMITED
Koji AKIYAMA
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Contamination Control In Semiconductor Manufacturing Systems
Publication number
20240304481
Publication date
Sep 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Bo Chen CHEN
B08 - CLEANING
Information
Patent Application
METHOD AND DEVICE FOR PROCESSING PRODUCT MANUFACTURING MESSAGES, EL...
Publication number
20240304034
Publication date
Sep 12, 2024
BOE TECHNOLOGY GROUP CO., LTD.
Meijuan ZHANG
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
OSCILLATING SECONDARY STAGE FOR FRAME-MODE OVERLAY METROLOGY
Publication number
20240290643
Publication date
Aug 29, 2024
KLA Corporation
Izhar Agam
H01 - BASIC ELECTRIC ELEMENTS