More than 3 levels of metal

Industry

CPC
H01L2027/11888

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2027/11888More than 3 levels of metal

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for routing local interconnect structure at same level as re...
- Patent number 11,916,077
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of designing and fabricating a semiconductor device based o...
- Patent number 11,854,976
- Issue date Dec 26, 2023
- Samsung Electronics Co., Ltd.
- Sanghoon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having power rails and signal tracks arranged...
- Patent number 11,756,876
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wei-An Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor circuit with metal structure and manufacturing method
- Patent number 11,721,701
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jhon Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with stacked wirings having respective pitches...
- Patent number 11,462,475
- Issue date Oct 4, 2022
- Samsung Electronics Co., Ltd.
- Sanghoon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor circuit with metal structure and manufacturing method
- Patent number 11,282,859
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jhon Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple via structure for high performance standard cells
- Patent number 11,133,803
- Issue date Sep 28, 2021
- QUALCOMM Incorporated
- Satyanarayana Sahu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC with test structures and e-beam pads embedded within a contiguou...
- Patent number 11,081,476
- Issue date Aug 3, 2021
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Local interconnect structure
- Patent number 11,018,157
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide semiconductor device of an integrated circuit
- Patent number 10,965,289
- Issue date Mar 30, 2021
- QUALCOMM Incorporated
- Satyanarayana Sahu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor circuit with metal structure having different pitches
- Patent number 10,854,635
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jhon Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor circuit with metal structure and manufacturing method
- Patent number 10,756,114
- Issue date Aug 25, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jhon Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for flexible power staple insertion
- Patent number 10,658,294
- Issue date May 19, 2020
- GLOBALFOUNDRIES Inc.
- Juhan Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multilevel semiconductor device and structure with memory
- Patent number 10,515,981
- Issue date Dec 24, 2019
- Monolithic 3D Inc.
- Zvi Or-Bach
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Integrated circuit power distribution network
- Patent number 10,510,774
- Issue date Dec 17, 2019
- Imec VZW
- Peter Debacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple via structure for high performance standard cells
- Patent number 10,236,886
- Issue date Mar 19, 2019
- QUALCOMM Incorporated
- Satyanarayana Sahu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor chip having region including gate electrode features...
- Patent number 10,217,763
- Issue date Feb 26, 2019
- Tela Innovations, Inc.
- Scott T. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor chip having region including gate electrode features...
- Patent number 10,186,523
- Issue date Jan 22, 2019
- Tela Innovations, Inc.
- Scott T. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor chip including region having rectangular-shaped gate...
- Patent number 10,141,334
- Issue date Nov 27, 2018
- Tela Innovations, Inc.
- Scott T. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor CIP including region having rectangular-shaped gate s...
- Patent number 10,141,335
- Issue date Nov 27, 2018
- Tela Innovations, Inc.
- Scott T. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Programmable integrated circuit standard cell
- Patent number 10,002,881
- Issue date Jun 19, 2018
- International Business Machines Corporation
- Ayan Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip including region having rectangular-shaped gate...
- Patent number 9,905,576
- Issue date Feb 27, 2018
- Tela Innovations, Inc.
- Scott T. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit containing first and second DOEs of standard cel...
- Patent number 9,773,775
- Issue date Sep 26, 2017
- PDF Solutions, Inc.
- Stephen Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor chip including region having integrated circuit trans...
- Patent number 9,443,947
- Issue date Sep 13, 2016
- Tela Innovations, Inc.
- Scott T. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor chip including integrated circuit including at least...
- Patent number 9,425,273
- Issue date Aug 23, 2016
- Tela Innovations, Inc.
- Scott T. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor chip including integrated circuit including four tran...
- Patent number 9,425,272
- Issue date Aug 23, 2016
- Tela Innovations, Inc.
- Scott T. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit with offset line end spacings in linear gate ele...
- Patent number 8,823,062
- Issue date Sep 2, 2014
- Tela Innovations, Inc.
- Scott T. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Gate array architecture with multiple programmable regions
- Patent number 8,788,984
- Issue date Jul 22, 2014
- Baysand Inc.
- Jonathan C Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Gate array architecture with multiple programmable regions
- Patent number 8,533,641
- Issue date Sep 10, 2013
- Baysand Inc.
- Jonathan C Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with gate level including gate electrode condu...
- Patent number 8,436,400
- Issue date May 7, 2013
- Tela Innovations, Inc.
- Scott T. Becker
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF FORMING SAME
- Publication number 20240395821
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yu LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCAL INTERCONNECT STRUCTURE
- Publication number 20240194682
- Publication date Jun 13, 2024
- Tiawan Semiconductor Manufacturing Co., Ltd.
- Chih-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING POWER MESH
- Publication number 20230335485
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- WEI-AN LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF FORMING SAME
- Publication number 20230050555
- Publication date Feb 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yu LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Circuit with Metal Structure and Manufacturing Method
- Publication number 20220216238
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Jhon Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Circuit with Metal Structure and Manufacturing Method
- Publication number 20210043655
- Publication date Feb 11, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Jhon Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Circuit with Metal Structure and Manufacturing Method
- Publication number 20190206893
- Publication date Jul 4, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Jhon Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE VIA STRUCTURE FOR HIGH PERFORMANCE STANDARD CELLS
- Publication number 20190173473
- Publication date Jun 6, 2019
- QUALCOMM Incorporated
- Satyanarayana SAHU
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
LOCAL INTERCONNECT STRUCTURE
- Publication number 20190096909
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Having Region Including Gate Electrode Features...
- Publication number 20190019810
- Publication date Jan 17, 2019
- Tela Innovations, Inc.
- Scott T. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Chip Having Region Including Gate Electrode Features...
- Publication number 20180374872
- Publication date Dec 27, 2018
- Tela Innovations, Inc.
- Scott T. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Chip Having Region Including Gate Electrode Features...
- Publication number 20180374873
- Publication date Dec 27, 2018
- Tela Innovations, Inc.
- Scott T. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Chip Having Region Including Gate Electrode Features...
- Publication number 20180374871
- Publication date Dec 27, 2018
- Tela Innovations, Inc.
- Scott T. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
3D Semiconductor Device and Structure
- Publication number 20180269229
- Publication date Sep 20, 2018
- MonolithIC 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE VIA STRUCTURE FOR HIGH PERFORMANCE STANDARD CELLS
- Publication number 20180183439
- Publication date Jun 28, 2018
- QUALCOMM Incorporated
- Satyanarayana SAHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROGRAMMABLE INTEGRATED CIRCUIT STANDARD CELL
- Publication number 20180090514
- Publication date Mar 29, 2018
- International Business Machines Corporation
- Ayan Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip and Method for Manufacturing the Same
- Publication number 20170365620
- Publication date Dec 21, 2017
- Tela Innovations, Inc.
- Scott T. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Chip and Method for Manufacturing the Same
- Publication number 20170365621
- Publication date Dec 21, 2017
- Tela Innovations, Inc.
- Scott T. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Chip and Method for Manufacturing the Same
- Publication number 20170358600
- Publication date Dec 14, 2017
- Tela Innovations, Inc.
- Scott T. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT POWER DISTRIBUTION NETWORK
- Publication number 20170294448
- Publication date Oct 12, 2017
- IMEC vzw
- Peter Debacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Including Integrated Circuit Defined Within Dyna...
- Publication number 20170186772
- Publication date Jun 29, 2017
- Tela Innovations, Inc.
- Scott T. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Chip and Method for Manufacturing the Same
- Publication number 20170186771
- Publication date Jun 29, 2017
- Tela Innovations, Inc.
- Scott T. Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CELL STRUCTURE IN INTERGRATED CIRCUITS FOR ECO AT UPPER METAL LAYER...
- Publication number 20170069660
- Publication date Mar 9, 2017
- Samsung Electronics Co., Ltd.
- Hyun-Teck OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip and Method for Manufacturing the Same
- Publication number 20160379991
- Publication date Dec 29, 2016
- Tela Innovations, Inc.
- Scott T. Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURED INTEGRATED CIRCUIT DEVICE WITH MULTIPLE CONFIGURABLE VIA...
- Publication number 20160293541
- Publication date Oct 6, 2016
- eASIC Corporation
- Alexander ANDREEV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Including Region Having Integrated Circuit Trans...
- Publication number 20150249041
- Publication date Sep 3, 2015
- Tela Innovations, Inc.
- Scott T. Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gate array architecture with multiple programmable regions
- Publication number 20150048425
- Publication date Feb 19, 2015
- Baysand Inc.
- Jonathan C. Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gate array architecture with multiple programmable regions
- Publication number 20130334576
- Publication date Dec 19, 2013
- Baysand Inc.
- Jonathan C Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Integrated Circuit Including Gate Electrode Conductive Structures W...
- Publication number 20130207165
- Publication date Aug 15, 2013
- Scott T. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Integrated Circuit with Gate Electrode Conductive Structures Having...
- Publication number 20130200436
- Publication date Aug 8, 2013
- Scott T. Becker
- G06 - COMPUTING CALCULATING COUNTING

More than 3 levels of metal

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for routing local interconnect structure at same level as re...

Methods of designing and fabricating a semiconductor device based o...

Semiconductor devices having power rails and signal tracks arranged...

Semiconductor circuit with metal structure and manufacturing method

Semiconductor device with stacked wirings having respective pitches...

Semiconductor circuit with metal structure and manufacturing method

Multiple via structure for high performance standard cells

IC with test structures and e-beam pads embedded within a contiguou...

Local interconnect structure

Metal oxide semiconductor device of an integrated circuit

Semiconductor circuit with metal structure having different pitches

Semiconductor circuit with metal structure and manufacturing method

Structure and method for flexible power staple insertion

Multilevel semiconductor device and structure with memory

Integrated circuit power distribution network

Multiple via structure for high performance standard cells

Semiconductor chip having region including gate electrode features...

Semiconductor chip having region including gate electrode features...

Semiconductor chip including region having rectangular-shaped gate...

Semiconductor CIP including region having rectangular-shaped gate s...

Programmable integrated circuit standard cell

Semiconductor chip including region having rectangular-shaped gate...

Integrated circuit containing first and second DOEs of standard cel...

Semiconductor chip including region having integrated circuit trans...

Semiconductor chip including integrated circuit including at least...

Semiconductor chip including integrated circuit including four tran...

Integrated circuit with offset line end spacings in linear gate ele...

Gate array architecture with multiple programmable regions

Gate array architecture with multiple programmable regions

Semiconductor device with gate level including gate electrode condu...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT AND METHOD OF FORMING SAME

LOCAL INTERCONNECT STRUCTURE

SEMICONDUCTOR DEVICE INCLUDING POWER MESH

INTEGRATED CIRCUIT AND METHOD OF FORMING SAME

Semiconductor Circuit with Metal Structure and Manufacturing Method

Semiconductor Circuit with Metal Structure and Manufacturing Method

Semiconductor Circuit with Metal Structure and Manufacturing Method

MULTIPLE VIA STRUCTURE FOR HIGH PERFORMANCE STANDARD CELLS

LOCAL INTERCONNECT STRUCTURE

Semiconductor Chip Having Region Including Gate Electrode Features...

Semiconductor Chip Having Region Including Gate Electrode Features...

Semiconductor Chip Having Region Including Gate Electrode Features...

Semiconductor Chip Having Region Including Gate Electrode Features...

3D Semiconductor Device and Structure

MULTIPLE VIA STRUCTURE FOR HIGH PERFORMANCE STANDARD CELLS

PROGRAMMABLE INTEGRATED CIRCUIT STANDARD CELL

Semiconductor Chip and Method for Manufacturing the Same

Semiconductor Chip and Method for Manufacturing the Same

Semiconductor Chip and Method for Manufacturing the Same

INTEGRATED CIRCUIT POWER DISTRIBUTION NETWORK

Semiconductor Chip Including Integrated Circuit Defined Within Dyna...

Semiconductor Chip and Method for Manufacturing the Same

CELL STRUCTURE IN INTERGRATED CIRCUITS FOR ECO AT UPPER METAL LAYER...

Semiconductor Chip and Method for Manufacturing the Same

STRUCTURED INTEGRATED CIRCUIT DEVICE WITH MULTIPLE CONFIGURABLE VIA...

Semiconductor Chip Including Region Having Integrated Circuit Trans...

Gate array architecture with multiple programmable regions

Gate array architecture with multiple programmable regions

Integrated Circuit Including Gate Electrode Conductive Structures W...

Integrated Circuit with Gate Electrode Conductive Structures Having...