Morphology of the connecting portion

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CPC
H01L2224/4851

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4851Morphology of the connecting portion

Industries

Patents Grantslast 30 patents

Information Patent Grant
Coated wire
- Patent number 10,960,498
- Issue date Mar 30, 2021
- Heraeus Materials Singapore Pte., Ltd.
- Il Tae Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for improved delamination characteristics in a...
- Patent number 10,763,130
- Issue date Sep 1, 2020
- Microchip Technology Incorporated
- Taweesak Laevohan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic unit
- Patent number 10,714,461
- Issue date Jul 14, 2020
- Vishay Semiconductor GmbH
- Christoph Paul Gebauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of fabricating an electronic device
- Patent number 9,756,726
- Issue date Sep 5, 2017
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the semiconductor...
- Patent number 9,748,186
- Issue date Aug 29, 2017
- Fuji Electric Co., Ltd.
- Fumihiko Momose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alloyed 2N copper wires for bonding in microelectronics devices
- Patent number 9,589,694
- Issue date Mar 7, 2017
- Heraeus Deutschland GmbH & Co. KG
- Murali Sarangapani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-throughput deposition of a voltage-tunable dielectric material
- Patent number 9,490,314
- Issue date Nov 8, 2016
- BlackBerry Limited
- Marina Zelner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper alloy bonding wire for semiconductor
- Patent number 9,427,830
- Issue date Aug 30, 2016
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structure of bonding wire
- Patent number 9,331,049
- Issue date May 3, 2016
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Light emitting device having interstitial elements in grain boundar...
- Patent number 9,178,117
- Issue date Nov 3, 2015
- LG Innotek Co., Ltd
- Han Byul Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure of multilayer copper bonding wire
- Patent number 8,836,147
- Issue date Sep 16, 2014
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor
- Patent number 8,742,258
- Issue date Jun 3, 2014
- Nippon Steel & Sumikin Materials Co., Ltd.
- Shinichi Terashima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Bonding connection between a bonding wire and a power semiconductor...
- Patent number 8,541,892
- Issue date Sep 24, 2013
- Infineon Technologies AG
- Dirk Siepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gold wire for semiconductor element connection
- Patent number 8,415,797
- Issue date Apr 9, 2013
- Nippon Steel & Sumikin Materials Co., Ltd.
- Keiichi Kimura
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 8,389,860
- Issue date Mar 5, 2013
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 8,299,356
- Issue date Oct 30, 2012
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Thermally improved semiconductor QFN/SON package
- Patent number 8,242,614
- Issue date Aug 14, 2012
- Texas Instruments Incorporated
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,183,684
- Issue date May 22, 2012
- Semiconductor Components Industries, LLC
- Isao Nakazato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip attach configuration having improved thermal cha...
- Patent number 8,102,038
- Issue date Jan 24, 2012
- Texas Instruments Incorporated
- Kapil Heramb Sahasrabudhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire loop and method of forming the wire loop
- Patent number 8,048,720
- Issue date Nov 1, 2011
- Kulicke and Soffa Industries, Inc.
- Dodgie Reigh M. Calpito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 7,952,028
- Issue date May 31, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally improved semiconductor QFN/SON package
- Patent number 7,863,103
- Issue date Jan 4, 2011
- Texas Instruments Incorporated
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming wire loop of semiconduc...
- Patent number 7,547,626
- Issue date Jun 16, 2009
- Samsung Techwin Co., Ltd.
- Byung-kil Kwak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of molded QFN device suitable for miniaturizat...
- Patent number 7,504,716
- Issue date Mar 17, 2009
- Texas Instruments Incorporated
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip assembly with welded metal pillar of stacked met...
- Patent number 7,446,419
- Issue date Nov 4, 2008
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gold bonding wires for semiconductor devices and method of producin...
- Patent number 7,390,370
- Issue date Jun 24, 2008
- Nippon Steel Corporation
- Tomohiro Uno
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Low profile, chip-scale package and method of fabrication
- Patent number 7,309,648
- Issue date Dec 18, 2007
- Texas Instruments Incorporated
- Navinchandra Kalidas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip assembly with welded metal pillar that includes...
- Patent number 7,268,421
- Issue date Sep 11, 2007
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding for thin semiconductor package
- Patent number 7,192,861
- Issue date Mar 20, 2007
- Texas Instruments Incorporated
- Kazuaki Ano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile, chip-scale package and method of fabrication
- Patent number 7,135,781
- Issue date Nov 14, 2006
- Texas Instruments Incorporated
- Navinchandra Kalidas
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Systems And Methods For Improved Delamination Characteristics In A...
- Publication number 20180308713
- Publication date Oct 25, 2018
- MICROCHIP TECHNOLOGY INCORPORATED
- Taweesak Laevohan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20140110743
- Publication date Apr 24, 2014
- Han Byul KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDS AND LIGHT EMITTER DEVICES AND RELATED METHODS
- Publication number 20140070235
- Publication date Mar 13, 2014
- Peter Scott Andrews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR
- Publication number 20130306352
- Publication date Nov 21, 2013
- NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
- Shinichi Terashima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COMPOSITE WIRE OF SILVER-GOLD-PALLADIUM ALLOY COATED WITH METAL TH...
- Publication number 20130233594
- Publication date Sep 12, 2013
- WIRE TECHNOLOGY CO., LTD.
- Jun-Der LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE WIRE OF SILVER-PALLADIUM ALLOY COATED WITH METALLIC THIN...
- Publication number 20130233593
- Publication date Sep 12, 2013
- WIRE TECHNOLOGY CO., LTD.
- Jun-Der LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE OF MULTILAYER COPPER BONDING WIRE
- Publication number 20130180757
- Publication date Jul 18, 2013
- Nippon Micrometal Corporation
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
3N COPPER WIRES WITH TRACE ADDITIONS FOR BONDING IN MICROELECTRONIC...
- Publication number 20130142568
- Publication date Jun 6, 2013
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Murali SARANGAPANI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Secondary Alloyed 1N Copper Wires for Bonding in Microelectronics D...
- Publication number 20130140068
- Publication date Jun 6, 2013
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Murali SARANGAPANI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
DOPED 4N COPPER WIRES FOR BONDING IN MICROELECTRONICS DEVICES
- Publication number 20130142567
- Publication date Jun 6, 2013
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Murali SARANGAPANI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Alloyed 2N Copper Wires for Bonding in Microelectronics Devices
- Publication number 20130140084
- Publication date Jun 6, 2013
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Murali SARANGAPANI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR
- Publication number 20120118610
- Publication date May 17, 2012
- NIPPON MICROMETAL CORPORATION
- Shinichi Terashima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR
- Publication number 20120094121
- Publication date Apr 19, 2012
- NIPPON MICROMETAL CORPORATION
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Chip Attach Configuration Having Improved Thermal Cha...
- Publication number 20120094441
- Publication date Apr 19, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Kapil Heramb SAHASRABUDHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Connection Between a Bonding Wire and a Power Semiconductor...
- Publication number 20110121458
- Publication date May 26, 2011
- INFINEON TECHNOLOGIES AG
- Dirk Siepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE OF BONDING WIRE
- Publication number 20110104510
- Publication date May 5, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally Improved Semiconductor QFN/SON Package
- Publication number 20110068443
- Publication date Mar 24, 2011
- TEXAS INSTRUMENTS INCORPORATED
- DONALD C. ABBOTT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Attach Configuration Having Improved Thermal Cha...
- Publication number 20110068446
- Publication date Mar 24, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Kapil Heramb SAHASRABUDHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20110011619
- Publication date Jan 20, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20100294532
- Publication date Nov 25, 2010
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20100282495
- Publication date Nov 11, 2010
- NIPPON STEEL MATERIALS CO., LTD
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE LOOP AND METHOD OF FORMING THE WIRE LOOP
- Publication number 20100230809
- Publication date Sep 16, 2010
- KULICKE AND SOFFA INDUSTRIES, INC.
- Dodgie Reigh M. Calpito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY IMPROVED SEMICONDUCTOR QFN/SON PACKAGE
- Publication number 20100096734
- Publication date Apr 22, 2010
- TEXAS INSTRUMENTS INCORPORATED
- DONALD C. ABBOTT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100090330
- Publication date Apr 15, 2010
- SANYO ELECTRIC CO., LTD.
- Isao Nakazato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GOLD WIRE FOR SEMICONDUCTOR ELEMENT CONNECTION
- Publication number 20090115059
- Publication date May 7, 2009
- Nippon Steel Materials Co., Ltd
- Keiichi Kimura
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Bonding Tool With Improved Finish
- Publication number 20080314963
- Publication date Dec 25, 2008
- KULICKE AND SOFFA INDUSTRIES, INC.
- Harel Itzhaky
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package and method of forming wire loop of semiconduc...
- Publication number 20080099895
- Publication date May 1, 2008
- Samsung Techwin Co., Ltd.
- Byung-kil Kwak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20070187823
- Publication date Aug 16, 2007
- Naotaka Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method of molded QFN device suitable for miniaturizat...
- Publication number 20070090524
- Publication date Apr 26, 2007
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Profile, Chip-Scale Package and Method of Fabrication
- Publication number 20070020808
- Publication date Jan 25, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Navinchandra Kalidas
- H01 - BASIC ELECTRIC ELEMENTS

Morphology of the connecting portion

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Coated wire

Systems and methods for improved delamination characteristics in a...

Electronic unit

Electronic device and method of fabricating an electronic device

Semiconductor device and method for manufacturing the semiconductor...

Alloyed 2N copper wires for bonding in microelectronics devices

High-throughput deposition of a voltage-tunable dielectric material

Copper alloy bonding wire for semiconductor

Bonding structure of bonding wire

Light emitting device having interstitial elements in grain boundar...

Bonding structure of multilayer copper bonding wire

Bonding wire for semiconductor

Bonding connection between a bonding wire and a power semiconductor...

Gold wire for semiconductor element connection

Bonding wire for semiconductor devices

Bonding wire for semiconductor devices

Thermally improved semiconductor QFN/SON package

Semiconductor device and method of manufacturing the same

Semiconductor chip attach configuration having improved thermal cha...

Wire loop and method of forming the wire loop

Bonding wire for semiconductor device

Thermally improved semiconductor QFN/SON package

Semiconductor package and method of forming wire loop of semiconduc...

Structure and method of molded QFN device suitable for miniaturizat...

Semiconductor chip assembly with welded metal pillar of stacked met...

Gold bonding wires for semiconductor devices and method of producin...

Low profile, chip-scale package and method of fabrication

Semiconductor chip assembly with welded metal pillar that includes...

Wire bonding for thin semiconductor package

Low profile, chip-scale package and method of fabrication

Patents Applicationslast 30 patents

Systems And Methods For Improved Delamination Characteristics In A...

LIGHT EMITTING DEVICE

WIRE BONDS AND LIGHT EMITTER DEVICES AND RELATED METHODS

BONDING WIRE FOR SEMICONDUCTOR

COMPOSITE WIRE OF SILVER-GOLD-PALLADIUM ALLOY COATED WITH METAL TH...

COMPOSITE WIRE OF SILVER-PALLADIUM ALLOY COATED WITH METALLIC THIN...

BONDING STRUCTURE OF MULTILAYER COPPER BONDING WIRE

3N COPPER WIRES WITH TRACE ADDITIONS FOR BONDING IN MICROELECTRONIC...

Secondary Alloyed 1N Copper Wires for Bonding in Microelectronics D...

DOPED 4N COPPER WIRES FOR BONDING IN MICROELECTRONICS DEVICES

Alloyed 2N Copper Wires for Bonding in Microelectronics Devices

BONDING WIRE FOR SEMICONDUCTOR

COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR

Semiconductor Chip Attach Configuration Having Improved Thermal Cha...

Bonding Connection Between a Bonding Wire and a Power Semiconductor...

BONDING STRUCTURE OF BONDING WIRE

Thermally Improved Semiconductor QFN/SON Package

Semiconductor Chip Attach Configuration Having Improved Thermal Cha...

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICE

WIRE LOOP AND METHOD OF FORMING THE WIRE LOOP

THERMALLY IMPROVED SEMICONDUCTOR QFN/SON PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

GOLD WIRE FOR SEMICONDUCTOR ELEMENT CONNECTION

Bonding Tool With Improved Finish

Semiconductor package and method of forming wire loop of semiconduc...

Semiconductor device

Structure and method of molded QFN device suitable for miniaturizat...

Low Profile, Chip-Scale Package and Method of Fabrication