Monitoring of warpage, curvature, damage, defects or the like

Industry

CPC
H01L21/67288

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67288Monitoring of warpage, curvature, damage, defects or the like

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wafer taping apparatus and method
- Patent number 12,368,063
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Yi Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Defect inspection apparatus and defect inspection method
- Patent number 12,366,538
- Issue date Jul 22, 2025
- HITACHI HIGH-TECH CORPORATION
- Toshifumi Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing apparatus
- Patent number 12,368,065
- Issue date Jul 22, 2025
- Samsung Electronics Co., Ltd.
- Seungbeom Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System and method for correcting non-ideal wafer topography
- Patent number 12,368,066
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Mu Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
OHT vehicle and method of controlling operation of same
- Patent number 12,362,214
- Issue date Jul 15, 2025
- Semes Co., Ltd.
- Sung Hyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection method and etching system
- Patent number 12,362,208
- Issue date Jul 15, 2025
- Tokyo Electron Limited
- Takeshi Akimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computer-readable recording medium, substrate bonding system, and s...
- Patent number 12,362,212
- Issue date Jul 15, 2025
- Tokyo Electron Limited
- Keiichi Saiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection apparatus, manufacturing method of integrated circuit, a...
- Patent number 12,347,708
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer conveyance unit and wafer conveyance method
- Patent number 12,347,718
- Issue date Jul 1, 2025
- Hamamatsu Photonics K.K.
- Akira Shimase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for measuring DIC defect shape on silicon wafer and polishin...
- Patent number 12,345,659
- Issue date Jul 1, 2025
- Shin-Etsu Handotai Co., Ltd.
- Kazuya Tomii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection and location of anomalous plasma events in fabrication ch...
- Patent number 12,340,992
- Issue date Jun 24, 2025
- Lam Research Corporation
- Yukinori Sakiyama
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and method for inspecting wafer carriers
- Patent number 12,334,373
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Kang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Abnormality detecting apparatus, semiconductor manufacturing appara...
- Patent number 12,334,374
- Issue date Jun 17, 2025
- Tokyo Electron Limited
- Yuka Nakasato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monitor wafer and method of using the same
- Patent number 12,325,054
- Issue date Jun 10, 2025
- United Microelectronics Corp.
- Chih-Chieh Tsai
- B08 - CLEANING
Information Patent Grant
Oscillating secondary stage for frame-mode overlay metrology
- Patent number 12,327,741
- Issue date Jun 10, 2025
- KLA Corporation
- Izhar Agam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflective waveplates for pupil polarization filtering
- Patent number 12,322,620
- Issue date Jun 3, 2025
- KLA Corporation
- Chong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Displacement measurements in semiconductor wafer processing
- Patent number 12,322,662
- Issue date Jun 3, 2025
- Applied Materials, Inc.
- Justin Wong
- B24 - GRINDING POLISHING
Information Patent Grant
Inspection system, lithographic apparatus, and inspection method
- Patent number 12,313,980
- Issue date May 27, 2025
- ASML Netherlands B.V.
- Alexey Olegovich Polyakov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for defects detection and classification using...
- Patent number 12,307,668
- Issue date May 20, 2025
- Bruker Nano, Inc.
- David Lewis Adler
- G01 - MEASURING TESTING
Information Patent Grant
Substrate processing system
- Patent number 12,300,524
- Issue date May 13, 2025
- Tokyo Electron Limited
- Yoshifumi Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for analyzing defects in CVD films
- Patent number 12,300,554
- Issue date May 13, 2025
- Applied Materials, Inc.
- Mandar B. Pandit
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Single wafer-type wafer cleaning device and method for controlling...
- Patent number 12,288,699
- Issue date Apr 29, 2025
- SK SILTRON CO., LTD.
- Gun Ho Lee
- B08 - CLEANING
Information Patent Grant
Stage system, lithographic apparatus, method for positioning and de...
- Patent number 12,287,586
- Issue date Apr 29, 2025
- ASML Netherlands B.V.
- Stef Marten Johan Janssens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FIB-SEM 3D tomography for measuring shape deviations of HAR structures
- Patent number 12,288,705
- Issue date Apr 29, 2025
- Carl Zeiss SMT GmbH
- Amir Avishai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Parameterizing x-ray scattering measurement using slice-and-image t...
- Patent number 12,288,706
- Issue date Apr 29, 2025
- Carl Zeiss SMT GmbH
- Hans Michael Stiepan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Contact area size determination between 3D structures in an integra...
- Patent number 12,283,504
- Issue date Apr 22, 2025
- Carl Zeiss SMT GmbH
- Alex Buxbaum
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Backside deposition tuning of stress to control wafer bow in semico...
- Patent number 12,276,922
- Issue date Apr 15, 2025
- Tokyo Electron Limited
- Daniel Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a cleaved semiconductor wafer
- Patent number 12,270,768
- Issue date Apr 8, 2025
- GlobalWafers Co., Ltd.
- Benjamin Michael Meyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrate handling device for a wafer
- Patent number 12,261,075
- Issue date Mar 25, 2025
- SEMSYSCO GMBH
- Andreas Gleissner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Splash resistant laser wafer singulation by crack length control
- Patent number 12,255,097
- Issue date Mar 18, 2025
- Texas Instruments Incorporated
- Yang Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Machine Learning Based Semiconductor Measurement Models Trained Usi...
- Publication number 20250238690
- Publication date Jul 24, 2025
- KLA Corporation
- Zhengquan Tan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONTACT AREA SIZE DETERMINATION BETWEEN 3D STRUCTURES IN AN INTEGRA...
- Publication number 20250239474
- Publication date Jul 24, 2025
- Carl Zeiss SMT GMBH
- Alex Buxbaum
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMAGE SENSOR WITH OXIDE FREE WAFER BONDED STRUCTURES AND METHODS FO...
- Publication number 20250231114
- Publication date Jul 17, 2025
- KLA Corporation
- Yajun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE LIFT ASSEMBLY, SYSTEM INCLUDING THE ASSEMBLY, AND METHODS...
- Publication number 20250233007
- Publication date Jul 17, 2025
- ASM IP HOLDING B.V.
- Tilakraj Durgadahalli Shankaregowda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of Semiconductor Fabrication
- Publication number 20250226250
- Publication date Jul 10, 2025
- Nanoverse Technologies Inc.
- Jeffrey Albelo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR DETERMINING CONTRIBUTION OF FACTOR DURING...
- Publication number 20250226251
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Young Hwan JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU, PRE-IMPLANT WAFER CHARACTERIZATION SYSTEM AND METHOD
- Publication number 20250226266
- Publication date Jul 10, 2025
- Axcelis Technologies, Inc.
- Scott Edwin Galica
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC DETERMINATION OF A SAMPLE INSPECTION RECIPE OF CHARGED PART...
- Publication number 20250226175
- Publication date Jul 10, 2025
- ASML NETHERLANDS B.V.
- Zhong-wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF OPERATION THEREOF
- Publication number 20250218826
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Jonghyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT PROCESSING APPARATUS
- Publication number 20250218830
- Publication date Jul 3, 2025
- PlayNitride Display Co., Ltd.
- Yen-Mu Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONSTRUCTING A SUBSTRATE TOPOLOGY MAP BASED ON MEASURED PROPERTIES
- Publication number 20250218831
- Publication date Jul 3, 2025
- Applied Materials, Inc.
- Saitanay Naribole
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
SEMICONDUCTOR DEVICE INSPECTION DEVICE AND SEMICONDUCTOR DEVICE INS...
- Publication number 20250210387
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Soon Kyu HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE ABNORMALITY DETECTION METHOD
- Publication number 20250201606
- Publication date Jun 19, 2025
- TOKYO ELECTRON LIMITED
- Ryu NAGAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20250201635
- Publication date Jun 19, 2025
- EBARA CORPORATION
- Issei SUGANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY AND METHOD FOR PREVENTING WARPAGE IN A SEMICONDUCTOR PACKAGE
- Publication number 20250201605
- Publication date Jun 19, 2025
- Intel Corporation
- Sonja Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE SYSTEM, METHOD FOR WAFER TEST MANAGEMENT SYSTEM IN A PROBE SY...
- Publication number 20250191946
- Publication date Jun 12, 2025
- MPI CORPORATION
- Stojan KANEV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM, METHOD, AND USER INTERFACE FOR EDGE RING WEAR COMPENSATION
- Publication number 20250191962
- Publication date Jun 12, 2025
- LAM RESEARCH CORPORATION
- Tom A. KAMP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR FOREIGN MATERIAL ADHESION INSPECTION, FOREIGN MATERIA...
- Publication number 20250191979
- Publication date Jun 12, 2025
- Mitsubishi Electric Corporation
- Kimiharu KUROKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR SUBSTRATE AND INTEGRATED SENSING SURFACES
- Publication number 20250183074
- Publication date Jun 5, 2025
- Applied Materials, Inc.
- Chuang-Chia Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE MONITORING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250183075
- Publication date Jun 5, 2025
- TES CO., LTD.
- Hong-Jun SHON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTING DAMAGED SEMICONDUCTOR WAFERS UTILIZING A SEMICONDUCTOR WA...
- Publication number 20250183073
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen Min LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
In-Situ In-Band and Out-of-Band Spectral Measurement for EUV Tools
- Publication number 20250164895
- Publication date May 22, 2025
- KLA Corporation
- Rajeev Rajendran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR DETERMINING WAFER BOW
- Publication number 20250167023
- Publication date May 22, 2025
- TOKYO ELECTRON LIMITED
- Daniel FULFORD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SUPPORT FOR MEASURING WAFER GEOMETRY
- Publication number 20250167024
- Publication date May 22, 2025
- TOKYO ELECTRON LIMITED
- Daniel FULFORD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR REDUCING WAFER BACKSIDE DAMAGE
- Publication number 20250167025
- Publication date May 22, 2025
- LAM RESEARCH CORPORATION
- Sairam Sundaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FinFET Device and Method of Forming and Monitoring Quality of the Same
- Publication number 20250169101
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Yin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND SU...
- Publication number 20250157836
- Publication date May 15, 2025
- SCREEN Holdings Co., Ltd.
- Shinji SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS OF OPTICAL INSPECTION OF ELECTRONIC DEVICE MANU...
- Publication number 20250155234
- Publication date May 15, 2025
- Applied Materials, Inc.
- Mohsin Waqar
- G01 - MEASURING TESTING
Information Patent Application
ELECTROPLATING CHAMBER LEAKAGE PLATING WARNING METHOD AND SYSTEM
- Publication number 20250157019
- Publication date May 15, 2025
- ACM RESEARCH (SHANGHAI), INC.
- Meng Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20250149355
- Publication date May 8, 2025
- TOKYO ELECTRON LIMITED
- Susumu HAYAKAWA
- H01 - BASIC ELECTRIC ELEMENTS

Monitoring of warpage, curvature, damage, defects or the like

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wafer taping apparatus and method

Defect inspection apparatus and defect inspection method

Wafer processing apparatus

System and method for correcting non-ideal wafer topography

OHT vehicle and method of controlling operation of same

Inspection method and etching system

Computer-readable recording medium, substrate bonding system, and s...

Inspection apparatus, manufacturing method of integrated circuit, a...

Wafer conveyance unit and wafer conveyance method

Method for measuring DIC defect shape on silicon wafer and polishin...

Detection and location of anomalous plasma events in fabrication ch...

Apparatus and method for inspecting wafer carriers

Abnormality detecting apparatus, semiconductor manufacturing appara...

Monitor wafer and method of using the same

Oscillating secondary stage for frame-mode overlay metrology

Reflective waveplates for pupil polarization filtering

Displacement measurements in semiconductor wafer processing

Inspection system, lithographic apparatus, and inspection method

Methods and systems for defects detection and classification using...

Substrate processing system

Systems and methods for analyzing defects in CVD films

Single wafer-type wafer cleaning device and method for controlling...

Stage system, lithographic apparatus, method for positioning and de...

FIB-SEM 3D tomography for measuring shape deviations of HAR structures

Parameterizing x-ray scattering measurement using slice-and-image t...

Contact area size determination between 3D structures in an integra...

Backside deposition tuning of stress to control wafer bow in semico...

Method of processing a cleaved semiconductor wafer

Substrate handling device for a wafer

Splash resistant laser wafer singulation by crack length control

Patents Applicationslast 30 patents

Machine Learning Based Semiconductor Measurement Models Trained Usi...

CONTACT AREA SIZE DETERMINATION BETWEEN 3D STRUCTURES IN AN INTEGRA...

IMAGE SENSOR WITH OXIDE FREE WAFER BONDED STRUCTURES AND METHODS FO...

SUBSTRATE LIFT ASSEMBLY, SYSTEM INCLUDING THE ASSEMBLY, AND METHODS...

Method of Semiconductor Fabrication

METHOD AND APPARATUS FOR DETERMINING CONTRIBUTION OF FACTOR DURING...

IN-SITU, PRE-IMPLANT WAFER CHARACTERIZATION SYSTEM AND METHOD

DYNAMIC DETERMINATION OF A SAMPLE INSPECTION RECIPE OF CHARGED PART...

ELECTRONIC DEVICE AND METHOD OF OPERATION THEREOF

COMPONENT PROCESSING APPARATUS

CONSTRUCTING A SUBSTRATE TOPOLOGY MAP BASED ON MEASURED PROPERTIES

SEMICONDUCTOR DEVICE INSPECTION DEVICE AND SEMICONDUCTOR DEVICE INS...

SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE ABNORMALITY DETECTION METHOD

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

ASSEMBLY AND METHOD FOR PREVENTING WARPAGE IN A SEMICONDUCTOR PACKAGE

PROBE SYSTEM, METHOD FOR WAFER TEST MANAGEMENT SYSTEM IN A PROBE SY...

SYSTEM, METHOD, AND USER INTERFACE FOR EDGE RING WEAR COMPENSATION

SUBSTRATE FOR FOREIGN MATERIAL ADHESION INSPECTION, FOREIGN MATERIA...

SENSOR SUBSTRATE AND INTEGRATED SENSING SURFACES

SUBSTRATE MONITORING METHOD AND SUBSTRATE PROCESSING APPARATUS

DETECTING DAMAGED SEMICONDUCTOR WAFERS UTILIZING A SEMICONDUCTOR WA...

In-Situ In-Band and Out-of-Band Spectral Measurement for EUV Tools

DEVICE AND METHOD FOR DETERMINING WAFER BOW

WAFER SUPPORT FOR MEASURING WAFER GEOMETRY

APPARATUS AND METHODS FOR REDUCING WAFER BACKSIDE DAMAGE

FinFET Device and Method of Forming and Monitoring Quality of the Same

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND SU...

METHODS AND SYSTEMS OF OPTICAL INSPECTION OF ELECTRONIC DEVICE MANU...

ELECTROPLATING CHAMBER LEAKAGE PLATING WARNING METHOD AND SYSTEM

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD