Monolithic Microwave Integrated Circuit [MMIC]

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H01L2924/1423

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1423Monolithic Microwave Integrated Circuit [MMIC]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Spatial power-combining devices with reduced size
- Patent number 12,143,074
- Issue date Nov 12, 2024
- Qorvo US, Inc.
- Soack Dae Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gallium nitride integrated circuits including non-gold-based metall...
- Patent number 12,087,713
- Issue date Sep 10, 2024
- Analog Devices, Inc.
- Daniel Piedra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency transmission line with finish plating on conductive...
- Patent number 11,984,423
- Issue date May 14, 2024
- Skyworks Solutions, Inc.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging an integrated circuit (IC) package with embedd...
- Patent number 11,929,300
- Issue date Mar 12, 2024
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices incorporating stacked bonds and methods of forming the same
- Patent number 11,908,823
- Issue date Feb 20, 2024
- Wolfspeed, Inc.
- Erwin Orejola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and electronic device comprising a plurality of...
- Patent number 11,854,954
- Issue date Dec 26, 2023
- STMicroelectronics S.r.l.
- Angelo Scuderi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged transistor having die attach materials with channels and p...
- Patent number 11,830,810
- Issue date Nov 28, 2023
- Wolfspeed, Inc.
- Mitch Flowers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MMICs with backside interconnects for fanout-style packaging
- Patent number 11,791,312
- Issue date Oct 17, 2023
- Qorvo US, Inc.
- Andrew Arthur Ketterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and electronic device comprising a plurality of...
- Patent number 11,742,311
- Issue date Aug 29, 2023
- STMicroelectronics S.r.l.
- Angelo Scuderi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and amplifier assembly
- Patent number 11,736,067
- Issue date Aug 22, 2023
- Sumitomo Electric Industries, Ltd.
- Masahiro Tanomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide fan-out
- Patent number 11,728,290
- Issue date Aug 15, 2023
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated antenna on interposer substrate
- Patent number 11,715,668
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Jr Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) package with embedded heat spreader in a re...
- Patent number 11,626,340
- Issue date Apr 11, 2023
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bond electrical characterization
- Patent number 11,616,187
- Issue date Mar 28, 2023
- Northrop Grumman Systems Corporation
- Aurelius L. Graninger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate waveguide
- Patent number 11,532,574
- Issue date Dec 20, 2022
- Intel Coropration
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,532,736
- Issue date Dec 20, 2022
- Murata Manufacturing Co., Ltd.
- Yasunari Umemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an inductor
- Patent number 11,393,782
- Issue date Jul 19, 2022
- Renesas Electronics Corporation
- Yasutaka Nakashiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spatial power-combining devices with reduced size
- Patent number 11,387,791
- Issue date Jul 12, 2022
- Qorvo US, Inc.
- Soack Dae Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic microwave integrated circuit (MMIC) cooling structure
- Patent number 11,152,279
- Issue date Oct 19, 2021
- Raytheon Company
- Susan C. Trulli
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Integrated antenna on interposer substrate
- Patent number 11,075,116
- Issue date Jul 27, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Jr Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amplifier and amplification apparatus
- Patent number 11,069,634
- Issue date Jul 20, 2021
- Fujitsu Limited
- Ikuo Soga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave antenna apparatus and package
- Patent number 11,005,155
- Issue date May 11, 2021
- Sony Corporation
- Wasif Tanveer Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,978,579
- Issue date Apr 13, 2021
- Murata Manufacturing Co., Ltd.
- Yasunari Umemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna module and method of manufacturing the same
- Patent number 10,971,825
- Issue date Apr 6, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ho Kyung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bond electrical characterization
- Patent number 10,950,778
- Issue date Mar 16, 2021
- Northrop Grumman Systems Corporation
- Aurelius L. Graninger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency transmission line
- Patent number 10,937,759
- Issue date Mar 2, 2021
- Skyworks Solutions, Inc.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and amplifier assembly
- Patent number 10,862,433
- Issue date Dec 8, 2020
- Sumitomo Electric Industries, Ltd.
- Masahiro Tanomura
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Transient liquid phase material bonding and sealing structures and...
- Patent number 10,840,108
- Issue date Nov 17, 2020
- Skyworks Solutions, Inc.
- Bradley Paul Barber
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Flange mount millimeter-wave package
- Patent number 10,818,617
- Issue date Oct 27, 2020
- MACOM Technology Solutions Holdings, Inc.
- Kohei Fujii
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,811,371
- Issue date Oct 20, 2020
- Mitsubishi Electric Corporation
- Naoto Ando
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER AMPLIFICATION HIGH-FREQUENCY CIRCUIT DEVICE
- Publication number 20240213189
- Publication date Jun 27, 2024
- Mitsubishi Electric Corporation
- Yuta SUGIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED PASSIVE DEVICE
- Publication number 20240194413
- Publication date Jun 13, 2024
- Wolfspeed, Inc.
- Jeremy FISHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...
- Publication number 20240105670
- Publication date Mar 28, 2024
- CYNTEC CO., LTD.
- Chi-Hung Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED TRANSISTOR WITH CHANNELED DIE ATTACH MATERIALS AND PROCESS...
- Publication number 20240079320
- Publication date Mar 7, 2024
- Wolfspeed, Inc.
- Mitch FLOWERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLIMETER-WAVE ANTENNA ARRAY APPARATUS
- Publication number 20240047854
- Publication date Feb 8, 2024
- Teknologian Tutkimuskeskus VTT Oy
- Vladimir ERMOLOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE FOR MILLIMETRE WAVE AND THZ SIGNALS
- Publication number 20230387045
- Publication date Nov 30, 2023
- Teknologian Tutkimuskeskus VTT Oy
- Pekka Pursula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND ELECTRONIC DEVICE COMPRISING A PLURALITY OF...
- Publication number 20230335524
- Publication date Oct 19, 2023
- STMicroelectronics S.r.l.
- Angelo SCUDERI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DIAMOND SUBSTRATE FOR THERMAL MANAGEMENT
- Publication number 20230317692
- Publication date Oct 5, 2023
- Raytheon Company
- Jarrod Vaillancourt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Limiting Failures Caused by Dendrite Growth on Semiconductor Chips
- Publication number 20230215833
- Publication date Jul 6, 2023
- Wolfspeed, Inc.
- Dan Namishia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED HEAT SPREADER IN A RE...
- Publication number 20230207415
- Publication date Jun 29, 2023
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPATIAL POWER-COMBINING DEVICES WITH REDUCED SIZE
- Publication number 20220368291
- Publication date Nov 17, 2022
- Qorvo US, Inc.
- Soack Dae Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES INCORPORATING STACKED BONDS AND METHODS OF FORMING THE SAME
- Publication number 20220223559
- Publication date Jul 14, 2022
- Wolfspeed, Inc.
- Erwin Orejola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Transistor with Channeled Die Attach Materials and Process...
- Publication number 20210351121
- Publication date Nov 11, 2021
- Cree, Inc.
- Mitch Flowers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ANTENNA ON INTERPOSER SUBSTRATE
- Publication number 20210335668
- Publication date Oct 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Jr Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPATIAL POWER-COMBINING DEVICES WITH REDUCED SIZE
- Publication number 20210297048
- Publication date Sep 23, 2021
- Qorvo US, Inc.
- Soack Dae Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERCONDUCTING BUMP BOND ELECTRICAL CHARACTERIZATION
- Publication number 20210257532
- Publication date Aug 19, 2021
- Northrop Grumman Systems Corporation
- AURELIUS L. GRANINGER
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT AND ELECTRONIC DEVICE COMPRISING A PLURALITY OF...
- Publication number 20210242116
- Publication date Aug 5, 2021
- STMicroelectronics S.r.l.
- Angelo SCUDERI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND ELECTRONIC DEVICE COMPRISING A PLURALITY OF...
- Publication number 20210242157
- Publication date Aug 5, 2021
- STMicroelectronics S.r.l.
- Angelo SCUDERI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210184022
- Publication date Jun 17, 2021
- Murata Manufacturing Co., Ltd.
- Yasunari UMEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED HEAT SPREADER IN A RE...
- Publication number 20210183722
- Publication date Jun 17, 2021
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND AMPLIFIER ASSEMBLY
- Publication number 20210058039
- Publication date Feb 25, 2021
- Sumitomo Electric Industries, Ltd.
- Masahiro Tanomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAVEGUIDE FAN-OUT
- Publication number 20200303327
- Publication date Sep 24, 2020
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package Including Miniature Antenna
- Publication number 20200295462
- Publication date Sep 17, 2020
- FRACTUS, S.A.
- JORDI Soler Castany
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20200235028
- Publication date Jul 23, 2020
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Hyung Seok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERCONDUCTING BUMP BOND ELECTRICAL CHARACTERIZATION
- Publication number 20200220064
- Publication date Jul 9, 2020
- Northrop Grumman Systems Corporation
- AURELIUS L. GRANINGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MMICS WITH BACKSIDE INTERCONNECTS FOR FANOUT-STYLE PACKAGING
- Publication number 20200176416
- Publication date Jun 4, 2020
- Qorvo US, Inc.
- Andrew Arthur Ketterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMPLIFIER AND AMPLIFICATION APPARATUS
- Publication number 20200161258
- Publication date May 21, 2020
- Fujitsu Limited
- Ikuo Soga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLANGE MOUNT MILLIMETER-WAVE PACKAGE
- Publication number 20200105686
- Publication date Apr 2, 2020
- MACOM Technology Solutions Holdings, Inc.
- Kohei Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSIENT LIQUID PHASE MATERIAL BONDING AND SEALING STRUCTURES AND...
- Publication number 20200090951
- Publication date Mar 19, 2020
- SKYWORKS SOLUTIONS, INC.
- Bradley Paul Barber
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Integrated Circuit Package Including Miniature Antenna
- Publication number 20200028264
- Publication date Jan 23, 2020
- FRACTUS, S.A.
- JORDI Soler Castany
- H01 - BASIC ELECTRIC ELEMENTS

Monolithic Microwave Integrated Circuit [MMIC]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Spatial power-combining devices with reduced size

Gallium nitride integrated circuits including non-gold-based metall...

Radio frequency transmission line with finish plating on conductive...

Method for packaging an integrated circuit (IC) package with embedd...

Devices incorporating stacked bonds and methods of forming the same

Integrated circuit and electronic device comprising a plurality of...

Packaged transistor having die attach materials with channels and p...

MMICs with backside interconnects for fanout-style packaging

Integrated circuit and electronic device comprising a plurality of...

Semiconductor device and amplifier assembly

Waveguide fan-out

Integrated antenna on interposer substrate

Integrated circuit (IC) package with embedded heat spreader in a re...

Superconducting bump bond electrical characterization

Through-substrate waveguide

Semiconductor device

Semiconductor device having an inductor

Spatial power-combining devices with reduced size

Monolithic microwave integrated circuit (MMIC) cooling structure

Integrated antenna on interposer substrate

Amplifier and amplification apparatus

Microwave antenna apparatus and package

Semiconductor device

Antenna module and method of manufacturing the same

Superconducting bump bond electrical characterization

Radio frequency transmission line

Semiconductor device and amplifier assembly

Transient liquid phase material bonding and sealing structures and...

Flange mount millimeter-wave package

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

POWER AMPLIFICATION HIGH-FREQUENCY CIRCUIT DEVICE

STACKED INTEGRATED PASSIVE DEVICE

ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...

PACKAGED TRANSISTOR WITH CHANNELED DIE ATTACH MATERIALS AND PROCESS...

MILLIMETER-WAVE ANTENNA ARRAY APPARATUS

WAFER-LEVEL PACKAGE FOR MILLIMETRE WAVE AND THZ SIGNALS

INTEGRATED CIRCUIT AND ELECTRONIC DEVICE COMPRISING A PLURALITY OF...

INTEGRATED DIAMOND SUBSTRATE FOR THERMAL MANAGEMENT

Limiting Failures Caused by Dendrite Growth on Semiconductor Chips

INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED HEAT SPREADER IN A RE...

SPATIAL POWER-COMBINING DEVICES WITH REDUCED SIZE

DEVICES INCORPORATING STACKED BONDS AND METHODS OF FORMING THE SAME

Packaged Transistor with Channeled Die Attach Materials and Process...

INTEGRATED ANTENNA ON INTERPOSER SUBSTRATE

SPATIAL POWER-COMBINING DEVICES WITH REDUCED SIZE

SUPERCONDUCTING BUMP BOND ELECTRICAL CHARACTERIZATION

INTEGRATED CIRCUIT AND ELECTRONIC DEVICE COMPRISING A PLURALITY OF...

INTEGRATED CIRCUIT AND ELECTRONIC DEVICE COMPRISING A PLURALITY OF...

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED HEAT SPREADER IN A RE...

SEMICONDUCTOR DEVICE AND AMPLIFIER ASSEMBLY

WAVEGUIDE FAN-OUT

Integrated Circuit Package Including Miniature Antenna

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SUPERCONDUCTING BUMP BOND ELECTRICAL CHARACTERIZATION

MMICS WITH BACKSIDE INTERCONNECTS FOR FANOUT-STYLE PACKAGING

AMPLIFIER AND AMPLIFICATION APPARATUS

FLANGE MOUNT MILLIMETER-WAVE PACKAGE

TRANSIENT LIQUID PHASE MATERIAL BONDING AND SEALING STRUCTURES AND...

Integrated Circuit Package Including Miniature Antenna