Monitoring of warpage, curvature, damage, defects or the like

Industry

CPC
H01L21/67288

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67288Monitoring of warpage, curvature, damage, defects or the like

Industries

Patents Grantslast 30 patents

Information Patent Grant
Process for producing semiconductor wafers
- Patent number 11,972,986
- Issue date Apr 30, 2024
- Siltronic AG
- Michael Boy
- C30 - CRYSTAL GROWTH
Information Patent Grant
Imaging ellipsometry (IE)-based inspection method and method of fab...
- Patent number 11,972,960
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Myungjun Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of analyzing semiconductor structure
- Patent number 11,959,958
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yi Min Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automated inspection tool
- Patent number 11,961,770
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Han Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device and method for bonding of substrates
- Patent number 11,955,339
- Issue date Apr 9, 2024
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for coating a substrate with magnesium fluoride via atomic...
- Patent number 11,952,659
- Issue date Apr 9, 2024
- Corning Incorporated
- Ming-Huang Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of evaluating silicon wafer, method of evaluating silicon wa...
- Patent number 11,948,819
- Issue date Apr 2, 2024
- Sumco Corporation
- Keiichiro Mori
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for inspecting wafer carriers
- Patent number 11,929,271
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Kang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging apparatus and method of manufacturing semic...
- Patent number 11,923,214
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Junghyun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus
- Patent number 11,923,220
- Issue date Mar 5, 2024
- Tokyo Electron Limited
- Naoyuki Okamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate table with vacuum channels grid
- Patent number 11,923,231
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Cheng Wu
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Apparatuses and methods for determining wafer defects
- Patent number 11,922,613
- Issue date Mar 5, 2024
- Micron Technology, Inc.
- Yutao Gong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cleaved semiconductor wafer camera system
- Patent number 11,921,054
- Issue date Mar 5, 2024
- GlobalWafers Co., Ltd.
- Benjamin Michael Meyer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Workpiece inspection apparatus
- Patent number 11,915,955
- Issue date Feb 27, 2024
- TAKAOKA TOKO CO., LTD.
- Mitsuhiro Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarization process, planarization system and method of manufactu...
- Patent number 11,908,711
- Issue date Feb 20, 2024
- Canon Kabushiki Kaisha
- Steven C. Shackleton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer method and transfer system for transferring substrate betw...
- Patent number 11,908,717
- Issue date Feb 20, 2024
- Tokyo Electron Limited
- Masakazu Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rework for metal interconnects using etch and thermal anneal
- Patent number 11,901,224
- Issue date Feb 13, 2024
- International Business Machines Corporation
- Prasad Bhosale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing substrate
- Patent number 11,894,219
- Issue date Feb 6, 2024
- Semes Co., Ltd.
- Je Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for recognizing and addressing plasma discharge d...
- Patent number 11,894,250
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Yu Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Over the air (OTA) chip testing system
- Patent number 11,879,925
- Issue date Jan 23, 2024
- Johnstech International Corporation
- Mike Andres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and non-transitory com...
- Patent number 11,869,785
- Issue date Jan 9, 2024
- Kokusai Electric Corporation
- Tomoyuki Miyada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Stage system, lithographic apparatus, method for positioning and de...
- Patent number 11,860,552
- Issue date Jan 2, 2024
- ASML Netherlands B.V.
- Stef Marten Johan Janssens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing system and substrate processing method
- Patent number 11,854,840
- Issue date Dec 26, 2023
- Tokyo Electron Limited
- Yuji Takimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer stress control using backside film deposition and laser anneal
- Patent number 11,842,911
- Issue date Dec 12, 2023
- Yangtze Memory Technologies Co., Ltd.
- Pengan Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for adaptive alignment
- Patent number 11,842,420
- Issue date Dec 12, 2023
- ASML Netherlands B.V.
- Wei Fang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked substrate manufacturing method, stacked substrate manufactu...
- Patent number 11,842,905
- Issue date Dec 12, 2023
- Nikon Corporation
- Isao Sugaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detecting outliers at a manufacturing system using machine learning
- Patent number 11,842,910
- Issue date Dec 12, 2023
- Applied Materials, Inc.
- Bharath Ram Sundar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Back-side wafer modification
- Patent number 11,830,778
- Issue date Nov 28, 2023
- International Business Machines Corporation
- David Wolpert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for determining post bonding overlay
- Patent number 11,829,077
- Issue date Nov 28, 2023
- KLA Corporation
- Franz Zach
- G01 - MEASURING TESTING
Information Patent Grant
Wafer inspection apparatus and system including the same
- Patent number 11,823,927
- Issue date Nov 21, 2023
- Samsung Electronics Co., Ltd.
- Kyunghun Han
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
PLANARIZATION PROCESS, PLANARIZATION SYSTEM AND METHOD OF MANUFACTU...
- Publication number 20240145269
- Publication date May 2, 2024
- Canon Kabushiki Kaisha
- STEVEN C. SHACKLETON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20240145277
- Publication date May 2, 2024
- EBARA CORPORATION
- Yosuke NAGASAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ANALYZING LAYOUT PATTERN DENSITY
- Publication number 20240145280
- Publication date May 2, 2024
- SHANGHAI HUALI MICROELECTRONICS CORPORATION
- Wei CHENG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE INSPECTION SYSTEM AND METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240145315
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- EUNHEE JEANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOAD PORT MODULE AND DRIVING METHOD THEREOF
- Publication number 20240128104
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Sang Lyong Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD USING T...
- Publication number 20240112933
- Publication date Apr 4, 2024
- Samsung Electronics Co., Ltd.
- Jeonghee Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYNCHRONOUS SUBSTRATE TRANSPORT AND ELECTRICAL PROBING
- Publication number 20240112935
- Publication date Apr 4, 2024
- Photon Dynamics, Inc.
- Neil Dang Nguyen
- G01 - MEASURING TESTING
Information Patent Application
SUBSTRATE TEST APPARATUS AND METHOD
- Publication number 20240110879
- Publication date Apr 4, 2024
- SEMES CO., LTD.
- Gyunam PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEFECT INSPECTION DEVICE
- Publication number 20240096667
- Publication date Mar 21, 2024
- Hitachi High-Tech Corporation
- Hiromichi YAMAKAWA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM AND METHOD FOR DETERMINING POST BONDING OVERLAY
- Publication number 20240094642
- Publication date Mar 21, 2024
- KLA Corporation
- Franz Zach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Semiconductor Device and Non-transitory Com...
- Publication number 20240087929
- Publication date Mar 14, 2024
- Kokusai Electric Corporation
- Tomoyuki MIYADA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PIXELATED CHUCK FOR RETAINING WARPED SEMICONDUCTOR WAFERS
- Publication number 20240087939
- Publication date Mar 14, 2024
- International Business Machines Corporation
- VINAY PAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR THERMALLY CONDITIONING A WAFER IN A CHARGED...
- Publication number 20240079202
- Publication date Mar 7, 2024
- ASML NETHERLANDS B.V.
- Martijn Petrus, Christianus VAN HEUMEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20240079255
- Publication date Mar 7, 2024
- United Semiconductor (Xiamen) Co., Ltd.
- Ji He Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORTING APPARATUS
- Publication number 20240079264
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Jonggu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INSPECTION APPARATUS AND SEMICONDUCTOR MANUFACTURING...
- Publication number 20240071795
- Publication date Feb 29, 2024
- Mitsubishi Electric Corporation
- Motoki IINUMA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM AND METHOD FOR MITIGATING OVERLAY DISTORTION PATTERNS CAUSED...
- Publication number 20240053721
- Publication date Feb 15, 2024
- KLA Corporation
- Franz Zach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTING DEFECTS ON SPECIMENS
- Publication number 20240054632
- Publication date Feb 15, 2024
- KLA Corporation
- Li Yu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONTROL OF WAFER BOW IN MULTIPLE STATIONS
- Publication number 20240055285
- Publication date Feb 15, 2024
- LAM RESEARCH CORPORATION
- Edward Augustyniak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM CHUCK
- Publication number 20240038571
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yo SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MITIGATING WARPAGE ON STACKED WAFERS
- Publication number 20240038556
- Publication date Feb 1, 2024
- Xilinx, Inc.
- Myongseob KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METROLOGY SAMPLING PLANS FOR ONLY OUT OF SPECIFICATION DETECTION
- Publication number 20240038558
- Publication date Feb 1, 2024
- KLA Corporation
- Fatima Anis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
- Publication number 20240038557
- Publication date Feb 1, 2024
- Yaoying ZHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR GLASS SUBSTRATE AND GLASS SUBSTRATE
- Publication number 20240030051
- Publication date Jan 25, 2024
- AGC Inc.
- Yuha KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD
- Publication number 20240030057
- Publication date Jan 25, 2024
- SEMES CO., LTD.
- Youngjun SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
- Publication number 20240030021
- Publication date Jan 25, 2024
- TOKYO ELECTRON LIMITED
- Yohei YAMASHITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER CLEANING APPARATUS AND METHOD
- Publication number 20240021446
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jieh-Chau HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SUBSTRATE MANUFACTURING METHOD, STACKED SUBSTRATE MANUFACTU...
- Publication number 20240021447
- Publication date Jan 18, 2024
- Nikon Corporation
- Isao SUGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE FOR INSPECTION
- Publication number 20240014081
- Publication date Jan 11, 2024
- ROHM CO., LTD.
- Toshiro TAKAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR INSPECTION OF AN INNER POD OR AN OUTER POD OF...
- Publication number 20240006210
- Publication date Jan 4, 2024
- BROOKS AUTOMATION (GERMANY) GMBH
- Lutz REBSTOCK
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Monitoring of warpage, curvature, damage, defects or the like

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Process for producing semiconductor wafers

Imaging ellipsometry (IE)-based inspection method and method of fab...

Method of analyzing semiconductor structure

Automated inspection tool

Device and method for bonding of substrates

Methods for coating a substrate with magnesium fluoride via atomic...

Method of evaluating silicon wafer, method of evaluating silicon wa...

Apparatus and method for inspecting wafer carriers

Semiconductor packaging apparatus and method of manufacturing semic...

Substrate processing apparatus

Substrate table with vacuum channels grid

Apparatuses and methods for determining wafer defects

Cleaved semiconductor wafer camera system

Workpiece inspection apparatus

Planarization process, planarization system and method of manufactu...

Transfer method and transfer system for transferring substrate betw...

Rework for metal interconnects using etch and thermal anneal

Method for processing substrate

Method and system for recognizing and addressing plasma discharge d...

Over the air (OTA) chip testing system

Method of manufacturing semiconductor device and non-transitory com...

Stage system, lithographic apparatus, method for positioning and de...

Substrate processing system and substrate processing method

Wafer stress control using backside film deposition and laser anneal

Method and apparatus for adaptive alignment

Stacked substrate manufacturing method, stacked substrate manufactu...

Detecting outliers at a manufacturing system using machine learning

Back-side wafer modification

System and method for determining post bonding overlay

Wafer inspection apparatus and system including the same

Patents Applicationslast 30 patents

PLANARIZATION PROCESS, PLANARIZATION SYSTEM AND METHOD OF MANUFACTU...

SEMICONDUCTOR MANUFACTURING APPARATUS

METHOD FOR ANALYZING LAYOUT PATTERN DENSITY

SUBSTRATE INSPECTION SYSTEM AND METHOD OF MANUFACTURING SEMICONDUCT...

LOAD PORT MODULE AND DRIVING METHOD THEREOF

SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD USING T...

SYNCHRONOUS SUBSTRATE TRANSPORT AND ELECTRICAL PROBING

SUBSTRATE TEST APPARATUS AND METHOD

DEFECT INSPECTION DEVICE

SYSTEM AND METHOD FOR DETERMINING POST BONDING OVERLAY

Method of Manufacturing Semiconductor Device and Non-transitory Com...

PIXELATED CHUCK FOR RETAINING WARPED SEMICONDUCTOR WAFERS

SYSTEMS AND METHODS FOR THERMALLY CONDITIONING A WAFER IN A CHARGED...

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

SUBSTRATE SUPPORTING APPARATUS

SEMICONDUCTOR INSPECTION APPARATUS AND SEMICONDUCTOR MANUFACTURING...

SYSTEM AND METHOD FOR MITIGATING OVERLAY DISTORTION PATTERNS CAUSED...

DETECTING DEFECTS ON SPECIMENS

CONTROL OF WAFER BOW IN MULTIPLE STATIONS

VACUUM CHUCK

METHOD FOR MITIGATING WARPAGE ON STACKED WAFERS

METROLOGY SAMPLING PLANS FOR ONLY OUT OF SPECIFICATION DETECTION

METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE

MANUFACTURING METHOD FOR GLASS SUBSTRATE AND GLASS SUBSTRATE

SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD

LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD

WAFER CLEANING APPARATUS AND METHOD

STACKED SUBSTRATE MANUFACTURING METHOD, STACKED SUBSTRATE MANUFACTU...

SEMICONDUCTOR STRUCTURE FOR INSPECTION

METHOD AND SYSTEM FOR INSPECTION OF AN INNER POD OR AN OUTER POD OF...