Monitoring of warpage, curvature, damage, defects or the like

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CPC
H01L21/67288

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67288Monitoring of warpage, curvature, damage, defects or the like

Industries

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Patents Grantslast 30 patents

Information Patent Grant
System for dynamically provisioning cyber training environments
- Patent number 12,237,199
- Issue date Feb 25, 2025
- Circadence Corporation
- Laura Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer storage devices configured to measure physical properties of...
- Patent number 12,237,189
- Issue date Feb 25, 2025
- Micron Technology, Inc.
- Nagasubramaniyan Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device and method of forming and monitoring quality of the same
- Patent number 12,237,417
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Yin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, method, and user interface for edge ring wear compensation
- Patent number 12,237,203
- Issue date Feb 25, 2025
- Lam Research Corporation
- Tom A. Kamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inline wafer defect detection system and method
- Patent number 12,230,522
- Issue date Feb 18, 2025
- Texas Instruments Incorporated
- Patrick David Noll
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bowed substrate clamping method, apparatus, and system
- Patent number 12,224,192
- Issue date Feb 11, 2025
- Applied Materials, Inc.
- Arvinder S. Chadha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for thermally conditioning a wafer in a charged...
- Patent number 12,217,930
- Issue date Feb 4, 2025
- ASML Netherlands B.V.
- Martijn Petrus Christianus Van Heumen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems of optical inspection of electronic device manu...
- Patent number 12,215,966
- Issue date Feb 4, 2025
- Applied Materials, Inc.
- Mohsin Waqar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adaptive baking method
- Patent number 12,196,491
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzung-Chen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for determining post bonding overlay
- Patent number 12,197,137
- Issue date Jan 14, 2025
- KLA Corporation
- Franz Zach
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor manufacturing apparatus, failure prediction method fo...
- Patent number 12,191,178
- Issue date Jan 7, 2025
- Ebara Corporation
- Jumpei Fujikata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nozzle having real time inspection functions
- Patent number 12,191,175
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kai-Lin Chuang
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Integrated substrate measurement system to improve manufacturing pr...
- Patent number 12,191,176
- Issue date Jan 7, 2025
- Applied Materials, Inc.
- Upendra V. Ummethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for bonding
- Patent number 12,165,888
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for mitigating overlay distortion patterns caused...
- Patent number 12,164,277
- Issue date Dec 10, 2024
- KLA Corporation
- Franz Zach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer cleaning apparatus and method
- Patent number 12,165,887
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jieh-Chau Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Identification of and compensation for a failure in a heater array
- Patent number 12,165,891
- Issue date Dec 10, 2024
- Lam Research Corporation
- Changyou Jing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control device, system and control method
- Patent number 12,165,892
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Yuichi Takenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aligner apparatus
- Patent number 12,148,646
- Issue date Nov 19, 2024
- Kawasaki Jukogyo Kabushiki Kaisha
- Haruhiko Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Generating edge adjusted drop patterns
- Patent number 12,136,558
- Issue date Nov 5, 2024
- Canon Kabushiki Kaisha
- Mehul N. Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated substrate measurement system to improve manufacturing pr...
- Patent number 12,136,557
- Issue date Nov 5, 2024
- Applied Materials, Inc.
- Upendra V. Ummethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer inspection method
- Patent number 12,131,929
- Issue date Oct 29, 2024
- Semes Co., Ltd.
- Myoung Hoon Woo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device and method for bonding of substrates
- Patent number 12,131,907
- Issue date Oct 29, 2024
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection system
- Patent number 12,131,930
- Issue date Oct 29, 2024
- Applied Materials, Inc.
- Asaf Schlezinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing semiconductor wafers
- Patent number 12,131,924
- Issue date Oct 29, 2024
- Yangtze Memory Technologies Co., Ltd.
- Liquan Cai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SiC substrate and sic epitaxial wafer
- Patent number 12,132,085
- Issue date Oct 29, 2024
- Resonac Corporation
- Hiromasa Suo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion device, micro device optical inspection and repairing equi...
- Patent number 12,131,961
- Issue date Oct 29, 2024
- PlayNitride Display Co., Ltd.
- Cheng-Cian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated semiconductor die vessel processing workstations
- Patent number 12,125,725
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Sheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Defect inspection apparatus and defect inspection program
- Patent number 12,112,963
- Issue date Oct 8, 2024
- HITACHI HIGH-TECH CORPORATION
- Takashi Hiroi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor inspection device and method of inspecting a semicond...
- Patent number 12,106,986
- Issue date Oct 1, 2024
- Fuji Electric Co., Ltd.
- Noriaki Noji
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method and System for Analyzing Wafer Angle in Semiconductor Integr...
- Publication number 20250069955
- Publication date Feb 27, 2025
- SHANGHAI HUALI MICROELECTRONICS CORPORATION
- Ying Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Large Format Continuous Imaging System
- Publication number 20250062145
- Publication date Feb 20, 2025
- Applied Materials, Inc.
- Venkatakaushik VOLETI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method and Stiffeners for Package Level Warpage Modulation
- Publication number 20250062168
- Publication date Feb 20, 2025
- Intel Corporation
- Justin WHETTEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER CLEANING APPARATUS AND METHOD
- Publication number 20250062140
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jieh-Chau HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT DEVICE WITH DIAGNOSTIC CAPABILITIES
- Publication number 20250062143
- Publication date Feb 20, 2025
- Applied Materials, Inc.
- Deepak Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IDENTIFICATION OF AND COMPENSATION FOR A FAILURE IN A HEATER ARRAY
- Publication number 20250054788
- Publication date Feb 13, 2025
- LAM RESEARCH CORPORATION
- Changyou Jing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD FOR IMP...
- Publication number 20250054803
- Publication date Feb 13, 2025
- PSK Holdings Inc.
- Gunwoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE MAP GENERATING METHOD
- Publication number 20250046646
- Publication date Feb 6, 2025
- TOKYO ELECTRON LIMITED
- Junnosuke TAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATIC CORRECTION DEVICE OF ROBOTIC ARM AND METHOD THEREOF
- Publication number 20250046637
- Publication date Feb 6, 2025
- JUN-FU TECHNOLOGY INC
- Cheng-Hsiang LU
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
SUBSTRATE TEST METHOD
- Publication number 20250035564
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Sung-Il Choi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STATUS DETERMINATION METHOD AND MONITORING DEVICE
- Publication number 20250038022
- Publication date Jan 30, 2025
- TOKYO ELECTRON LIMITED
- Huizhen BU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED METROLOGY FOR PROCESS CONTROLS IN WAFER BONDING SYSTEM
- Publication number 20250029847
- Publication date Jan 23, 2025
- TOKYO ELECTRON LIMITED
- Nathan IP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR MONITORING PERFORMANCE OF ELECTROSTATIC CHUCKS IN SUBSTR...
- Publication number 20250022740
- Publication date Jan 16, 2025
- LAM RESEARCH CORPORATION
- Liwei AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE CARD CARRIER
- Publication number 20250019141
- Publication date Jan 16, 2025
- BRIDGE CO., LTD.
- Dong Wook LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SiC SUBSTRATE AND SiC EPITAXIAL WAFER
- Publication number 20250015139
- Publication date Jan 9, 2025
- Resonac Corporation
- Hiromasa SUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO IMPROVE INSPECTION TECHNIQUES FOR INTEGRAT...
- Publication number 20250014927
- Publication date Jan 9, 2025
- Intel Corporation
- Chrystian Mauricio Posada Arbelaez
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INSPECTION SYSTEM
- Publication number 20250006527
- Publication date Jan 2, 2025
- BROOKS AUTOMATION (GERMANY) GMBH
- Lutz REBSTOCK
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INSPECTION SYSTEM
- Publication number 20240429078
- Publication date Dec 26, 2024
- Applied Materials, Inc.
- Asaf SCHLEZINGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLIDING OUTER TOOL ENCLOSURE
- Publication number 20240412993
- Publication date Dec 12, 2024
- KLA Corporation
- Gurupkar Singh Nerwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME
- Publication number 20240413093
- Publication date Dec 12, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDISTRIBUTION LAYER METALLIC LAYOUT STRUCTURE AND METHOD WITH WARP...
- Publication number 20240404853
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dian-Hau CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADAPTIVE BAKING METHOD
- Publication number 20240393051
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzung-Chen WU
- F27 - FURNACES KILNS OVENS RETORTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20240395570
- Publication date Nov 28, 2024
- TOKYO ELECTRON LIMITED
- Yoshitomo SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR SUBSTRATE HANDLING
- Publication number 20240379404
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Chun Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SEMICONDUCTOR DIE VESSEL PROCESSING WORKSTATIONS
- Publication number 20240379393
- Publication date Nov 14, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Tsung-Sheng KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20240371661
- Publication date Nov 7, 2024
- TOKYO ELECTRON LIMITED
- Masataka GOSHO
- B08 - CLEANING
Information Patent Application
Integrated Inspection for Enhanced Hybrid Bonding Yield in Advanced...
- Publication number 20240363446
- Publication date Oct 31, 2024
- Venkatakaushik VOLETI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, ESTIMATION METHOD OF SUBSTRATE PROC...
- Publication number 20240355617
- Publication date Oct 24, 2024
- TOKYO ELECTRON LIMITED
- Hiroshi Nakamura
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
WAFER CARRIER HAVING INSPECTION WINDOW AND OPERATING METHOD THEREOF
- Publication number 20240347359
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHI JIA WANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS AND METHODS FOR INSPECTION STATIONS
- Publication number 20240339344
- Publication date Oct 10, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Yan-Hong LIU
- G06 - COMPUTING CALCULATING COUNTING

Monitoring of warpage, curvature, damage, defects or the like

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

System for dynamically provisioning cyber training environments

Wafer storage devices configured to measure physical properties of...

FinFET device and method of forming and monitoring quality of the same

System, method, and user interface for edge ring wear compensation

Inline wafer defect detection system and method

Bowed substrate clamping method, apparatus, and system

Systems and methods for thermally conditioning a wafer in a charged...

Methods and systems of optical inspection of electronic device manu...

Adaptive baking method

System and method for determining post bonding overlay

Semiconductor manufacturing apparatus, failure prediction method fo...

Nozzle having real time inspection functions

Integrated substrate measurement system to improve manufacturing pr...

Method and system for bonding

System and method for mitigating overlay distortion patterns caused...

Wafer cleaning apparatus and method

Identification of and compensation for a failure in a heater array

Control device, system and control method

Aligner apparatus

Generating edge adjusted drop patterns

Integrated substrate measurement system to improve manufacturing pr...

Wafer inspection method

Device and method for bonding of substrates

Inspection system

Method for processing semiconductor wafers

SiC substrate and sic epitaxial wafer

Adhesion device, micro device optical inspection and repairing equi...

Integrated semiconductor die vessel processing workstations

Defect inspection apparatus and defect inspection program

Semiconductor inspection device and method of inspecting a semicond...

Patents Applicationslast 30 patents

Method and System for Analyzing Wafer Angle in Semiconductor Integr...

Large Format Continuous Imaging System

Method and Stiffeners for Package Level Warpage Modulation

WAFER CLEANING APPARATUS AND METHOD

SUBSTRATE SUPPORT DEVICE WITH DIAGNOSTIC CAPABILITIES

IDENTIFICATION OF AND COMPENSATION FOR A FAILURE IN A HEATER ARRAY

SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD FOR IMP...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE MAP GENERATING METHOD

AUTOMATIC CORRECTION DEVICE OF ROBOTIC ARM AND METHOD THEREOF

SUBSTRATE TEST METHOD

STATUS DETERMINATION METHOD AND MONITORING DEVICE

INTEGRATED METROLOGY FOR PROCESS CONTROLS IN WAFER BONDING SYSTEM

SYSTEM FOR MONITORING PERFORMANCE OF ELECTROSTATIC CHUCKS IN SUBSTR...

PROBE CARD CARRIER

SiC SUBSTRATE AND SiC EPITAXIAL WAFER

METHODS AND APPARATUS TO IMPROVE INSPECTION TECHNIQUES FOR INTEGRAT...

INSPECTION SYSTEM

INSPECTION SYSTEM

SLIDING OUTER TOOL ENCLOSURE

APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME

REDISTRIBUTION LAYER METALLIC LAYOUT STRUCTURE AND METHOD WITH WARP...

ADAPTIVE BAKING METHOD

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

APPARATUS AND METHOD FOR SUBSTRATE HANDLING

INTEGRATED SEMICONDUCTOR DIE VESSEL PROCESSING WORKSTATIONS

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Integrated Inspection for Enhanced Hybrid Bonding Yield in Advanced...

SUBSTRATE PROCESSING APPARATUS, ESTIMATION METHOD OF SUBSTRATE PROC...

WAFER CARRIER HAVING INSPECTION WINDOW AND OPERATING METHOD THEREOF

SYSTEMS AND METHODS FOR INSPECTION STATIONS